JPH0412646U - - Google Patents
Info
- Publication number
- JPH0412646U JPH0412646U JP5345790U JP5345790U JPH0412646U JP H0412646 U JPH0412646 U JP H0412646U JP 5345790 U JP5345790 U JP 5345790U JP 5345790 U JP5345790 U JP 5345790U JP H0412646 U JPH0412646 U JP H0412646U
- Authority
- JP
- Japan
- Prior art keywords
- chuck
- wafer
- holder
- arm
- transport
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 210000000078 claw Anatomy 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 230000032258 transport Effects 0.000 claims 5
- 230000007723 transport mechanism Effects 0.000 claims 1
- 238000001514 detection method Methods 0.000 description 1
Description
第１図ａ，ｂは本考案の一実施例の外観図及び
そのＡ−Ａ断面図、第２図は従来の半導体製造装
置の外観図である。
１……ホルダー、２……ステージ、３……プリ
アライメント用爪、４……搬送用チヤツク、４ａ
……受け渡し用ベース、５……ウエーハ、６……
アーム、７……アーム用レール、８……搬送用ベ
ース、９……ベース用レール、１０……ローダー
、１１……ホルダー、１２……ステージ、１３…
…搬送アーム、１４……ウエーハ、１５……搬送
アーム用レール、１６……プリアライメント用爪
、１７……チヤツク、１８……ＯＦ感知センサー
、１９……搬送用ベルト、２０……ローダー。
1A and 1B are an external view of an embodiment of the present invention and a sectional view taken along the line AA, and FIG. 2 is an external view of a conventional semiconductor manufacturing apparatus. 1...Holder, 2...Stage, 3...Pre-alignment claw, 4...Transportation chuck, 4a
...Base for delivery, 5...Wafer, 6...
Arm, 7... Arm rail, 8... Transfer base, 9... Base rail, 10... Loader, 11... Holder, 12... Stage, 13...
...transport arm, 14...wafer, 15...transfer arm rail, 16...prealignment claw, 17...chuck, 18...OF detection sensor, 19...transport belt, 20...loader.
Claims (1)
を吸着する搬送用チヤツクと、このチヤツクを搬
送アーム位置まで移送するレールと、移送されて
きたチヤツクを受け取る搬送アームと、このアー
ムをウエーハホルダーに移送するレールと、ウエ
ーハホルダーに移送されたチヤツクを固定する受
け渡し用ベースと、搬送アーム及び受け渡し用ベ
ースがチヤツクから離れた後チヤツクを下げてウ
エーハをホルダーに残し、ホルダー上でウエーハ
のプリアライメントを行なう爪とを有するウエー
ハ搬送機構を備えたことを特徴とする半導体製造
装置。 A transport chuck that sucks the back side of the wafer set in the loader, a rail that transports this chuck to the transport arm position, a transport arm that receives the transferred chuck, and a rail that transports this arm to the wafer holder. a transfer base that fixes the chuck transferred to the wafer holder; and a claw that lowers the chuck to leave the wafer in the holder after the transfer arm and the transfer base are separated from the chuck, and performs pre-alignment of the wafer on the holder. A semiconductor manufacturing device characterized by comprising a wafer transport mechanism having the following features.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5345790U JPH0412646U (en) | 1990-05-22 | 1990-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5345790U JPH0412646U (en) | 1990-05-22 | 1990-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0412646U true JPH0412646U (en) | 1992-01-31 |
Family
ID=31574658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5345790U Pending JPH0412646U (en) | 1990-05-22 | 1990-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0412646U (en) |
-
1990
- 1990-05-22 JP JP5345790U patent/JPH0412646U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5845360U (en) | Substrate attachment/detachment device | |
| JPH0412646U (en) | ||
| JPS63177035U (en) | ||
| JPS6389242U (en) | ||
| JPH0363937U (en) | ||
| JPH0366929U (en) | ||
| JPS6117742U (en) | semiconductor manufacturing equipment | |
| JPS63178331U (en) | ||
| JPH0284332U (en) | ||
| JPH0328735U (en) | ||
| JPS63170464U (en) | ||
| JPH0412647U (en) | ||
| JPH03117835U (en) | ||
| JPH0265341U (en) | ||
| JPH01156549U (en) | ||
| JPH042036U (en) | ||
| JPS63133545U (en) | ||
| JPS63200326U (en) | ||
| JPH042035U (en) | ||
| JPH02137348U (en) | ||
| JPH0317622U (en) | ||
| JPH0282026U (en) | ||
| JPS60927U (en) | Semiconductor wafer pasting equipment | |
| JPS6346846U (en) | ||
| JPS5840341U (en) | Wafer adsorption device |