JPH0412663U - - Google Patents
Info
- Publication number
- JPH0412663U JPH0412663U JP5344990U JP5344990U JPH0412663U JP H0412663 U JPH0412663 U JP H0412663U JP 5344990 U JP5344990 U JP 5344990U JP 5344990 U JP5344990 U JP 5344990U JP H0412663 U JPH0412663 U JP H0412663U
- Authority
- JP
- Japan
- Prior art keywords
- leads
- view
- lead frame
- lead
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims 1
- 239000008188 pellet Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の平面図、第２図は
第１図のリード部の拡大平面図、第３図は第２図
の側面図、第４図は一実施例の半導体装置用リー
ドフレームをモールド封止した時の縦断面図、第
５図は第４図のリードを折り曲げた状態の縦断面
図である。第６図は本考案の実施例２の平面図、
第７図は第６図のリード部の拡大平面図、第８図
は第７図の側面図である。第９図は従来の半導体
装置用リードフレームの平面図、第１０図は第９
図のリード部の拡大平面図、第１１図は第１０図
の側面図、第１２図は従来の半導体装置用リード
フレームをモールド封止した時の縦断面図、第１
３図は第１２図のリードを折り曲げた状態の縦断
面図である。
１……アイランド、２……溝、３……リード、
４……ステツチ、５……タイバー、６……パツケ
ージ、７……基準穴、８……ペレツト、９……ク
ラツク。
FIG. 1 is a plan view of one embodiment of the present invention, FIG. 2 is an enlarged plan view of the lead portion of FIG. 1, FIG. 3 is a side view of FIG. 2, and FIG. 4 is a semiconductor device of one embodiment. FIG. 5 is a vertical cross-sectional view of the lead frame shown in FIG. 4 in a bent state. FIG. 6 is a plan view of Embodiment 2 of the present invention;
7 is an enlarged plan view of the lead portion shown in FIG. 6, and FIG. 8 is a side view of the lead portion shown in FIG. Fig. 9 is a plan view of a conventional lead frame for semiconductor devices, and Fig. 10 is a plan view of a conventional lead frame for semiconductor devices.
FIG. 11 is a side view of FIG. 10, FIG. 12 is a longitudinal cross-sectional view of a conventional lead frame for a semiconductor device sealed with a mold, and FIG.
FIG. 3 is a longitudinal sectional view of the lead shown in FIG. 12 in a folded state. 1... Island, 2... Groove, 3... Lead,
4...Stitch, 5...Tie bar, 6...Package, 7...Reference hole, 8...Pellet, 9...Crack.
Claims (1)
半導体装置用リードフレームにおいて、リードの
表面及び裏面のリードの折り曲げ位置に、リード
と直角方向にリード端から反対端に達するＶ形状
の溝を有することを特徴とする半導体装置用リー
ドフレーム。 A strip-shaped lead frame for a semiconductor device having a plurality of islands and leads, characterized by having V-shaped grooves extending from the lead end to the opposite end in a direction perpendicular to the leads at the bending positions of the leads on the front and back surfaces of the leads. Lead frame for semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5344990U JPH0412663U (en) | 1990-05-22 | 1990-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5344990U JPH0412663U (en) | 1990-05-22 | 1990-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0412663U true JPH0412663U (en) | 1992-01-31 |
Family
ID=31574643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5344990U Pending JPH0412663U (en) | 1990-05-22 | 1990-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0412663U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018061026A (en) * | 2016-09-28 | 2018-04-12 | 日亜化学工業株式会社 | Light-emitting device and manufacturing method thereof |
| US10243107B2 (en) | 2016-09-28 | 2019-03-26 | Nichia Corporation | Light emitting device and method for manufacturing thereof |
-
1990
- 1990-05-22 JP JP5344990U patent/JPH0412663U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018061026A (en) * | 2016-09-28 | 2018-04-12 | 日亜化学工業株式会社 | Light-emitting device and manufacturing method thereof |
| US10243107B2 (en) | 2016-09-28 | 2019-03-26 | Nichia Corporation | Light emitting device and method for manufacturing thereof |
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