JPS6361149U - - Google Patents
Info
- Publication number
- JPS6361149U JPS6361149U JP1986155892U JP15589286U JPS6361149U JP S6361149 U JPS6361149 U JP S6361149U JP 1986155892 U JP1986155892 U JP 1986155892U JP 15589286 U JP15589286 U JP 15589286U JP S6361149 U JPS6361149 U JP S6361149U
- Authority
- JP
- Japan
- Prior art keywords
- metal piece
- piece
- external leads
- semiconductor device
- external
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims 3
- 238000007789 sealing Methods 0.000 claims 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案に係る半導体装置のチツプ封止
前の状態を示す平面図、第２図および第３図は同
じく半導体装置のチツプ封止後の状態を示す側面
図と背面図、第４図はその完成品を示す斜視図、
第５図および第６図は従来の半導体装置の樹脂封
止前の状態を示す平面図と側面図、第７図はその
完成品を示す斜視図である。
１……リードフレーム、２〜５……外部リード
、６〜９……内部電極、３１〜３５……延在部、
３６……連結片、３７……放熱片。
FIG. 1 is a plan view showing the state of the semiconductor device according to the present invention before the chip is sealed, FIGS. 2 and 3 are side and rear views showing the state of the semiconductor device after the chip is sealed, and FIG. The figure is a perspective view of the finished product.
5 and 6 are a plan view and a side view of a conventional semiconductor device before being sealed with resin, and FIG. 7 is a perspective view of the completed product. 1...Lead frame, 2-5...External lead, 6-9...Internal electrode, 31-35...Extension part,
36... Connection piece, 37... Heat radiation piece.
Claims (1)
ら外部リードに各々接続する内部電極を有する金
属片と、この金属片の裏側に半導体チツプ封止用
のパツケージを介して取り付けられた放熱片とを
備え、前記金属片の内部電極に前記外部リードと
反対側に突出する延在部を分断可能に設け、これ
ら延在部は連結片によつて接続されていることを
特徴とする半導体装置。 A metal piece having a plurality of external leads protruding to one side and internal electrodes connected to each of these external leads, and a heat dissipating piece attached to the back side of the metal piece via a package for sealing a semiconductor chip. 2. A semiconductor device, wherein the internal electrode of the metal piece is separably provided with an extending portion protruding on the side opposite to the external lead, and these extending portions are connected by a connecting piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986155892U JPS6361149U (en) | 1986-10-09 | 1986-10-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986155892U JPS6361149U (en) | 1986-10-09 | 1986-10-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6361149U true JPS6361149U (en) | 1988-04-22 |
Family
ID=31077005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986155892U Pending JPS6361149U (en) | 1986-10-09 | 1986-10-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6361149U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015029143A (en) * | 2008-08-29 | 2015-02-12 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | Resin encapsulated semiconductor device and method of manufacturing the same, and lead frame |
| US9905497B2 (en) | 2008-08-29 | 2018-02-27 | Semiconductor Components Industries, Llc | Resin sealing type semiconductor device and method of manufacturing the same, and lead frame |
-
1986
- 1986-10-09 JP JP1986155892U patent/JPS6361149U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015029143A (en) * | 2008-08-29 | 2015-02-12 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | Resin encapsulated semiconductor device and method of manufacturing the same, and lead frame |
| US9905497B2 (en) | 2008-08-29 | 2018-02-27 | Semiconductor Components Industries, Llc | Resin sealing type semiconductor device and method of manufacturing the same, and lead frame |