JPH0237868U - - Google Patents
Info
- Publication number
- JPH0237868U JPH0237868U JP11535688U JP11535688U JPH0237868U JP H0237868 U JPH0237868 U JP H0237868U JP 11535688 U JP11535688 U JP 11535688U JP 11535688 U JP11535688 U JP 11535688U JP H0237868 U JPH0237868 U JP H0237868U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- tape mount
- mount
- semiconductor device
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims description 2
- 230000002745 absorbent Effects 0.000 claims 1
- 239000002250 absorbent Substances 0.000 claims 1
- 238000010521 absorption reaction Methods 0.000 description 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Description
第１図ａ，ｂは本考案の一実施例の平面図及び
Ａ―Ａ′線断面図、第２図ａ，ｂは従来の半導体
装置のテーピングを説明するための平面図及びＢ
―Ｂ′線断面図である。
１……テープ台紙、２……粘着剤層、３……吸
湿層、４……半導体装置。
1A and 1B are a plan view and a sectional view taken along the line A-A' of an embodiment of the present invention, and FIGS. 2A and 2B are a plan view and B for explaining taping of a conventional semiconductor device.
-B' line sectional view. 1...Tape mount, 2...Adhesive layer, 3...Moisture absorption layer, 4...Semiconductor device.
Claims (1)
半導体装置を粘着固定する粘着剤層と、前記テー
プ台紙の裏面に設けられ水分を吸収する能力のあ
る吸湿剤を含んだ吸湿層とを有することを特徴と
する半導体装置テーピング用テープ。 A tape mount, an adhesive layer formed on the surface of the tape mount to adhesively fix the semiconductor device, and a hygroscopic layer provided on the back surface of the tape mount and containing a moisture absorbent capable of absorbing moisture. Features: Tape for taping semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11535688U JPH0237868U (en) | 1988-08-31 | 1988-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11535688U JPH0237868U (en) | 1988-08-31 | 1988-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0237868U true JPH0237868U (en) | 1990-03-13 |
Family
ID=31356943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11535688U Pending JPH0237868U (en) | 1988-08-31 | 1988-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0237868U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003037743A1 (en) * | 2001-11-01 | 2003-05-08 | Idemitsu Unitech Co., Ltd. | Atmosphere improving tape for package, package with atmosphere improving tape and method of manufacturing the package, package container with atmosphere improving tape, engaging device, and package with engaging device |
-
1988
- 1988-08-31 JP JP11535688U patent/JPH0237868U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003037743A1 (en) * | 2001-11-01 | 2003-05-08 | Idemitsu Unitech Co., Ltd. | Atmosphere improving tape for package, package with atmosphere improving tape and method of manufacturing the package, package container with atmosphere improving tape, engaging device, and package with engaging device |
| CN100443382C (en) * | 2001-11-01 | 2008-12-17 | 出光统一科技株式会社 | Atmosphere improving tape for package, package with atmosphere improving tape and method of manufacturing the package, package container with atmosphere improving tape, engaging device and package wit |
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