JPH0296727U - - Google Patents
Info
- Publication number
- JPH0296727U JPH0296727U JP597589U JP597589U JPH0296727U JP H0296727 U JPH0296727 U JP H0296727U JP 597589 U JP597589 U JP 597589U JP 597589 U JP597589 U JP 597589U JP H0296727 U JPH0296727 U JP H0296727U
- Authority
- JP
- Japan
- Prior art keywords
- boat
- tube
- heat treatment
- semiconductor devices
- upright
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Description
第１図は本考案の半導体装置の熱処理装置の実
施例を示す側面図、第２図は第１図の本実施例装
置の断面図、第３図は本実施例によつて得られた
ボートの長さ方向の温度分布図、第４図は本実施
例と従来例とを比較して示すボートの長さ方向の
酸化膜厚図、第５図は従来装置を示す側面図であ
る。
１……チユーブ、２……炉口側、３……半導体
ウエハ、４……ボート、５……バツフアー板、６
……隙間、７……熱電対、８……切り込み。
FIG. 1 is a side view showing an embodiment of the heat treatment apparatus for semiconductor devices of the present invention, FIG. 2 is a sectional view of the apparatus of the embodiment shown in FIG. 1, and FIG. 3 is a boat obtained by this embodiment. FIG. 4 is a diagram showing the temperature distribution in the longitudinal direction of the boat, FIG. 4 is a diagram showing the oxide film thickness in the longitudinal direction of the boat, comparing the present embodiment with the conventional example, and FIG. 5 is a side view showing the conventional device. 1...Tube, 2...Furnace mouth side, 3...Semiconductor wafer, 4...Boat, 5...Buffer plate, 6
...Gap, 7...Thermocouple, 8...Notch.
Claims (1)
立状態に載置するボートとから成る半導体装置の
熱処理装置において、上記ボートの炉口側に直立
状態に載置されるバツフアー板を具備したことを
特徴とする半導体装置の熱処理装置。 A heat treatment apparatus for semiconductor devices comprising a tube and a boat on which semiconductor wafers are placed upright in the tube, characterized by comprising a buffer plate placed on the furnace mouth side of the boat in an upright position. Heat treatment equipment for semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP597589U JPH0296727U (en) | 1989-01-20 | 1989-01-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP597589U JPH0296727U (en) | 1989-01-20 | 1989-01-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0296727U true JPH0296727U (en) | 1990-08-01 |
Family
ID=31209817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP597589U Pending JPH0296727U (en) | 1989-01-20 | 1989-01-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0296727U (en) |
-
1989
- 1989-01-20 JP JP597589U patent/JPH0296727U/ja active Pending