JPH042019U - - Google Patents
Info
- Publication number
- JPH042019U JPH042019U JP4194590U JP4194590U JPH042019U JP H042019 U JPH042019 U JP H042019U JP 4194590 U JP4194590 U JP 4194590U JP 4194590 U JP4194590 U JP 4194590U JP H042019 U JPH042019 U JP H042019U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- semiconductor wafers
- plate
- cool plate
- bake
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 229920002120 photoresistant polymer Polymers 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 claims 7
- 230000002093 peripheral effect Effects 0.000 description 1
Description
第１図、第２図はそれぞれ本考案実施例による
プリベーク装置の概要構成を示す側面図、および
平面図である。図において、
１……プリベーク装置、２……半導体ウエーハ
、２ａ……フオトレジスト、３……ホツトプレー
ト、４……クールプレート、５……ウエーハ周辺
露光装置。
FIGS. 1 and 2 are a side view and a plan view, respectively, showing the general structure of a pre-bake apparatus according to an embodiment of the present invention. In the figure, 1... prebake device, 2... semiconductor wafer, 2a... photoresist, 3... hot plate, 4... cool plate, 5... wafer peripheral exposure device.
Claims (1)
ールプレートを配備し、前段工程でフオトレジス
トを塗布した半導体ウエーハをホツトプレート、
クールプレートの順に通過させて熱処理する半導
体ウエーハのプリベーク装置において、クールプ
レートと対応する位置に、ウエーハ外周縁部のレ
ジスト層に光を照射するウエーハ周辺露光装置を
一体に組み込んで構成したことを特徴とする半導
体ウエーハのプリベーク装置。 A hot plate and a cool plate are installed along the wafer transport path, and the semiconductor wafer coated with photoresist in the previous step is transferred to the hot plate,
A pre-bake device for semiconductor wafers that heat-processes semiconductor wafers by passing them through a cool plate in order, and is characterized by a wafer periphery exposure device that irradiates light onto a resist layer at the outer periphery of the wafer at a position corresponding to the cool plate. Pre-bake equipment for semiconductor wafers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4194590U JPH042019U (en) | 1990-04-19 | 1990-04-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4194590U JPH042019U (en) | 1990-04-19 | 1990-04-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH042019U true JPH042019U (en) | 1992-01-09 |
Family
ID=31553051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4194590U Pending JPH042019U (en) | 1990-04-19 | 1990-04-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH042019U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014067833A (en) * | 2012-09-25 | 2014-04-17 | Tokyo Electron Ltd | Substrate processing apparatus |
-
1990
- 1990-04-19 JP JP4194590U patent/JPH042019U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014067833A (en) * | 2012-09-25 | 2014-04-17 | Tokyo Electron Ltd | Substrate processing apparatus |
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