JPS61190146U - - Google Patents
Info
- Publication number
- JPS61190146U JPS61190146U JP7444685U JP7444685U JPS61190146U JP S61190146 U JPS61190146 U JP S61190146U JP 7444685 U JP7444685 U JP 7444685U JP 7444685 U JP7444685 U JP 7444685U JP S61190146 U JPS61190146 U JP S61190146U
- Authority
- JP
- Japan
- Prior art keywords
- row
- semiconductor package
- lead frame
- leads
- wider
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は、本考案のリードフレームを示す平面
図、第２図は、本考案のリードフレームを用いた
半導体パツケージの外観図を示す。
１……外部リード、２……タイバー、３……内
部リード、４……ダイパツド、Ｗ１……半導体パ
ツケージ端部の外部リード幅、Ｗ２……半導体パ
ツケージ端部以外の外部リード幅。
FIG. 1 is a plan view showing the lead frame of the present invention, and FIG. 2 is an external view of a semiconductor package using the lead frame of the present invention. 1...External lead, 2...Tie bar, 3...Internal lead, 4...Die pad, W1 ...External lead width at the end of the semiconductor package, W2 ...External lead width other than the end of the semiconductor package.
Claims (1)
数の外部リードのうち、同列最外端の一対が内側
のものより幅広であることを特徴とする半導体用
リードフレーム。 A semiconductor lead frame characterized in that among a large number of external leads led out in a row from a semiconductor package, a pair of outermost leads in the same row are wider than those inside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7444685U JPS61190146U (en) | 1985-05-20 | 1985-05-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7444685U JPS61190146U (en) | 1985-05-20 | 1985-05-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61190146U true JPS61190146U (en) | 1986-11-27 |
Family
ID=30614751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7444685U Pending JPS61190146U (en) | 1985-05-20 | 1985-05-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61190146U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010016289A (en) * | 2008-07-07 | 2010-01-21 | Mitsubishi Electric Corp | Semiconductor package and semiconductor device |
-
1985
- 1985-05-20 JP JP7444685U patent/JPS61190146U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010016289A (en) * | 2008-07-07 | 2010-01-21 | Mitsubishi Electric Corp | Semiconductor package and semiconductor device |