JPH03109743U - - Google Patents
Info
- Publication number
- JPH03109743U JPH03109743U JP1852790U JP1852790U JPH03109743U JP H03109743 U JPH03109743 U JP H03109743U JP 1852790 U JP1852790 U JP 1852790U JP 1852790 U JP1852790 U JP 1852790U JP H03109743 U JPH03109743 U JP H03109743U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- chip
- diamond
- adsorbing
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000001179 sorption measurement Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
- 230000007257 malfunction Effects 0.000 description 1
Landscapes
- Die Bonding (AREA)
- Feeding Of Workpieces (AREA)
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
Description
第１図Ａは、本考案を適用するコレツトチヤツ
クの一例を示す斜視図、第１図Ｂは、第１図Ａの
コレツトチヤツクに本考案を実施した場合の例を
示す断面図、第２図は、第１図Ａに示したコレツ
トチヤツクの使用状態を示す断面図、第３図は、
第１図Ａに示した一例でおこる不具合の様子を示
した断面図である。
１……ダイヤモンド膜、２，３……ＩＣホール
ド斜面、４……吸着用空気穴、５……ＩＣ（半導
体ＩＣチツプ）、６，７……摩耗部。
FIG. 1A is a perspective view showing an example of a collector chuck to which the present invention is applied, FIG. 1B is a cross-sectional view showing an example of the present invention applied to the collector chuck of FIG. 1A, and FIG. A sectional view showing the state of use of the collect chuck shown in FIG. 1A, and FIG. 3 are as follows.
FIG. 2 is a cross-sectional view showing a malfunction that occurs in the example shown in FIG. 1A. 1... Diamond film, 2, 3... IC holding slope, 4... Air hole for adsorption, 5... IC (semiconductor IC chip), 6, 7... Worn part.
Claims (1)
ーム等にセツトするためのコレツトチヤツクにお
いて、半導体ＩＣチツプ吸着部の表面がダイヤモ
ンド薄膜形成技術を用いてダイヤモンドコーテイ
ングされている事を特徴とするコレツトチヤツク
。 A collect chuck for adsorbing a semiconductor IC chip and setting it on a substrate, lead frame, etc., characterized in that the surface of the semiconductor IC chip adsorption part is coated with diamond using diamond thin film forming technology.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1852790U JPH03109743U (en) | 1990-02-26 | 1990-02-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1852790U JPH03109743U (en) | 1990-02-26 | 1990-02-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03109743U true JPH03109743U (en) | 1991-11-11 |
Family
ID=31521682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1852790U Pending JPH03109743U (en) | 1990-02-26 | 1990-02-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03109743U (en) |
-
1990
- 1990-02-26 JP JP1852790U patent/JPH03109743U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH03109743U (en) | ||
| JPH01140850U (en) | ||
| JPH0249138U (en) | ||
| JPS6413127U (en) | ||
| JPH03109333U (en) | ||
| JPH0184489U (en) | ||
| JPH03106745U (en) | ||
| JPS6450050U (en) | ||
| JPS6384941U (en) | ||
| JPH0237868U (en) | ||
| JPH0412673U (en) | ||
| JPS6336048U (en) | ||
| JPS59159942U (en) | spinner device | |
| JPS6194348U (en) | ||
| JPH0233429U (en) | ||
| JPS61196299U (en) | ||
| JPH02106308U (en) | ||
| JPS62156957U (en) | ||
| JPS6247128U (en) | ||
| JPH02125343U (en) | ||
| JPS59149634U (en) | Adhesive plate for wafer fixation | |
| JPS62190348U (en) | ||
| JPS61151360U (en) | ||
| JPH0183356U (en) | ||
| JPH044757U (en) |