JPS63102236U

JPS63102236U -

Info

Publication number: JPS63102236U
Application number: JP19816186U
Authority: JP
Priority date: 1986-12-23
Filing date: 1986-12-23
Publication date: 1988-07-02

Description

[Brief explanation of drawings]

第１図〜第１０図は本考案の実施例を示すもの
であつて、第１図は半導体ウエハ移換え装置の正
面図、第２図はカムの運動を説明するための第１
図の部分拡大図、第３図は半導体ウエハ支持具の
斜視図、第４図ａ，ｂ，ｃ，ｄ，ｅ及びｆは半導
体ウエハをキヤリアカセツトからカートリツジに
移換える手順を示す断面図、第５図は半導体ウエ
ハを収容したキヤリアカセツトを示し、同図ａは
平面図、同図ｂは正面図、第６図は半導体ウエハ
を収容したカートリツジを示し、同図ａは平面図
、同図ｂは正面図、第７図は半導体ウエハをキヤ
リアカセツトからカートリツジに移換え、ＣＶＤ
装置に装入する手順を示す概略平面図、第８図ａ
，ｂ，ｃ及びｄは半導体ウエハ移換えの他の手順
を示す概略平面図、第９図は第８図ａの概略部分
斜視図、第１０図は他の半導体ウエハ移換え装置
の要部正面図である。第１１図は市販のキヤリア
カセツトの部分斜視図である。第１２図は一般の
カートリツジの斜視図である。なお図面に示された符号において、１……カー
トリツジ、１ａ……支柱、１ｂ……補助柱、１ｅ
，２ｅ，４３ａ，４４ａ……溝、１ｆ，２ｃ……
突部、１ｇ，２ｄ……開口部、２，２_２……キヤ
リアカセツト、３……半導体ウエハ移換え装置、
４……平板、１３，１４……カム、１６……半導
体ウエハ、４３，４４……アーム、ｄ_１，ｄ_２…
…溝の幅、Ｐ……溝のピツチである。 1 to 10 show an embodiment of the present invention, in which FIG. 1 is a front view of a semiconductor wafer transfer device, and FIG. 2 is a first diagram showing the movement of the cam.
3 is a perspective view of the semiconductor wafer support; FIGS. 4 a, b, c, d, e, and f are sectional views showing the procedure for transferring semiconductor wafers from the carrier cassette to the cartridge; FIG. Figure 5 shows a carrier cassette containing semiconductor wafers, Figure a is a plan view, Figure b is a front view, and Figure 6 shows a cartridge housing semiconductor wafers, Figure a is a plan view and Figure b is a front view. is a front view, and Figure 7 shows the transfer of semiconductor wafers from the carrier cassette to the cartridge, and the CVD process.
Schematic plan view showing the procedure for loading the device, FIG. 8a
, b, c, and d are schematic plan views showing other steps of semiconductor wafer transfer, FIG. 9 is a schematic partial perspective view of FIG. It is a diagram. FIG. 11 is a partial perspective view of a commercially available carrier cassette. FIG. 12 is a perspective view of a general cartridge. In addition, in the symbols shown in the drawings, 1...cartridge, 1a...support column, 1b...auxiliary column, 1e
, 2e, 43a, 44a... groove, 1f, 2c...
Projection, 1g, 2d... Opening, 2, 2 ₂ ... Carrier cassette, 3... Semiconductor wafer transfer device,
4... Flat plate, 13, 14... Cam, 16... Semiconductor wafer, 43, 44... Arm, d ₁ , d ₂ ...
...Width of the groove, P...Pitch of the groove.

Claims

[Scope of utility model registration request]

between a first accommodating part and a second accommodating part each having a space for inserting or taking out a plate-shaped semiconductor;
A plate-shaped semiconductor transfer device that takes out the plate-shaped semiconductor housed in the first housing part and then inserts and houses the plate-shaped semiconductor in the second housing part, wherein the plate-shaped semiconductor is It has a supporting member for supporting, and a position changing means for changing the position of the supporting member in a direction perpendicular to the surface of the plate-shaped semiconductor, and the supporting member is moved in the first accommodating part and in the second accommodating part. A plate-shaped semiconductor transfer device, wherein the position changing means is provided with means for varying the distance of the position change.