JPH01156549U - - Google Patents

Info

Publication number
JPH01156549U
JPH01156549U JP5240988U JP5240988U JPH01156549U JP H01156549 U JPH01156549 U JP H01156549U JP 5240988 U JP5240988 U JP 5240988U JP 5240988 U JP5240988 U JP 5240988U JP H01156549 U JPH01156549 U JP H01156549U
Authority
JP
Japan
Prior art keywords
wafer
suction
exposure
suctions
contracted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5240988U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5240988U priority Critical patent/JPH01156549U/ja
Publication of JPH01156549U publication Critical patent/JPH01156549U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例を示す断面図、第2
図は第1図における吸着装置の下降時を示す断面
図、第3図は従来の露光装置用ウエハ吸着装置を
示す断面図、第4図は第3図における吸着装置の
下降時を示す断面図である。 1……Siウエハ、2……オートハンド、3…
…取付金具、4……吸着パツト、5……吸着口、
6……フオトレジスト面、7……擦り傷。
Fig. 1 is a sectional view showing one embodiment of the present invention;
The figure is a cross-sectional view showing the suction device in FIG. 1 when it is lowered, FIG. 3 is a cross-sectional view showing a conventional wafer suction device for exposure equipment, and FIG. 4 is a cross-sectional view showing the suction device in FIG. 3 when it is lowered. It is. 1...Si wafer, 2...auto hand, 3...
...Mounting bracket, 4...Suction part, 5...Suction port,
6... Photoresist surface, 7... Scratches.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ウエハ露光装置において、ウエハをプリ
アライメントステージから露光部ウエハチヤツク
上に吸着搬送するオートハンドに、ウエハに対し
て垂直方向に収縮可能な吸着パツトを取付けたこ
とを特徴とする露光装置用ウエハ吸着装置。
A wafer suction device for a semiconductor wafer exposure device, characterized in that a suction pad that can be contracted in a direction perpendicular to the wafer is attached to an automatic hand that suctions and transfers the wafer from a pre-alignment stage onto a wafer chuck in an exposure section. .
JP5240988U 1988-04-19 1988-04-19 Pending JPH01156549U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5240988U JPH01156549U (en) 1988-04-19 1988-04-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5240988U JPH01156549U (en) 1988-04-19 1988-04-19

Publications (1)

Publication Number Publication Date
JPH01156549U true JPH01156549U (en) 1989-10-27

Family

ID=31278407

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5240988U Pending JPH01156549U (en) 1988-04-19 1988-04-19

Country Status (1)

Country Link
JP (1) JPH01156549U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04290455A (en) * 1991-03-19 1992-10-15 Hitachi Electron Eng Co Ltd Wafer prealignment system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04290455A (en) * 1991-03-19 1992-10-15 Hitachi Electron Eng Co Ltd Wafer prealignment system

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