JPS5952633U - high frequency element - Google Patents

high frequency element

Info

Publication number
JPS5952633U
JPS5952633U JP14787882U JP14787882U JPS5952633U JP S5952633 U JPS5952633 U JP S5952633U JP 14787882 U JP14787882 U JP 14787882U JP 14787882 U JP14787882 U JP 14787882U JP S5952633 U JPS5952633 U JP S5952633U
Authority
JP
Japan
Prior art keywords
high frequency
frequency element
bridge
abstract
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14787882U
Other languages
Japanese (ja)
Inventor
浩 吉田
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP14787882U priority Critical patent/JPS5952633U/en
Publication of JPS5952633U publication Critical patent/JPS5952633U/en
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図a ” cは従来のブリッヂを有する高周波素子
の平面図、要部模式傾視図およびペレットのホンディン
グパッドを示す図、第2図a”−’cは本考案の一実施
例による高周波素子の平面図、要部模式傾視図および要
部拡大平面図である。 1.3.4・・・・・・リード端子、2・・・・・・ブ
リッヂ、5・・・・・・ペレット、6・・・・・・ブリ
ッヂへのボンディングワイヤ、7・・・・・・リード端
子へのボンディングワイヤ、8・・・・・・セラミック
基板、9・・・・・・ペレット上のポンディングパッド
、a・・・・・・ペレットのブリッヂへの挿入長。
Figure 1 a''c is a plan view of a conventional high-frequency element with a bridge, a schematic perspective view of essential parts, and a diagram showing a pellet honding pad, and Figure 2 a''-'c is an embodiment of the present invention. FIG. 1 is a plan view, a schematic perspective view of a main part, and an enlarged plan view of a main part of a high-frequency element. 1.3.4... Lead terminal, 2... Bridge, 5... Pellet, 6... Bonding wire to bridge, 7... ... Bonding wire to lead terminal, 8 ... Ceramic substrate, 9 ... Bonding pad on pellet, a ... Length of insertion of pellet into bridge.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ブリッジを有するセラミックパッケージに収納された高
周波素子において、ペレットの少くとも一部がブリッヂ
の下に挿入されマウントされていることを特徴とする高
周波素子。
A high-frequency device housed in a ceramic package having a bridge, characterized in that at least a part of the pellet is inserted and mounted under the bridge.
JP14787882U 1982-09-29 1982-09-29 high frequency element Pending JPS5952633U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14787882U JPS5952633U (en) 1982-09-29 1982-09-29 high frequency element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14787882U JPS5952633U (en) 1982-09-29 1982-09-29 high frequency element

Publications (1)

Publication Number Publication Date
JPS5952633U true JPS5952633U (en) 1984-04-06

Family

ID=30328725

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14787882U Pending JPS5952633U (en) 1982-09-29 1982-09-29 high frequency element

Country Status (1)

Country Link
JP (1) JPS5952633U (en)

Similar Documents

Publication Publication Date Title
JPS596839U (en) semiconductor equipment
JPS5952633U (en) high frequency element
JPS6117751U (en) Tape carrier semiconductor device
JPS60153543U (en) Lead frame for semiconductor devices
JPS5933254U (en) semiconductor equipment
JPS59177949U (en) semiconductor equipment
JPS60106375U (en) Mounting structure of external lead terminal
JPS59145047U (en) semiconductor equipment
JPS6037253U (en) semiconductor equipment
JPS58120665U (en) lead frame
JPS5999447U (en) Package for semiconductors
JPS60156748U (en) semiconductor equipment
JPS5987135U (en) Glass sealed case for semiconductor devices
JPS609226U (en) Package for semiconductor mounting
JPS59191744U (en) semiconductor equipment
JPS6018555U (en) semiconductor equipment
JPS6021966U (en) Slit type contact for handler
JPS60130584U (en) IC socket
JPS6018556U (en) semiconductor equipment
JPS58159756U (en) integrated circuit device
JPS6076040U (en) semiconductor equipment
JPS6068654U (en) semiconductor equipment
JPS593556U (en) semiconductor equipment
JPS58122460U (en) Packages for semiconductor devices
JPS6094835U (en) semiconductor equipment