JPH0184442U - - Google Patents
Info
- Publication number
- JPH0184442U JPH0184442U JP1987180584U JP18058487U JPH0184442U JP H0184442 U JPH0184442 U JP H0184442U JP 1987180584 U JP1987180584 U JP 1987180584U JP 18058487 U JP18058487 U JP 18058487U JP H0184442 U JPH0184442 U JP H0184442U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- sealed
- tips
- beyond
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図、第２図は本考案の樹脂封止型半導体装
置の外形図である。第３図は第１図のものをチユ
ーブ状のものに収納したところの図である。第４
図、第５図は従来の樹脂封止型半導体装置の外形
図であり、第６図は第４図のものをトレー状の容
器に収納した図である。
FIGS. 1 and 2 are external views of the resin-sealed semiconductor device of the present invention. FIG. 3 is a diagram of the device shown in FIG. 1 housed in a tube-like structure. Fourth
5 are external views of a conventional resin-sealed semiconductor device, and FIG. 6 is a view of the device shown in FIG. 4 housed in a tray-shaped container.
Claims (1)
れより外へつき出させた構造を有する樹脂封止型
半導体装置。 A resin-sealed semiconductor device having a structure in which the edges of the resin-sealed portion protrude to the outside like or beyond the tips of the leads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987180584U JPH0184442U (en) | 1987-11-26 | 1987-11-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987180584U JPH0184442U (en) | 1987-11-26 | 1987-11-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0184442U true JPH0184442U (en) | 1989-06-05 |
Family
ID=31472098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987180584U Pending JPH0184442U (en) | 1987-11-26 | 1987-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0184442U (en) |
-
1987
- 1987-11-26 JP JP1987180584U patent/JPH0184442U/ja active Pending