JPS6395228U - - Google Patents
Info
- Publication number
- JPS6395228U JPS6395228U JP19127386U JP19127386U JPS6395228U JP S6395228 U JPS6395228 U JP S6395228U JP 19127386 U JP19127386 U JP 19127386U JP 19127386 U JP19127386 U JP 19127386U JP S6395228 U JPS6395228 U JP S6395228U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- cylindrical body
- electronic component
- shape memory
- memory alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims description 3
- 239000003985 ceramic capacitor Substances 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Thermally Actuated Switches (AREA)
Description
第１図は本考案の第１の実施例の電子部品を示
す斜視図、第２図は第１図の電子部品で使用する
円筒体の断面図、第３図は第２図の円筒体の開放
状態を示す断面図、第４図は本考案の第２の実施
例の電子部品を示す斜視図、第５図は第４図の電
子部品の円筒体を示す断面図、第６図は第５図の
円筒体の開放状態を示す断面図である。
１……セラミツクコンデンサ、２ａ，２ｂ……
外部電極、３ａ，３ｂ……リード、４……円筒状
の形状記憶合金からなる円筒体、５……円筒状の
形状記憶合金の先端部に複数の切り裂き溝を形成
した円筒体。
1 is a perspective view showing an electronic component according to a first embodiment of the present invention, FIG. 2 is a sectional view of a cylindrical body used in the electronic component of FIG. 1, and FIG. 4 is a perspective view showing the electronic component of the second embodiment of the present invention, FIG. 5 is a sectional view showing the cylindrical body of the electronic component in FIG. 4, and FIG. FIG. 6 is a sectional view showing the cylindrical body of FIG. 5 in an open state; 1... Ceramic capacitor, 2a, 2b...
External electrodes, 3a, 3b...Leads, 4...A cylindrical body made of a cylindrical shape memory alloy, 5...A cylindrical body having a plurality of cut grooves formed at the tip of the cylindrical shape memory alloy.
Claims (1)
に、形状記憶合金からなる円筒体を介在させ、所
定温度以上になると、前記円筒体が作動し、前記
リードが電気的に“断”状態となるように構成さ
れていることを特徴とする電子部品。 In an electronic component having a lead, a cylindrical body made of a shape memory alloy is interposed in the lead, and when the temperature reaches a predetermined temperature or higher, the cylindrical body is activated and the lead is electrically disconnected. An electronic component characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19127386U JPS6395228U (en) | 1986-12-11 | 1986-12-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19127386U JPS6395228U (en) | 1986-12-11 | 1986-12-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6395228U true JPS6395228U (en) | 1988-06-20 |
Family
ID=31145262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19127386U Pending JPS6395228U (en) | 1986-12-11 | 1986-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6395228U (en) |
-
1986
- 1986-12-11 JP JP19127386U patent/JPS6395228U/ja active Pending