JPH0198159U - - Google Patents
Info
- Publication number
- JPH0198159U JPH0198159U JP19211887U JP19211887U JPH0198159U JP H0198159 U JPH0198159 U JP H0198159U JP 19211887 U JP19211887 U JP 19211887U JP 19211887 U JP19211887 U JP 19211887U JP H0198159 U JPH0198159 U JP H0198159U
- Authority
- JP
- Japan
- Prior art keywords
- comes
- vacuum
- groove
- sputtering
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005477 sputtering target Methods 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
- 239000013077 target material Substances 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Description
第1図は本考案の第1の実施例の断面図、第2
図は本考案の第2の実施例の断面図、第3図は従
来のスパツタリング用ターゲツトの断面図である
。
1,2……ターゲツト材、1′……裏板部、3
,4……裏板。
Fig. 1 is a sectional view of the first embodiment of the present invention;
The figure is a sectional view of a second embodiment of the present invention, and FIG. 3 is a sectional view of a conventional sputtering target. 1, 2...Target material, 1'...Back plate part, 3
, 4...back board.
Claims (1)
ツタリングする際に使用する金属ターゲツトにお
いて、冷却系に接触する面に溝加工を施したこと
を特徴とするスパツタリング用ターゲツト。 A sputtering target for use in sputtering metal in a vacuum or gas atmosphere, characterized in that a groove is formed on the surface that comes into contact with a cooling system.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19211887U JPH0198159U (en) | 1987-12-18 | 1987-12-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19211887U JPH0198159U (en) | 1987-12-18 | 1987-12-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0198159U true JPH0198159U (en) | 1989-06-30 |
Family
ID=31482991
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19211887U Pending JPH0198159U (en) | 1987-12-18 | 1987-12-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0198159U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006503984A (en) * | 2002-10-24 | 2006-02-02 | ハネウエル・インターナシヨナル・インコーポレーテツド | Target design and related methods for improving cooling capacity and reducing deflection and deformation |
-
1987
- 1987-12-18 JP JP19211887U patent/JPH0198159U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006503984A (en) * | 2002-10-24 | 2006-02-02 | ハネウエル・インターナシヨナル・インコーポレーテツド | Target design and related methods for improving cooling capacity and reducing deflection and deformation |
JP2011052325A (en) * | 2002-10-24 | 2011-03-17 | Honeywell Internatl Inc | Target design and related method for enhanced cooling and reduced deflection and deformation |
JP2014051746A (en) * | 2002-10-24 | 2014-03-20 | Honeywell Internatl Inc | Design of target capable of increasing cooling capability and decreasing deflection and deformation and related methods for the same |