JPH0245970U - - Google Patents
Info
- Publication number
- JPH0245970U JPH0245970U JP12455388U JP12455388U JPH0245970U JP H0245970 U JPH0245970 U JP H0245970U JP 12455388 U JP12455388 U JP 12455388U JP 12455388 U JP12455388 U JP 12455388U JP H0245970 U JPH0245970 U JP H0245970U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- electronic component
- mount
- holding tape
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
- 239000002390 adhesive tape Substances 0.000 description 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
第１図は本考案の一実施例の縦断面図、第２図
は従来の搭載用テープの縦断面図、第３図は搭載
用テープの正面図である。
１……電子部品、２……リード、２ａ……先端
部、１１……搭載用テープ、１２……台紙、１３
……保持テープ、１４……粘着テープ（粘着材層
）。
FIG. 1 is a longitudinal sectional view of an embodiment of the present invention, FIG. 2 is a longitudinal sectional view of a conventional mounting tape, and FIG. 3 is a front view of the mounting tape. DESCRIPTION OF SYMBOLS 1... Electronic component, 2... Lead, 2a... Tip part, 11... Mounting tape, 12... Mounting paper, 13
...Holding tape, 14...Adhesive tape (adhesive material layer).
Claims (1)
と台紙との間に電子部品のリードを挾んで支持す
る搭載用テープにおいて、前記保持テープに対向
する台紙の表面に粘着材の層を設け、この粘着材
層と前記保持テープとで電子部品のリード両面を
夫々接着支持するように構成したことを特徴とす
る電子部品搭載用テープ。 In a mounting tape that attaches a holding tape to a mount and supports electronic component leads by sandwiching them between the holding tape and the mount, an adhesive layer is provided on the surface of the mount opposite the holding tape, and the adhesive A tape for mounting an electronic component, characterized in that the material layer and the holding tape are configured to adhesively support both sides of leads of an electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12455388U JPH0245970U (en) | 1988-09-22 | 1988-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12455388U JPH0245970U (en) | 1988-09-22 | 1988-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0245970U true JPH0245970U (en) | 1990-03-29 |
Family
ID=31374388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12455388U Pending JPH0245970U (en) | 1988-09-22 | 1988-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0245970U (en) |
-
1988
- 1988-09-22 JP JP12455388U patent/JPH0245970U/ja active Pending
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