JPS63193834U - - Google Patents
Info
- Publication number
- JPS63193834U JPS63193834U JP1987083286U JP8328687U JPS63193834U JP S63193834 U JPS63193834 U JP S63193834U JP 1987083286 U JP1987083286 U JP 1987083286U JP 8328687 U JP8328687 U JP 8328687U JP S63193834 U JPS63193834 U JP S63193834U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- semiconductor element
- lead
- semiconductor
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims 1
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Description
第１図及び第２図は本考案に係る半導体装置の
実施例を示す断面図、第３図及び第４図は従来例
を示す断面図である。
１ｂ……電極部、２……半導体素子、４……リ
ード。
1 and 2 are sectional views showing an embodiment of a semiconductor device according to the present invention, and FIGS. 3 and 4 are sectional views showing a conventional example. 1b...electrode section, 2...semiconductor element, 4...lead.
Claims (1)
とがリードでボンデイングされてなる半導体装置
において、 前記リードは形状記憶合金にて形成され、且つ
加熱されて変形した状態で前記半導体素子に固定
されていることを特徴とする半導体装置。[Claims for Utility Model Registration] A semiconductor device in which a semiconductor element is disposed and the semiconductor element and an electrode part are bonded with a lead, the lead being formed of a shape memory alloy and deformed by heating. A semiconductor device, wherein the semiconductor device is fixed to the semiconductor element in a fixed state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987083286U JPS63193834U (en) | 1987-05-30 | 1987-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987083286U JPS63193834U (en) | 1987-05-30 | 1987-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63193834U true JPS63193834U (en) | 1988-12-14 |
Family
ID=30936733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987083286U Pending JPS63193834U (en) | 1987-05-30 | 1987-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63193834U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02192137A (en) * | 1989-01-19 | 1990-07-27 | Ibiden Co Ltd | Film carrier |
-
1987
- 1987-05-30 JP JP1987083286U patent/JPS63193834U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02192137A (en) * | 1989-01-19 | 1990-07-27 | Ibiden Co Ltd | Film carrier |
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