JPH0165145U - - Google Patents
Info
- Publication number
- JPH0165145U JPH0165145U JP1987161502U JP16150287U JPH0165145U JP H0165145 U JPH0165145 U JP H0165145U JP 1987161502 U JP1987161502 U JP 1987161502U JP 16150287 U JP16150287 U JP 16150287U JP H0165145 U JPH0165145 U JP H0165145U
- Authority
- JP
- Japan
- Prior art keywords
- frame
- island
- lead
- lead frame
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａ，ｂは本考案の一実施例の平面図及び
Ａ―Ａ線断面図、第２図は従来の樹脂封止型半導
体装置の一例の断面図、第３図ａ，ｂは従来のリ
ードフレームの一例を示す平面図及びＡ―Ａ線断
面図である。
１……アイランド、２……支持体、３……半導
体チツプ、４……樹脂封止領域、５……リード、
６……突起、７……樹脂体。
Figures 1a and b are a plan view and a cross-sectional view taken along line A--A of an embodiment of the present invention, Figure 2 is a cross-sectional view of an example of a conventional resin-sealed semiconductor device, and Figures 3a and b are conventional FIG. 2 is a plan view and a cross-sectional view taken along line AA of the lead frame of FIG. DESCRIPTION OF SYMBOLS 1... Island, 2... Support body, 3... Semiconductor chip, 4... Resin sealing area, 5... Lead,
6...Protrusion, 7...Resin body.
Claims (1)
ームから張出された二本の支持体で支持されるア
イランドと、前記アイランドの周囲に配置され一
端が前記フレームに接続するリードを有するリー
ドフレームにおいて、前記支持体が取付けられて
いる側の前記アイランドの辺に沿つて突起を設け
たことを特徴とするリードフレーム。 In the lead frame, the lead frame has an island provided in the center of a rectangular frame and supported by two supports extending from the frame, and a lead arranged around the island and connected to the frame at one end. A lead frame characterized in that a protrusion is provided along a side of the island on which a support is attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161502U JPH0165145U (en) | 1987-10-21 | 1987-10-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161502U JPH0165145U (en) | 1987-10-21 | 1987-10-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0165145U true JPH0165145U (en) | 1989-04-26 |
Family
ID=31444492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987161502U Pending JPH0165145U (en) | 1987-10-21 | 1987-10-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0165145U (en) |
-
1987
- 1987-10-21 JP JP1987161502U patent/JPH0165145U/ja active Pending