JPH01107576U - - Google Patents
Info
- Publication number
- JPH01107576U JPH01107576U JP90688U JP90688U JPH01107576U JP H01107576 U JPH01107576 U JP H01107576U JP 90688 U JP90688 U JP 90688U JP 90688 U JP90688 U JP 90688U JP H01107576 U JPH01107576 U JP H01107576U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- holding
- electronic component
- holes
- sensitive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 3
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Description
第１図ａ，ｂは本考案の電子部品保持テープの
平面図、断面図、第２図ａ，ｂは従来の電子部品
保持テープの平面図、断面図、第３図ａ，ｂ他の
実施例の平面図、断面図である。
１……電子部品保持テープの台紙、２……パー
ホレーシヨン、３……感圧接着テープ、４……電
子部品保持孔。
Figures 1a and b are a plan view and a sectional view of the electronic component holding tape of the present invention, Figures 2a and b are a plan view and a sectional view of a conventional electronic component holding tape, and Figures 3a and b are other implementations. FIG. 3 is a plan view and a sectional view of an example. 1... mount for electronic component holding tape, 2... perforation, 3... pressure sensitive adhesive tape, 4... electronic component holding hole.
Claims (1)
ーシヨンと中心部付近に電子部品を保持する孔と
をそれぞれ連続して設け、前記テープ中心部付近
裏面にテープ長手方向に沿つて感圧接着テープを
貼合せ、保持孔に感圧接着面を露出せしめて前記
保持孔に電子部品を保持する電子部品保持テープ
において、電子部品を保持する孔を２個以上有す
る様にしたことを特徴とする電子部品保持テープ
。 Perforations with small holes at regular intervals are provided at the end of the tape and holes for holding electronic components are provided in succession near the center, and a pressure-sensitive adhesive tape is pasted along the longitudinal direction of the tape on the back surface near the center of the tape. Additionally, an electronic component holding tape for holding an electronic component in the holding hole by exposing a pressure-sensitive adhesive surface to the holding hole, the electronic component holding tape having two or more holes for holding the electronic component. tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP90688U JPH01107576U (en) | 1988-01-07 | 1988-01-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP90688U JPH01107576U (en) | 1988-01-07 | 1988-01-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01107576U true JPH01107576U (en) | 1989-07-20 |
Family
ID=31200328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP90688U Pending JPH01107576U (en) | 1988-01-07 | 1988-01-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01107576U (en) |
-
1988
- 1988-01-07 JP JP90688U patent/JPH01107576U/ja active Pending
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