JPS63149551U - - Google Patents
Info
- Publication number
- JPS63149551U JPS63149551U JP4225687U JP4225687U JPS63149551U JP S63149551 U JPS63149551 U JP S63149551U JP 4225687 U JP4225687 U JP 4225687U JP 4225687 U JP4225687 U JP 4225687U JP S63149551 U JPS63149551 U JP S63149551U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- lead
- semiconductor device
- inner lead
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案のリードフレームの平面図、第
２図は第１図のリードフレームの縦方向断面図、
第３図は本考案の他の実施例を示すリードフレー
ムの平面図、第４図は第３図のリードフレームの
縦方向断面図、第５図は半導体装置の概略構成図
、第６図は従来のリードフレームの平面図である
。
１……半導体装置、４ａ，４ｂ……ベース、５
……インナーリード、７……リード、１０……半
導体素子、１２……ボンデイングパツド、１３…
…ワイヤ、２０……リードフレーム、２１……補
強用絶縁材。
FIG. 1 is a plan view of the lead frame of the present invention, FIG. 2 is a longitudinal sectional view of the lead frame of FIG. 1,
FIG. 3 is a plan view of a lead frame showing another embodiment of the present invention, FIG. 4 is a vertical sectional view of the lead frame of FIG. 3, FIG. 5 is a schematic configuration diagram of a semiconductor device, and FIG. FIG. 3 is a plan view of a conventional lead frame. 1...Semiconductor device, 4a, 4b...Base, 5
...Inner lead, 7...Lead, 10...Semiconductor element, 12...Bonding pad, 13...
... wire, 20 ... lead frame, 21 ... reinforcing insulating material.
Claims (1)
体素子上方へと突出させて、半導体素子上面の各
ボンデイングパツドと上記各インナーリード先端
との間をワイヤでそれぞれ接続する半導体装置用
リードフレームにおいて、上記リードフレームの
少なくともワイヤボンデイングエリアを除く各イ
ンナーリード間を補強用絶縁材で相互に連結して
なる半導体装置用リードフレーム。 A lead frame for a semiconductor device in which each inner lead tip of the lead frame projects above a semiconductor element, and each bonding pad on the upper surface of the semiconductor element and each inner lead tip are connected by wires, wherein the lead frame A lead frame for a semiconductor device in which each inner lead, excluding at least a wire bonding area, is interconnected with a reinforcing insulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4225687U JPS63149551U (en) | 1987-03-23 | 1987-03-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4225687U JPS63149551U (en) | 1987-03-23 | 1987-03-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63149551U true JPS63149551U (en) | 1988-10-03 |
Family
ID=30857996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4225687U Pending JPS63149551U (en) | 1987-03-23 | 1987-03-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63149551U (en) |
-
1987
- 1987-03-23 JP JP4225687U patent/JPS63149551U/ja active Pending