JPS6142840U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS6142840U
JPS6142840U JP12728184U JP12728184U JPS6142840U JP S6142840 U JPS6142840 U JP S6142840U JP 12728184 U JP12728184 U JP 12728184U JP 12728184 U JP12728184 U JP 12728184U JP S6142840 U JPS6142840 U JP S6142840U
Authority
JP
Japan
Prior art keywords
tab
semiconductor equipment
semiconductor device
resin
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12728184U
Other languages
Japanese (ja)
Inventor
隆保 半田
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP12728184U priority Critical patent/JPS6142840U/en
Publication of JPS6142840U publication Critical patent/JPS6142840U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の半導体装置を示す上面図であり、第２図
は本考案による一実施例の半導体装置を示す上面図であ
る。 尚、図において、ｌａ，ｌｂ・・・半導体素子載置用タ
ブ、２ａ，２ｂ・・・タブ吊りリード、３ａ，３ｂ・・
・内部リード、４ａ，４ｂ・・・外部リード、５ａ，７
ｂ・・・リードフレーム、８ａ，８ｂ・・・半導体装置
、９ ａｔ ９ ｂ”半導体素子、１０ａ，１０ｂ・・
・ワイヤ、ｌｌｂ・・・折り返し反転部。FIG. 1 is a top view showing a conventional semiconductor device, and FIG. 2 is a top view showing an embodiment of the semiconductor device according to the present invention. In the figure, la, lb...semiconductor element mounting tabs, 2a, 2b... tab suspension leads, 3a, 3b...
・Internal lead, 4a, 4b...External lead, 5a, 7
b... Lead frame, 8a, 8b... Semiconductor device, 9 at 9 b'' semiconductor element, 10a, 10b...
・Wire, llb...Folding and inversion part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子と、その素子を載−するタブと、該タブを支
持するタブ吊りリードと、該タブの周囲に延在する内部
リードと、前記半導体素子の電極と該内部リードの先端
を接続するワイヤを樹脂封止して成る半導体装置におい
て、前記タブ吊りリードの一部に折り返し反転部を設け
ることを特徴とする樹脂封止型の半導体装置。A semiconductor element, a tab on which the element is mounted, a tab suspension lead that supports the tab, an internal lead extending around the tab, and a wire connecting the electrode of the semiconductor element and the tip of the internal lead. What is claimed is: 1. A resin-sealed semiconductor device comprising: a resin-sealed semiconductor device, wherein a part of the tab suspension lead is provided with a folded-back portion;
JP12728184U 1984-08-22 1984-08-22 semiconductor equipment Pending JPS6142840U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12728184U JPS6142840U (en) 1984-08-22 1984-08-22 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12728184U JPS6142840U (en) 1984-08-22 1984-08-22 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS6142840U true JPS6142840U (en) 1986-03-19

Family

ID=30685929

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12728184U Pending JPS6142840U (en) 1984-08-22 1984-08-22 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS6142840U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0377356A (en) * 1989-08-19 1991-04-02 Mitsubishi Electric Corp Lead frame for semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0377356A (en) * 1989-08-19 1991-04-02 Mitsubishi Electric Corp Lead frame for semiconductor device

Similar Documents

Publication Publication Date Title
JPS6142840U (en) semiconductor equipment
JPS60181051U (en) Structure of lead frame
JPS6117751U (en) Tape carrier semiconductor device
JPS59145047U (en) semiconductor equipment
JPS6037253U (en) semiconductor equipment
JPS614419U (en) chip capacitor
JPS6142855U (en) semiconductor equipment
JPS58191645U (en) Semiconductor device package
JPS58120665U (en) lead frame
JPS60153543U (en) Lead frame for semiconductor devices
JPS609226U (en) Package for semiconductor mounting
JPS60151132U (en) semiconductor equipment
JPS60119756U (en) lead frame
JPS5825050U (en) Lead terminal arrangement structure of integrated circuit package
JPS5858355U (en) Package for semiconductor devices
JPS5883157U (en) Resin-encapsulated semiconductor device
JPS5999447U (en) Package for semiconductors
JPS60103834U (en) lead frame
JPS58422U (en) Wire bonding connection structure
JPS59127240U (en) capacitor
JPS60179052U (en) Semiconductor device lead frame
JPS61251U (en) electronic components
JPS6190245U (en)
JPS6120045U (en) semiconductor equipment
JPS5989551U (en) Semiconductor integrated circuit device