JPH01144361U - - Google Patents

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Publication number
JPH01144361U
JPH01144361U JP3931788U JP3931788U JPH01144361U JP H01144361 U JPH01144361 U JP H01144361U JP 3931788 U JP3931788 U JP 3931788U JP 3931788 U JP3931788 U JP 3931788U JP H01144361 U JPH01144361 U JP H01144361U
Authority
JP
Japan
Prior art keywords
carrier
adhesive layer
electronic components
support
buffer layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3931788U
Other languages
Japanese (ja)
Other versions
JPH076121Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988039317U priority Critical patent/JPH076121Y2/en
Priority to KR1019890012051A priority patent/KR900005862A/en
Publication of JPH01144361U publication Critical patent/JPH01144361U/ja
Application granted granted Critical
Publication of JPH076121Y2 publication Critical patent/JPH076121Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Packages (AREA)
  • Packaging Frangible Articles (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の実例を示す部分斜視図、第2
図は第1図の搬送体による電子部品の供給状態を
示す説明図、第3図は本考案の他の実施を示す部
分斜視図である。 1……搬送用支持体、2……粘着剤層、3……
緩衝体層。
Fig. 1 is a partial perspective view showing an example of the present invention;
The figure is an explanatory diagram showing a state in which electronic components are supplied by the carrier shown in FIG. 1, and FIG. 3 is a partial perspective view showing another implementation of the present invention. 1... Conveyance support, 2... Adhesive layer, 3...
Buffer layer.

Claims (1)

【実用新案登録請求の範囲】 (1) 搬送用支持体面に粘着剤層を設けて電子部
品を粘着固定する搬送体であつて、前記支持体と
前記粘着剤層との間に緩衝体層を介在させたこと
を特徴とする電子部品用搬送体。 (2) 粘着剤層及び緩衝体層が搬送用支持体の長
さ方向に間欠的に設けられている請求項1記載の
電子部品用搬送体。
[Claims for Utility Model Registration] (1) A conveying body in which an adhesive layer is provided on the surface of a conveying support and electronic components are adhesively fixed thereto, wherein a buffer layer is provided between the support and the adhesive layer. A carrier for electronic parts characterized by interposing the carrier therebetween. (2) The carrier for electronic components according to claim 1, wherein the adhesive layer and the buffer layer are provided intermittently in the length direction of the carrier.
JP1988039317U 1988-02-26 1988-03-24 Carrier for electronic parts Expired - Lifetime JPH076121Y2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1988039317U JPH076121Y2 (en) 1988-03-24 1988-03-24 Carrier for electronic parts
KR1019890012051A KR900005862A (en) 1988-02-26 1989-08-24 Carrier for Electronic Parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988039317U JPH076121Y2 (en) 1988-03-24 1988-03-24 Carrier for electronic parts

Publications (2)

Publication Number Publication Date
JPH01144361U true JPH01144361U (en) 1989-10-04
JPH076121Y2 JPH076121Y2 (en) 1995-02-15

Family

ID=31265826

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988039317U Expired - Lifetime JPH076121Y2 (en) 1988-02-26 1988-03-24 Carrier for electronic parts

Country Status (1)

Country Link
JP (1) JPH076121Y2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59194498A (en) * 1983-04-19 1984-11-05 双信電機株式会社 Carrier tape of chiplike electronic part
JPS6149497U (en) * 1984-09-03 1986-04-03

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59194498A (en) * 1983-04-19 1984-11-05 双信電機株式会社 Carrier tape of chiplike electronic part
JPS6149497U (en) * 1984-09-03 1986-04-03

Also Published As

Publication number Publication date
JPH076121Y2 (en) 1995-02-15

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