JPS60119756U - lead frame - Google Patents

lead frame

Info

Publication number
JPS60119756U
JPS60119756U JP652084U JP652084U JPS60119756U JP S60119756 U JPS60119756 U JP S60119756U JP 652084 U JP652084 U JP 652084U JP 652084 U JP652084 U JP 652084U JP S60119756 U JPS60119756 U JP S60119756U
Authority
JP
Japan
Prior art keywords
lead frame
island
leads
abstract
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP652084U
Other languages
Japanese (ja)
Inventor
京戸　典生
正夫 高橋
Original Assignee
三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP652084U priority Critical patent/JPS60119756U/en
Publication of JPS60119756U publication Critical patent/JPS60119756U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１区は従来のリードフレームを示す図で、第２図は第
１図に示す従来のリードフレームに半導体素子を固着し
たときの部分拡大図で、第３図は本考案のリードフレー
ムの要部を示す要部拡大図　　　−である。 １・・・アイランド、２・・・リード、３・・・つりバ
ー、４・・・リードフレームの外周部、訃・・突出部、
９・・・突出部に直接に行ったワイヤボンディング。Section 1 is a diagram showing a conventional lead frame, FIG. 2 is a partially enlarged view of a semiconductor element fixed to the conventional lead frame shown in FIG. 1, and FIG. This is an enlarged view of the main parts. 1...Island, 2...Lead, 3...Hanging bar, 4...Outer periphery of lead frame, butt...Protruding part,
9...Wire bonding performed directly on the protrusion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子が固着されるアイランドと、このアイランド
の周囲の空間に設けられた複数のリードとを具備するリ
ードフレームにおいて、前記アイランドはその周囲が前
記リード間の間隙に向けて部分的に突出したことを特徴
とするリードフレーム。In a lead frame comprising an island to which a semiconductor element is fixed and a plurality of leads provided in a space around the island, the periphery of the island partially protrudes toward the gap between the leads. A lead frame featuring
JP652084U 1984-01-20 1984-01-20 lead frame Pending JPS60119756U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP652084U JPS60119756U (en) 1984-01-20 1984-01-20 lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP652084U JPS60119756U (en) 1984-01-20 1984-01-20 lead frame

Publications (1)

Publication Number Publication Date
JPS60119756U true JPS60119756U (en) 1985-08-13

Family

ID=30484036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP652084U Pending JPS60119756U (en) 1984-01-20 1984-01-20 lead frame

Country Status (1)

Country Link
JP (1) JPS60119756U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0459956U (en) * 1990-09-29 1992-05-22

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0459956U (en) * 1990-09-29 1992-05-22

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