JPH0351849U - - Google Patents

Info

Publication number
JPH0351849U
JPH0351849U JP1989112645U JP11264589U JPH0351849U JP H0351849 U JPH0351849 U JP H0351849U JP 1989112645 U JP1989112645 U JP 1989112645U JP 11264589 U JP11264589 U JP 11264589U JP H0351849 U JPH0351849 U JP H0351849U
Authority
JP
Japan
Prior art keywords
semiconductor device
land portion
arrangement
pellet
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989112645U
Other languages
Japanese (ja)
Other versions
JPH0741164Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989112645U priority Critical patent/JPH0741164Y2/en
Publication of JPH0351849U publication Critical patent/JPH0351849U/ja
Application granted granted Critical
Publication of JPH0741164Y2 publication Critical patent/JPH0741164Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、本考案の一実施例に係るトランジス
タアレイの部分断面斜視図、第２図は、同じくト
ランジスタアレイにおけるリードフレームの配置
を示す平面図、第３図は、従来例のトランジスタ
アレイの部分断面斜視図、第４図は、同じく従来
例のトランジスタアレイにおけるリードフレーム
の配置を示す平面図である。 １……ペレツト、２……リードフレーム、２ａ
……ランド部、５……パツケージ。 FIG. 1 is a partial cross-sectional perspective view of a transistor array according to an embodiment of the present invention, FIG. 2 is a plan view showing the arrangement of lead frames in the transistor array, and FIG. 3 is a diagram of a conventional transistor array. FIG. 4, a partially sectional perspective view, is a plan view showing the arrangement of lead frames in a conventional transistor array. 1...Pellet, 2...Lead frame, 2a
...Land Department, 5...Package.

Claims (1)

【実用新案登録請求の範囲】 独立した半導体素子を構成するペレツトを複数
一組としてパツケージに封止した半導体装置にお
いて、 各ペレツトをダイボンデイングするリードフレ
ームのランド部が、配置中央側のものが端部のラ
ンド部に比べて熱容量の大きい形状に形成された
ことを特徴とする半導体装置。[Claims for Utility Model Registration] In a semiconductor device in which a plurality of pellets constituting independent semiconductor elements are sealed in a package, the land portion of the lead frame for die bonding each pellet is located at the center of the arrangement. A semiconductor device characterized by being formed in a shape having a larger heat capacity than a land portion at an end.
JP1989112645U 1989-09-26 1989-09-26 Semiconductor device Expired - Lifetime JPH0741164Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989112645U JPH0741164Y2 (en) 1989-09-26 1989-09-26 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989112645U JPH0741164Y2 (en) 1989-09-26 1989-09-26 Semiconductor device

Publications (2)

Publication Number Publication Date
JPH0351849U true JPH0351849U (en) 1991-05-20
JPH0741164Y2 JPH0741164Y2 (en) 1995-09-20

Family

ID=31661088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989112645U Expired - Lifetime JPH0741164Y2 (en) 1989-09-26 1989-09-26 Semiconductor device

Country Status (1)

Country Link
JP (1) JPH0741164Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012108011A1 (en) * 2011-02-09 2012-08-16 三菱電機株式会社 Power semiconductor module

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109194153A (en) 2010-11-02 2019-01-11 三菱电机株式会社 Electric power steering power module and the electric power steering drive dynamic control device for using it

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63151055A (en) * 1986-12-16 1988-06-23 Matsushita Electronics Corp Composite type semiconductor device
JPS63255953A (en) * 1987-04-13 1988-10-24 Sanken Electric Co Ltd Circuit device sealed with insulator

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63151055A (en) * 1986-12-16 1988-06-23 Matsushita Electronics Corp Composite type semiconductor device
JPS63255953A (en) * 1987-04-13 1988-10-24 Sanken Electric Co Ltd Circuit device sealed with insulator

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012108011A1 (en) * 2011-02-09 2012-08-16 三菱電機株式会社 Power semiconductor module
JP5669866B2 (en) * 2011-02-09 2015-02-18 三菱電機株式会社 Power semiconductor module
US9129949B2 (en) 2011-02-09 2015-09-08 Mitsubishi Electric Corporation Power semiconductor module

Also Published As

Publication number Publication date
JPH0741164Y2 (en) 1995-09-20

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