JPS636750U - - Google Patents
Info
- Publication number
- JPS636750U JPS636750U JP10043686U JP10043686U JPS636750U JP S636750 U JPS636750 U JP S636750U JP 10043686 U JP10043686 U JP 10043686U JP 10043686 U JP10043686 U JP 10043686U JP S636750 U JPS636750 U JP S636750U
- Authority
- JP
- Japan
- Prior art keywords
- frame
- external leads
- island
- resin
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの発明の一実施例を示す上面図、第
２図は第１図のものを複数連結した状態を示す上
面図、第３図は従来のリードフレームを示す上面
図、第４図は樹脂封止用金型の下金型を示す斜視
図、第５図は従来のリードフレームにおけるフレ
ーム変形の状態を示す図である。
図において、１はフレーム枠、２はその先端が
フレーム枠に固着された外部リード、２ａはその
先端がフレーム枠と離隔した外部リード、１０は
アイランドである。なお、各図中、同一符号は同
一または相当部分を示すものである。
FIG. 1 is a top view showing an embodiment of the present invention, FIG. 2 is a top view showing a state in which a plurality of the lead frames shown in FIG. 1 are connected, FIG. 3 is a top view showing a conventional lead frame, and FIG. 5 is a perspective view showing a lower mold of a resin sealing mold, and FIG. 5 is a diagram showing a state of frame deformation in a conventional lead frame. In the figure, 1 is a frame, 2 is an external lead whose tip is fixed to the frame, 2a is an external lead whose tip is separated from the frame, and 10 is an island. In each figure, the same reference numerals indicate the same or corresponding parts.
Claims (1)
イランドと、このアイランドの周縁から外側方向
に延在し、かつ互いに一定の間隔をおいて設けら
れた複数の外部リードと、この外部リードの先端
が固着されて上記アイランドが固定支持されるフ
レーム枠とを備えた樹脂封止半導体装置用リード
フレームにおいて、上記複数の外部リードのうち
少なくとも一部の外部リードの先端を上記フレー
ム枠に離隔して設けたことを特徴とする樹脂封止
半導体装置用リードフレーム。 An island on which a semiconductor element is placed and sealed with resin, a plurality of external leads extending outward from the periphery of this island and provided at regular intervals, and tips of the external leads. A lead frame for a resin-sealed semiconductor device is provided with a frame frame to which the island is fixedly supported, wherein tips of at least some of the external leads of the plurality of external leads are spaced apart from the frame frame. A lead frame for a resin-sealed semiconductor device, characterized by the following:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10043686U JPS636750U (en) | 1986-06-30 | 1986-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10043686U JPS636750U (en) | 1986-06-30 | 1986-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS636750U true JPS636750U (en) | 1988-01-18 |
Family
ID=30970257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10043686U Pending JPS636750U (en) | 1986-06-30 | 1986-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS636750U (en) |
-
1986
- 1986-06-30 JP JP10043686U patent/JPS636750U/ja active Pending