JPH0229520U - - Google Patents

Info

Publication number
JPH0229520U
JPH0229520U JP10851788U JP10851788U JPH0229520U JP H0229520 U JPH0229520 U JP H0229520U JP 10851788 U JP10851788 U JP 10851788U JP 10851788 U JP10851788 U JP 10851788U JP H0229520 U JPH0229520 U JP H0229520U
Authority
JP
Japan
Prior art keywords
hot plate
wafer
oven
plate oven
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10851788U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10851788U priority Critical patent/JPH0229520U/ja
Publication of JPH0229520U publication Critical patent/JPH0229520U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案のホツトプレートオーブンの一
実施例でホツトプレート上にウエーハを載置した
断面図、第2図と第3図は従来のホツトプレート
オーブンのホツトプレート上にウエーハを載置し
た断面図である。 1…ウエーハ、2a,2b…搬送用レール、3
…ホツトプレート、5…バキユーム穴、7a〜7
n…溝。
Figure 1 is a cross-sectional view of an embodiment of the hot plate oven of the present invention, with a wafer placed on the hot plate, and Figures 2 and 3 are cross-sectional views of a conventional hot plate oven with a wafer placed on the hot plate. FIG. 1... Wafer, 2a, 2b... Transport rail, 3
...Hot plate, 5...Vacuum hole, 7a-7
n...Groove.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ウエーハをホツトプレートオーブンの所定の位
置まで搬送用レールで搬送し、ホツトプレートに
形成されたバキユーム穴でウエーハを吸引し、ウ
エーハをホツトプレートに密着固定し、所定の処
理を行うホツトプレートオーブンにおいて、前記
ホツトプレートの表面に、ウエーハとの接触面積
減少用の溝を形成したことを特徴とするホツトプ
レートオーブン。
In the hot plate oven, the wafer is transported to a predetermined position in the hot plate oven using a transport rail, the wafer is sucked through a vacuum hole formed in the hot plate, the wafer is closely fixed to the hot plate, and a predetermined process is performed. A hot plate oven characterized in that a groove for reducing a contact area with a wafer is formed on the surface of the hot plate.
JP10851788U 1988-08-17 1988-08-17 Pending JPH0229520U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10851788U JPH0229520U (en) 1988-08-17 1988-08-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10851788U JPH0229520U (en) 1988-08-17 1988-08-17

Publications (1)

Publication Number Publication Date
JPH0229520U true JPH0229520U (en) 1990-02-26

Family

ID=31343927

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10851788U Pending JPH0229520U (en) 1988-08-17 1988-08-17

Country Status (1)

Country Link
JP (1) JPH0229520U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03128221U (en) * 1990-03-30 1991-12-24

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03128221U (en) * 1990-03-30 1991-12-24

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