JPH03109333U - - Google Patents
Info
- Publication number
- JPH03109333U JPH03109333U JP1616490U JP1616490U JPH03109333U JP H03109333 U JPH03109333 U JP H03109333U JP 1616490 U JP1616490 U JP 1616490U JP 1616490 U JP1616490 U JP 1616490U JP H03109333 U JPH03109333 U JP H03109333U
- Authority
- JP
- Japan
- Prior art keywords
- paste
- die bonding
- holding
- applying
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
Description
第１図は本考案の第１実施例によるダイボンデ
イング機構を示す正面図、第２図は第１図のダイ
ボンデイング機構の平面図、第３図は本考案の第
２実施例によるダイボンデイング機構を示す図、
第４図は従来技術を説明する図である。
１０……支持フレーム、１２……ステツプモー
タ、１６……支持アーム、１８，２０……空気シ
リンダ、２６……ペースト塗布用シリンジ、３２
……チツプ保持用吸着コレツト、３８……シリン
コンチツプ、４０……基板。
FIG. 1 is a front view showing a die bonding mechanism according to a first embodiment of the present invention, FIG. 2 is a plan view of the die bonding mechanism of FIG. 1, and FIG. 3 is a die bonding mechanism according to a second embodiment of the present invention. A diagram showing
FIG. 4 is a diagram illustrating the prior art. 10... Support frame, 12... Step motor, 16... Support arm, 18, 20... Air cylinder, 26... Syringe for paste application, 32
. . . Adsorption collet for holding the chip, 38 . . . Silicon chip, 40 . . . Substrate.
Claims (1)
ンデイング機構において、ペースト塗布位置に置
かれた基板にペーストを塗布するペースト塗布手
段と、チツプ保持位置において半導体チツプを保
持し且つペーストを塗布された基板上に運ぶチツ
プ保持手段と、該ペースト塗布手段と該チツプ保
持手段とを同時に移動するように共通的に支持す
る支持手段と、該支持手段を移動させる駆動手段
とからなり、該ペースト塗布手段がペースト塗布
位置にきたときに該チツプ保持手段がチツプ保持
位置にくるようにしたことを特徴とするダイボン
デイング機構。 A die bonding mechanism for attaching a semiconductor chip to a substrate includes a paste application means for applying paste to the substrate placed at a paste application position, and a paste application means for holding the semiconductor chip at a chip holding position and transporting the semiconductor chip onto the substrate coated with the paste. It consists of a chip holding means, a supporting means for commonly supporting the paste applying means and the chip holding means so as to move them simultaneously, and a driving means for moving the supporting means, and the paste applying means is located at a paste applying position. 1. A die bonding mechanism characterized in that the die bonding means is arranged to come to a tip holding position when the die bonding mechanism reaches the tip holding position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1616490U JPH03109333U (en) | 1990-02-22 | 1990-02-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1616490U JPH03109333U (en) | 1990-02-22 | 1990-02-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03109333U true JPH03109333U (en) | 1991-11-11 |
Family
ID=31519448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1616490U Pending JPH03109333U (en) | 1990-02-22 | 1990-02-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03109333U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007244706A (en) * | 2006-03-17 | 2007-09-27 | Jms Co Ltd | Adapter |
| JP2008054927A (en) * | 2006-08-31 | 2008-03-13 | Nippon Sherwood Medical Industries Ltd | Connection structure for connector |
| JP2009050313A (en) * | 2007-08-23 | 2009-03-12 | Nippon Sherwood Medical Industries Ltd | Connecting structure for connector |
-
1990
- 1990-02-22 JP JP1616490U patent/JPH03109333U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007244706A (en) * | 2006-03-17 | 2007-09-27 | Jms Co Ltd | Adapter |
| JP2008054927A (en) * | 2006-08-31 | 2008-03-13 | Nippon Sherwood Medical Industries Ltd | Connection structure for connector |
| JP2009050313A (en) * | 2007-08-23 | 2009-03-12 | Nippon Sherwood Medical Industries Ltd | Connecting structure for connector |