JPS62163951U - - Google Patents

Info

Publication number
JPS62163951U
JPS62163951U JP5338886U JP5338886U JPS62163951U JP S62163951 U JPS62163951 U JP S62163951U JP 5338886 U JP5338886 U JP 5338886U JP 5338886 U JP5338886 U JP 5338886U JP S62163951 U JPS62163951 U JP S62163951U
Authority
JP
Japan
Prior art keywords
vehicle
smif pod
smif
semiconductor manufacturing
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5338886U
Other languages
Japanese (ja)
Other versions
JPH0249722Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5338886U priority Critical patent/JPH0249722Y2/ja
Priority to US07/018,993 priority patent/US4826360A/en
Priority to EP87301888A priority patent/EP0239266A3/en
Priority to CA000531391A priority patent/CA1271271A/en
Priority to KR870002102A priority patent/KR870009446A/en
Publication of JPS62163951U publication Critical patent/JPS62163951U/ja
Application granted granted Critical
Publication of JPH0249722Y2 publication Critical patent/JPH0249722Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Sheets, Magazines, And Separation Thereof (AREA)
  • Packaging Frangible Articles (AREA)
  • Warehouses Or Storage Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案の一実施例である半導体製造
装置への半導体ウエハ用カセツト装填機構を示す
要部のみを示した断面図、第2図は同実施例で使
用されビークル及びSMIFポツドを示す正断面
図、第3図は同ビークルを示す斜視図、第4図は
この考案の一実施例であるカセツト装填機構の作
用を説明する図、第5図は第4図と同様の図、第
6図はこの考案の一実施例で使用された半導体ウ
エハ自動移送システムの概要を示す平面図、第7
図は同要部のみを示す斜視図、第8図はSMIF
システムが適用されたクリーンルームを示す斜視
図、第9図はこの考案の実施例に用いられるSM
IFポツドを示す断面図である。 1……半導体製造装置、4……SMIFアーム
、6……半導体ウエハ用カセツト、8……SMI
Fポツド、9……ケース本体、10……底板、1
1……ビークル、16……支持手段、22……脱
着手段。
Fig. 1 is a sectional view showing only the main parts of a mechanism for loading semiconductor wafer cassettes into semiconductor manufacturing equipment, which is an embodiment of this invention, and Fig. 2 shows a vehicle and an SMIF pod used in the same embodiment. 3 is a perspective view showing the same vehicle, FIG. 4 is a diagram illustrating the operation of the cassette loading mechanism which is an embodiment of this invention, FIG. 5 is a view similar to FIG. 4, and FIG. Figure 6 is a plan view showing an overview of the semiconductor wafer automatic transfer system used in one embodiment of this invention;
The figure is a perspective view showing only the main parts, and Figure 8 is the SMIF
A perspective view showing a clean room to which the system is applied, FIG. 9 is an SM used in an embodiment of this invention.
FIG. 3 is a sectional view showing the IF pot. 1... Semiconductor manufacturing equipment, 4... SMIF arm, 6... Semiconductor wafer cassette, 8... SMI
F pot, 9...Case body, 10...Bottom plate, 1
1... Vehicle, 16... Support means, 22... Detachment means.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 箱状のケース本体及び着脱自在な底板から構成
され、前記底板上に半導体ウエハ用カセツトが収
納されたSMIFポツドと、このSMIFポツド
を内部に着脱自在に収納した状態で半導体製造装
置間を移動するビークルと、該ビークル及び前記
半導体製造装置の間での半導体ウエハ用カセツト
の受け渡しを行うSMIFアームとを備え、かつ
前記ビークルには、前記SMIFポツドを着脱自
在に支持する支持手段が設けられ、さらに前記S
MIFアームには、前記ビークルが載置される装
着部と、このビークルの載置、取り外しに従つて
ビークルからのSMIFポツドの脱着を行う脱着
手段とが設けられていることを特徴とする半導体
製造装置への半導体ウエハ用カセツト装填機構。
The SMIF pod consists of a box-shaped case body and a removable bottom plate, and a cassette for semiconductor wafers is stored on the bottom plate, and the SMIF pod is moved between semiconductor manufacturing equipment with the SMIF pod removably stored inside. comprising a vehicle and an SMIF arm for transferring semiconductor wafer cassettes between the vehicle and the semiconductor manufacturing equipment, and the vehicle is provided with support means for removably supporting the SMIF pod, and further Said S
Semiconductor manufacturing characterized in that the MIF arm is provided with a mounting section on which the vehicle is placed, and a detaching means for attaching and detaching the SMIF pod from the vehicle in accordance with the placement and removal of the vehicle. A cassette loading mechanism for semiconductor wafers into the equipment.
JP5338886U 1986-03-10 1986-04-09 Expired JPH0249722Y2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP5338886U JPH0249722Y2 (en) 1986-04-09 1986-04-09
US07/018,993 US4826360A (en) 1986-03-10 1987-02-25 Transfer system in a clean room
EP87301888A EP0239266A3 (en) 1986-03-10 1987-03-04 Transfer system in a clean room
CA000531391A CA1271271A (en) 1986-03-10 1987-03-06 Semiconductor wafer transport system in a clean room
KR870002102A KR870009446A (en) 1986-03-10 1987-03-09 Transport system in clean room

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5338886U JPH0249722Y2 (en) 1986-04-09 1986-04-09

Publications (2)

Publication Number Publication Date
JPS62163951U true JPS62163951U (en) 1987-10-17
JPH0249722Y2 JPH0249722Y2 (en) 1990-12-27

Family

ID=30879406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5338886U Expired JPH0249722Y2 (en) 1986-03-10 1986-04-09

Country Status (1)

Country Link
JP (1) JPH0249722Y2 (en)

Also Published As

Publication number Publication date
JPH0249722Y2 (en) 1990-12-27

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