JPS6196542U - - Google Patents
Info
- Publication number
- JPS6196542U JPS6196542U JP18217384U JP18217384U JPS6196542U JP S6196542 U JPS6196542 U JP S6196542U JP 18217384 U JP18217384 U JP 18217384U JP 18217384 U JP18217384 U JP 18217384U JP S6196542 U JPS6196542 U JP S6196542U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- lead
- large number
- utility
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000005219 brazing Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 239000011888 foil Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Description
第１図はこの考案の一実施例に係る半導体装置
の構成を略示した説明図、第２図は第１図に示し
た半導体装置の作用の説明図、第３図は従来の半
導体装置の説明図を示している。
１…リードフレーム、２ａ〜２ｃ…リード、３
…ボンデイングエリア、４…尖鋭突起、７…半導
体素子、８…半田箔。
FIG. 1 is an explanatory diagram schematically showing the structure of a semiconductor device according to an embodiment of the invention, FIG. 2 is an explanatory diagram of the operation of the semiconductor device shown in FIG. 1, and FIG. 3 is an explanatory diagram of the conventional semiconductor device. An explanatory diagram is shown. 1...Lead frame, 2a-2c...Lead, 3
...Bonding area, 4...Sharp protrusion, 7...Semiconductor element, 8...Solder foil.
Claims (1)
成された部分に、ろう材を介して半導体素子を固
着してなることを特徴とする半導体装置。 A semiconductor device characterized in that a semiconductor element is fixed to a portion of the surface of a lead frame in which a large number of pointed lead protrusions are formed through a brazing material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18217384U JPS6196542U (en) | 1984-11-29 | 1984-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18217384U JPS6196542U (en) | 1984-11-29 | 1984-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6196542U true JPS6196542U (en) | 1986-06-21 |
Family
ID=30739709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18217384U Pending JPS6196542U (en) | 1984-11-29 | 1984-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6196542U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013008771A (en) * | 2011-06-23 | 2013-01-10 | Nissan Motor Co Ltd | Semiconductor module |
| JP2014197634A (en) * | 2013-03-29 | 2014-10-16 | 新電元工業株式会社 | Lead frame, semiconductor device, and manufacturing method of the same |
-
1984
- 1984-11-29 JP JP18217384U patent/JPS6196542U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013008771A (en) * | 2011-06-23 | 2013-01-10 | Nissan Motor Co Ltd | Semiconductor module |
| JP2014197634A (en) * | 2013-03-29 | 2014-10-16 | 新電元工業株式会社 | Lead frame, semiconductor device, and manufacturing method of the same |