JPH0282026U - - Google Patents
Info
- Publication number
- JPH0282026U JPH0282026U JP16207888U JP16207888U JPH0282026U JP H0282026 U JPH0282026 U JP H0282026U JP 16207888 U JP16207888 U JP 16207888U JP 16207888 U JP16207888 U JP 16207888U JP H0282026 U JPH0282026 U JP H0282026U
- Authority
- JP
- Japan
- Prior art keywords
- exposure
- post
- projection exposure
- projection
- exposure apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims 6
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000000206 photolithography Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 1
Description
第１図は本考案の実施例１を示す装置構成図、
第２図は本考案の実施例２を示す装置構成図であ
る。
１……被処理ウエーハ、２……投影露光部、３
……焼きしめ部、４……ウエーハ搬送部、５……
ローダー側カセツト、６……レシーバー側カセツ
ト、７……ウエーハの動き、８……焼きしめ部内
ウエーハ搬送機構、９……排気ダクト。
FIG. 1 is an apparatus configuration diagram showing Embodiment 1 of the present invention;
FIG. 2 is an apparatus configuration diagram showing a second embodiment of the present invention. 1... Wafer to be processed, 2... Projection exposure section, 3
...Baking section, 4...Wafer transport section, 5...
Loader side cassette, 6...Receiver side cassette, 7...Wafer movement, 8...Wafer transport mechanism in the baking section, 9...Exhaust duct.
Claims (1)
る投影露光装置において、露光後ベーク処理を行
う焼きしめ部を投影露光部に隣接して有し、露光
処理終了時点から露光後ベーク処理開始までの時
間を一定時間にして搬送し露光処理から露光後ベ
ーク処理を連続して行うことを特徴とする投影露
光装置。 A projection exposure apparatus used in the photolithography process of semiconductor device manufacturing has a printing section adjacent to the projection exposure section that performs a post-exposure bake process, and the time from the end of the exposure process to the start of the post-exposure bake process is constant. 1. A projection exposure apparatus characterized in that the projection exposure apparatus is transported in time and continuously performs an exposure process and a post-exposure bake process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16207888U JPH0282026U (en) | 1988-12-14 | 1988-12-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16207888U JPH0282026U (en) | 1988-12-14 | 1988-12-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0282026U true JPH0282026U (en) | 1990-06-25 |
Family
ID=31445582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16207888U Pending JPH0282026U (en) | 1988-12-14 | 1988-12-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0282026U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7060115B2 (en) | 2000-07-24 | 2006-06-13 | Tokyo Electron Limited | Substrate processing method, substrate processing apparatus and substrate carrying method |
| JP2008147315A (en) * | 2006-12-07 | 2008-06-26 | Canon Inc | Exposure device, exposure/development system, and method of manufacturing device |
-
1988
- 1988-12-14 JP JP16207888U patent/JPH0282026U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7060115B2 (en) | 2000-07-24 | 2006-06-13 | Tokyo Electron Limited | Substrate processing method, substrate processing apparatus and substrate carrying method |
| JP2008147315A (en) * | 2006-12-07 | 2008-06-26 | Canon Inc | Exposure device, exposure/development system, and method of manufacturing device |