JPH0265333U - - Google Patents
Info
- Publication number
- JPH0265333U JPH0265333U JP14489288U JP14489288U JPH0265333U JP H0265333 U JPH0265333 U JP H0265333U JP 14489288 U JP14489288 U JP 14489288U JP 14489288 U JP14489288 U JP 14489288U JP H0265333 U JPH0265333 U JP H0265333U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- resist coating
- coating apparatus
- chuck
- rotating shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 5
Landscapes
- Coating Apparatus (AREA)
Description
第1図は本考案の実施例を示す図、第2図は本
考案の実施例の作用を説明するための図、第3図
は従来のレジスト塗布装置を示す図、第4図は従
来のレジスト塗布装置でウエハー上に塗布したレ
ジストの形状を示す図である。
図において、10はチヤツク、10aは吸着面
、11は真空吸引用の孔、12は回転軸、13は
段差部、14はウエハー、15はレジスト、16
はオリエンテーシヨンフラツトを示す。
Fig. 1 is a diagram showing an embodiment of the present invention, Fig. 2 is a diagram for explaining the operation of the embodiment of the present invention, Fig. 3 is a diagram showing a conventional resist coating device, and Fig. 4 is a diagram showing a conventional resist coating device. FIG. 3 is a diagram showing the shape of a resist coated on a wafer by a resist coating device. In the figure, 10 is a chuck, 10a is a suction surface, 11 is a hole for vacuum suction, 12 is a rotating shaft, 13 is a stepped portion, 14 is a wafer, 15 is a resist, 16
indicates an orientation flat.
Claims (1)
着面に対し垂直に設けられた回転軸12により回
転するチヤツク10を少なくとも具備したレジス
ト塗布装置において、 上記チヤツク10にウエハー14のオリエンテ
ーシヨンフラツト16に当接し、且つウエハー1
4の厚さと等しい高さの段差部13を設けたこと
を特徴とするレジスト塗布装置。[Scope of Claim for Utility Model Registration] A resist coating apparatus comprising at least a chuck 10 which attracts and holds a wafer 14 using a vacuum and rotates by a rotating shaft 12 provided perpendicularly to the suction surface of the resist coating apparatus. The wafer 1 is in contact with the orientation flat 16 of the wafer 1.
4. A resist coating device characterized in that a step portion 13 having a height equal to the thickness of No. 4 is provided.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14489288U JPH0632673Y2 (en) | 1988-11-08 | 1988-11-08 | Resist coating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14489288U JPH0632673Y2 (en) | 1988-11-08 | 1988-11-08 | Resist coating device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0265333U true JPH0265333U (en) | 1990-05-16 |
JPH0632673Y2 JPH0632673Y2 (en) | 1994-08-24 |
Family
ID=31413000
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14489288U Expired - Lifetime JPH0632673Y2 (en) | 1988-11-08 | 1988-11-08 | Resist coating device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0632673Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05283511A (en) * | 1992-03-31 | 1993-10-29 | Nippon Telegr & Teleph Corp <Ntt> | Vacuum suction device |
-
1988
- 1988-11-08 JP JP14489288U patent/JPH0632673Y2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05283511A (en) * | 1992-03-31 | 1993-10-29 | Nippon Telegr & Teleph Corp <Ntt> | Vacuum suction device |
Also Published As
Publication number | Publication date |
---|---|
JPH0632673Y2 (en) | 1994-08-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0265333U (en) | ||
JPH02118926U (en) | ||
JPH02104984U (en) | ||
JPH03128943U (en) | ||
JPH02135140U (en) | ||
JPS59173341U (en) | Rotary coating device | |
JPH02125326U (en) | ||
JPH044055U (en) | ||
JPH0229520U (en) | ||
JPS6144831U (en) | Wafer drying equipment | |
JPH0373436U (en) | ||
JPS6379646U (en) | ||
JPH0243194U (en) | ||
JPS62126829U (en) | ||
JPH0312440U (en) | ||
JPS63159837U (en) | ||
JPH024733U (en) | ||
JPH0221734U (en) | ||
JPH0161975U (en) | ||
JPS58132573U (en) | Rotary coating device | |
JPS63100825U (en) | ||
JPH0256442U (en) | ||
JPH0212485U (en) | ||
JPS60192445U (en) | wafer chuck | |
JPS6377344U (en) |