JPS63106130U - - Google Patents
Info
- Publication number
- JPS63106130U JPS63106130U JP20008186U JP20008186U JPS63106130U JP S63106130 U JPS63106130 U JP S63106130U JP 20008186 U JP20008186 U JP 20008186U JP 20008186 U JP20008186 U JP 20008186U JP S63106130 U JPS63106130 U JP S63106130U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- metal particles
- back electrode
- utility
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002923 metal particle Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Description
第１図は、本考案に係る半導体素子の分割分離
前の断面図である。
５…裏面電極、６…金属粒子。
FIG. 1 is a cross-sectional view of a semiconductor device according to the present invention before division and separation. 5... Back electrode, 6... Metal particles.
Claims (1)
する半導体素子。 A semiconductor device characterized in that metal particles are attached on a back electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20008186U JPS63106130U (en) | 1986-12-26 | 1986-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20008186U JPS63106130U (en) | 1986-12-26 | 1986-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63106130U true JPS63106130U (en) | 1988-07-08 |
Family
ID=31162262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20008186U Pending JPS63106130U (en) | 1986-12-26 | 1986-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63106130U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006339354A (en) * | 2005-06-01 | 2006-12-14 | Tdk Corp | Semiconductor ic and its manufacturing method, module with built-in semiconductor ic and its manufacturing method |
-
1986
- 1986-12-26 JP JP20008186U patent/JPS63106130U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006339354A (en) * | 2005-06-01 | 2006-12-14 | Tdk Corp | Semiconductor ic and its manufacturing method, module with built-in semiconductor ic and its manufacturing method |