JPH0286135U - - Google Patents
Info
- Publication number
- JPH0286135U JPH0286135U JP1988165604U JP16560488U JPH0286135U JP H0286135 U JPH0286135 U JP H0286135U JP 1988165604 U JP1988165604 U JP 1988165604U JP 16560488 U JP16560488 U JP 16560488U JP H0286135 U JPH0286135 U JP H0286135U
- Authority
- JP
- Japan
- Prior art keywords
- bonding tool
- lead
- film carrier
- pressurizing
- connection device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の実施例１を示す正面図、第２
図は第１図のボンデイングツール先端部を示す斜
視図、第３図は本考案の実施例２を示すボンデイ
ングツール先端部の斜視図である。
１……ペレツト、２……バンプ、３……テープ
キヤリア基板、４……リード、５……ボンデイン
グツール、６……ヒータ、７……加圧装置、８…
…超音波ホーン、９……超音波振動子、１０……
ボンデイングステージ、１１……陰圧、１２……
凹部、１３……微小孔、１４……多孔質金属。
Figure 1 is a front view showing Embodiment 1 of the present invention, Figure 2 is a front view showing Example 1 of the present invention;
This figure is a perspective view showing the tip of the bonding tool shown in FIG. 1, and FIG. 3 is a perspective view of the tip of the bonding tool showing Embodiment 2 of the present invention. DESCRIPTION OF SYMBOLS 1... Pellet, 2... Bump, 3... Tape carrier substrate, 4... Lead, 5... Bonding tool, 6... Heater, 7... Pressure device, 8...
...Ultrasonic horn, 9...Ultrasonic vibrator, 10...
Bonding stage, 11... Negative pressure, 12...
Recessed portion, 13... Micropore, 14... Porous metal.
Claims (1)
ア基板のリードを一括同時接続するフイルムキヤ
リアデバイスのリード接続装置において、先端部
にリードを保持する機能をもつボンデイングツー
ルと、前記ボンデイングツールを加熱する加熱手
段と、ボンデイングツールを加圧する加圧手段と
、前記ボンデイングツールに超音波振動を加える
超音波ホーン及び超音波振動子とを有することを
特徴とするフイルムキヤリアデバイスのリード接
続装置。 A lead connection device for a film carrier device that simultaneously connects a semiconductor element provided with a protruding electrode and a lead of a film carrier substrate, comprising: a bonding tool having a function of holding the lead at its tip; and a heating means for heating the bonding tool. A lead connection device for a film carrier device, comprising: a pressurizing means for pressurizing a bonding tool; and an ultrasonic horn and an ultrasonic vibrator for applying ultrasonic vibration to the bonding tool.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988165604U JPH0286135U (en) | 1988-12-21 | 1988-12-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988165604U JPH0286135U (en) | 1988-12-21 | 1988-12-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0286135U true JPH0286135U (en) | 1990-07-09 |
Family
ID=31452243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988165604U Pending JPH0286135U (en) | 1988-12-21 | 1988-12-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0286135U (en) |
-
1988
- 1988-12-21 JP JP1988165604U patent/JPH0286135U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0286135U (en) | ||
| JPH0351891U (en) | ||
| JPS6196542U (en) | ||
| JPS62118443U (en) | ||
| JPS62121826U (en) | ||
| JPS62190348U (en) | ||
| JPH01117858U (en) | ||
| JPS62199949U (en) | ||
| JPS58195670U (en) | liquid atomizer | |
| JPS636736U (en) | ||
| JPS62134270U (en) | ||
| JPH0313740U (en) | ||
| JPS63188944U (en) | ||
| JPS6237930U (en) | ||
| JPS63180968U (en) | ||
| JPH0324799U (en) | ||
| JPS63152240U (en) | ||
| JPS60119530U (en) | Paper pack spout adhesive device | |
| JPH0224548U (en) | ||
| JPS63131128U (en) | ||
| JPH0272200U (en) | ||
| JPH0415846U (en) | ||
| JPS5840124U (en) | Simple moxibustion device | |
| JPS60183440U (en) | semiconductor frame | |
| JPH0385673U (en) |