JPS63105357U - - Google Patents
Info
- Publication number
- JPS63105357U JPS63105357U JP20195586U JP20195586U JPS63105357U JP S63105357 U JPS63105357 U JP S63105357U JP 20195586 U JP20195586 U JP 20195586U JP 20195586 U JP20195586 U JP 20195586U JP S63105357 U JPS63105357 U JP S63105357U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- lead frame
- sealed
- portions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000008188 pellet Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａ，ｂ，ｃ，ｄは夫々、本考案の一実施
例を示す上面図（透影図）、正面図、側面図、外
部導出リードの拡大図、第２図ａ，ｂ，ｃは、夫
々従来例の上面図（透影図）、正面図、側面図で
ある。
１〜１２……外部導出リード、１３……ペレツ
ト、１４……樹脂封止型半導体装置のバツケージ
。
Figures 1 a, b, c, and d are a top view (perspective view), front view, side view, and enlarged view of an external lead, and Figures 2 a, b, and c respectively show an embodiment of the present invention. These are a top view (transparent view), a front view, and a side view of the conventional example, respectively. 1-12... External leads, 13... Pellet, 14... Bag of resin-sealed semiconductor device.
Claims (1)
外部導出リードが樹脂封止内部で複数の捩りをも
つていることを特徴とする樹脂封止型半導体装置
。 (2) 前記外部導出リード上へ捩り部間のリード
フレーム断面積が他の部分より大きいことを特徴
とする実用新案登録請求の範囲第１項記載の樹脂
封止型半導体装置。[Scope of claims for utility model registration] (1) In a resin-sealed lead frame,
A resin-sealed semiconductor device characterized in that an external lead has a plurality of twists inside the resin-seal. (2) The resin-sealed semiconductor device according to claim 1, wherein a cross-sectional area of the lead frame between the twisted portions on the external leads is larger than other portions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986201955U JPH0510367Y2 (en) | 1986-12-25 | 1986-12-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986201955U JPH0510367Y2 (en) | 1986-12-25 | 1986-12-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63105357U true JPS63105357U (en) | 1988-07-08 |
| JPH0510367Y2 JPH0510367Y2 (en) | 1993-03-15 |
Family
ID=31165892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986201955U Expired - Lifetime JPH0510367Y2 (en) | 1986-12-25 | 1986-12-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0510367Y2 (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4919353A (en) * | 1972-06-14 | 1974-02-20 | ||
| JPS5610950A (en) * | 1979-07-05 | 1981-02-03 | Nec Corp | Lead wire for semiconductor device |
| JPS5753969A (en) * | 1980-09-17 | 1982-03-31 | Hitachi Ltd | Semiconductor device |
| JPS5814544A (en) * | 1981-07-17 | 1983-01-27 | Nec Corp | Vessel for monolithic ic |
| JPS59151447U (en) * | 1983-03-29 | 1984-10-11 | 日本電気株式会社 | Glass sealed package |
-
1986
- 1986-12-25 JP JP1986201955U patent/JPH0510367Y2/ja not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4919353A (en) * | 1972-06-14 | 1974-02-20 | ||
| JPS5610950A (en) * | 1979-07-05 | 1981-02-03 | Nec Corp | Lead wire for semiconductor device |
| JPS5753969A (en) * | 1980-09-17 | 1982-03-31 | Hitachi Ltd | Semiconductor device |
| JPS5814544A (en) * | 1981-07-17 | 1983-01-27 | Nec Corp | Vessel for monolithic ic |
| JPS59151447U (en) * | 1983-03-29 | 1984-10-11 | 日本電気株式会社 | Glass sealed package |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0510367Y2 (en) | 1993-03-15 |