JPS63105334U - - Google Patents
Info
- Publication number
- JPS63105334U JPS63105334U JP19972086U JP19972086U JPS63105334U JP S63105334 U JPS63105334 U JP S63105334U JP 19972086 U JP19972086 U JP 19972086U JP 19972086 U JP19972086 U JP 19972086U JP S63105334 U JPS63105334 U JP S63105334U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- conversion mechanism
- pitch conversion
- transfer means
- mechanism section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 238000006243 chemical reaction Methods 0.000 claims description 8
- 235000012431 wafers Nutrition 0.000 claims 7
- 239000011295 pitch Substances 0.000 claims 5
- 238000010586 diagram Methods 0.000 description 4
Description
第1図は本考案の一実施例に係る移替機の全体
を示す概略構成図、第2a図〜第2f図は同移替
機の動作を順次説明する説明図、第3図はピツチ
変換機構部の概略部分説明図、第4a図はピツチ
変換機構部のシヤフトが上昇した状態の要部断面
図、第4b図はピツチ変換機構部のシヤフトが下
降した状態の要部断面図、第5図は従来例の概略
構成図である。
1A,1B……半導体ウエハ保持部、2……半
導体ウエハ、4……ピツチ変換機構部、6……第
一の移行手段、7……第二の移行手段。
Fig. 1 is a schematic configuration diagram showing the entire transfer machine according to an embodiment of the present invention, Figs. 2a to 2f are explanatory diagrams sequentially explaining the operation of the transfer machine, and Fig. 3 is pitch conversion. A schematic partial explanatory diagram of the mechanism section, Fig. 4a is a sectional view of the main part of the pitch conversion mechanism section with the shaft raised, Fig. 4b is a sectional view of the main part of the pitch conversion mechanism section with the shaft lowered, and Fig. 5 The figure is a schematic configuration diagram of a conventional example. 1A, 1B...Semiconductor wafer holding section, 2...Semiconductor wafer, 4...Pitch conversion mechanism section, 6...First transfer means, 7...Second transfer means.
Claims (1)
体ウエハ保持部の間にピツチ変換機構部を設け、
いずれか一方の半導体ウエハ保持部に保持させた
半導体ウエハをピツチ変換機構部に移行させる第
一の移行手段と、ピツチ変換機構部に移行された
半導体ウエハを他方の半導体ウエハ保持部に移行
させる第二の移行手段を設けたことを特徴とする
ピツチ変換機構付き半導体ウエハ移替機。 A pitch conversion mechanism section is provided between both semiconductor wafer holding sections that hold semiconductor wafers at different pitches,
A first transfer means for transferring a semiconductor wafer held by one of the semiconductor wafer holding sections to the pitch conversion mechanism section; and a first transfer means for transferring the semiconductor wafer transferred to the pitch conversion mechanism section to the other semiconductor wafer holding section. A semiconductor wafer transfer machine with a pitch conversion mechanism, characterized in that it is provided with two transfer means.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19972086U JPS63105334U (en) | 1986-12-25 | 1986-12-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19972086U JPS63105334U (en) | 1986-12-25 | 1986-12-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63105334U true JPS63105334U (en) | 1988-07-08 |
Family
ID=31161607
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19972086U Pending JPS63105334U (en) | 1986-12-25 | 1986-12-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63105334U (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0228949A (en) * | 1988-07-19 | 1990-01-31 | Tel Sagami Ltd | Pitch converting method for planar body |
JPH0528041U (en) * | 1991-09-20 | 1993-04-09 | 東京応化工業株式会社 | Wafer transfer mechanism for vertical wafer processing equipment |
KR101108073B1 (en) | 2009-04-20 | 2012-01-31 | 코리아테크노(주) | Wafer distributing apparatus for having double stage and method of distributing the same |
KR101108075B1 (en) | 2009-04-20 | 2012-01-31 | 코리아테크노(주) | Wafer dumping module for having double stage apparatus |
JP2020061400A (en) * | 2018-10-05 | 2020-04-16 | 川崎重工業株式会社 | Substrate holding device |
-
1986
- 1986-12-25 JP JP19972086U patent/JPS63105334U/ja active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0228949A (en) * | 1988-07-19 | 1990-01-31 | Tel Sagami Ltd | Pitch converting method for planar body |
JPH0528041U (en) * | 1991-09-20 | 1993-04-09 | 東京応化工業株式会社 | Wafer transfer mechanism for vertical wafer processing equipment |
KR101108073B1 (en) | 2009-04-20 | 2012-01-31 | 코리아테크노(주) | Wafer distributing apparatus for having double stage and method of distributing the same |
KR101108075B1 (en) | 2009-04-20 | 2012-01-31 | 코리아테크노(주) | Wafer dumping module for having double stage apparatus |
JP2020061400A (en) * | 2018-10-05 | 2020-04-16 | 川崎重工業株式会社 | Substrate holding device |