JPS62154641U - - Google Patents
Info
- Publication number
- JPS62154641U JPS62154641U JP1986041043U JP4104386U JPS62154641U JP S62154641 U JPS62154641 U JP S62154641U JP 1986041043 U JP1986041043 U JP 1986041043U JP 4104386 U JP4104386 U JP 4104386U JP S62154641 U JPS62154641 U JP S62154641U
- Authority
- JP
- Japan
- Prior art keywords
- metal electrode
- semiconductor device
- cross
- brazing material
- shaped protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 5
- 238000005219 brazing Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000008188 pellet Substances 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Description
第１図はこの考案の一実施例を示す半導体装置
の断面図、第２図はこの考案の金属電極を示す斜
視図、第３図は従来の一般整流用半導体装置の断
面図、第４図は従来の金属電極を示す斜視図ある
。
図において、１は金属電極、１ａは十文字状の
突起部、３は半導体ペレツト、４はろう材である
。なお、各図中の同一符号は同一または相当部分
を示す。
Fig. 1 is a sectional view of a semiconductor device showing an embodiment of this invention, Fig. 2 is a perspective view showing a metal electrode of this invention, Fig. 3 is a sectional view of a conventional general rectifying semiconductor device, and Fig. 4. is a perspective view showing a conventional metal electrode. In the figure, 1 is a metal electrode, 1a is a cross-shaped protrusion, 3 is a semiconductor pellet, and 4 is a brazing material. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
着された半導体装置において、前記金属電極面に
十文字状の突起部を設け、この十文字状の突起部
に前記半導体ペレツトをろう材を介して接着した
ことを特徴とする半導体装置。 In a semiconductor device in which a semiconductor pellet is welded to a metal electrode via a brazing material, a cross-shaped protrusion is provided on the surface of the metal electrode, and the semiconductor pellet is adhered to the cross-shaped protrusion via a brazing material. A semiconductor device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986041043U JPS62154641U (en) | 1986-03-20 | 1986-03-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986041043U JPS62154641U (en) | 1986-03-20 | 1986-03-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62154641U true JPS62154641U (en) | 1987-10-01 |
Family
ID=30855676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986041043U Pending JPS62154641U (en) | 1986-03-20 | 1986-03-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62154641U (en) |
-
1986
- 1986-03-20 JP JP1986041043U patent/JPS62154641U/ja active Pending