JPH0363937U - - Google Patents
Info
- Publication number
- JPH0363937U JPH0363937U JP12423089U JP12423089U JPH0363937U JP H0363937 U JPH0363937 U JP H0363937U JP 12423089 U JP12423089 U JP 12423089U JP 12423089 U JP12423089 U JP 12423089U JP H0363937 U JPH0363937 U JP H0363937U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafers
- cassette
- transfer
- boat
- hawk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 235000012431 wafers Nutrition 0.000 claims 6
Description
第１図はこの考案の一実施例を例示する斜視図
であり、第２図及び第３図はカセツト及びボンド
の具体例を示す斜視図である。
Ａ……カセツト、Ｂ……ボート、Ｃ……半導体
ウエーハ移替装置、１……半導体ウエーハ、１１
……移送機構、１２……スライドステージ、１３
……カセツト専用移替ホーク、１４……ボート専
用移替ホーク。
FIG. 1 is a perspective view illustrating an embodiment of this invention, and FIGS. 2 and 3 are perspective views illustrating specific examples of a cassette and a bond. A...Cassette, B...Boat, C...Semiconductor wafer transfer device, 1...Semiconductor wafer, 11
...Transfer mechanism, 12...Slide stage, 13
... Transfer hawk for cassettes, 14... Transfer hawk for boats.
Claims (1)
カセツトとボートとの間で移替ホークによつて半
導体ウエーハを載置して移し替えるものにおいて
、 カセツトからボートへ専用に半導体ウエーハを
載置して移し替えるカセツト専用移替ホークと、 ボートからカセツトへ専用に半導体ウエーハを
載置して移し替えるボート専用移替ホークとを各
々備えたことを特徴とする半導体ウエーハ移替装
置。[Claims for Utility Model Registration] In a device in which semiconductor wafers are placed and transferred between a boat and a cassette in which semiconductor wafers are arranged horizontally and maintained in alignment, a transfer fork is used to place and transfer semiconductor wafers from the cassette to the boat. A semiconductor wafer transfer device characterized by comprising a cassette-dedicated transfer hawk for loading and transferring semiconductor wafers, and a boat-dedicated transfer hawk for loading and transferring semiconductor wafers from a boat to a cassette. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12423089U JPH0363937U (en) | 1989-10-23 | 1989-10-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12423089U JPH0363937U (en) | 1989-10-23 | 1989-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0363937U true JPH0363937U (en) | 1991-06-21 |
Family
ID=31672162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12423089U Pending JPH0363937U (en) | 1989-10-23 | 1989-10-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0363937U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100317320B1 (en) * | 1999-05-24 | 2001-12-22 | 김영환 | device for handling wafer for CVD process in fabrication of semiconductor |
-
1989
- 1989-10-23 JP JP12423089U patent/JPH0363937U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100317320B1 (en) * | 1999-05-24 | 2001-12-22 | 김영환 | device for handling wafer for CVD process in fabrication of semiconductor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0363937U (en) | ||
| JPS63195734U (en) | ||
| JPH0180933U (en) | ||
| JPH0180934U (en) | ||
| JPS6355436U (en) | ||
| JPS63144953U (en) | ||
| JPS6441130U (en) | ||
| JPH0412647U (en) | ||
| JPH0332428U (en) | ||
| JPS62163951U (en) | ||
| JPS63137939U (en) | ||
| JPS6052625U (en) | Wafer transfer device | |
| JPS63170464U (en) | ||
| JPS59195741U (en) | Wafer transfer device | |
| JPH0436225U (en) | ||
| JPH01173940U (en) | ||
| JPH0412646U (en) | ||
| JPH03117835U (en) | ||
| JPS6219740U (en) | ||
| JPS60927U (en) | Semiconductor wafer pasting equipment | |
| JPH02116736U (en) | ||
| JPS63106141U (en) | ||
| JPS63194835U (en) | ||
| JPS6292646U (en) | ||
| JPH0390445U (en) |