KR101108073B1 - Wafer distributing apparatus for having double stage and method of distributing the same - Google Patents

Abstract

The present invention provides a wafer dispensing apparatus having a double stage for dispensing and moving wafers according to the distance and the number of sheets between a PP carrier (effector interval is 6.3 mm) and an end effector through a double stage. The method relates to a wafer dispensing apparatus having this double stage,

A base frame; Ball nuts, which are installed at the rear of the first and second stages and the first and second stages, which are installed side by side on the base frame, and which have a ball screw driven as a driving motor between the L guides, To accommodate the first shaft movement, and the other side is composed of only the L-M guide, the first and second moving members to enable the movement of the first axis, the ball nut of the first moving member is accommodated 2 is installed between the movable member and the ball screw installed on the drive shaft of the drive motor to be independently movable in the second axis direction, and the ball nut screwed to the ball screw is installed to be movable along the LM guide A wafer dispensing apparatus having a third stage and a double stage consisting of a wafer dumping module fixed above the third movable member and performing wafer dumping are provided. The.

Wafer, cassette, dispensing device.

Description

Wafer distributing apparatus for having double stage and method of distributing the same}

The present invention provides a dumping module in which a carrier according to the thickness of a wafer is a PP carrier (6.3 mm of effector spacing) through a double stage, and at the same time an end effector spacing. The present invention relates to a wafer dispensing apparatus having a double stage having a variable space at a FOSB of 10 mm, and a wafer distributing method using the same.

The wafer dispensing apparatus of the prior art Patent Publication No. 10-2007-0028525 known as a double port wafer distribution method

To minimize wafer contamination, use standardized front opening unified pods (FOUPs) to minimize the time the wafer is exposed to contamination. Another approach to minimizing the exposure of the wafer to the surrounding environment (eg, clean room) is to use a large load lock chamber (eg, 25 wafers) that can accommodate the entire cassette or FOUP of the wafer. However, large load lockchambers cause a number of problems, including the need for complicated and larger volume elevator mechanisms.

To improve this, there is provided a load lock system comprising a first load lock chamber having a first port and a second port, the first axis being perpendicular to the first port and the second axis being perpendicular to the second port.

On the other hand, the distribution device known in the prior art Patent Registration 10-0827676 is an EFEM (Equipment Front End Module) for transferring the wafer from the outside as shown in the accompanying drawings, Figure 1a, Figure 1b; A load lock module for transferring wafers from the EFEM; And a process module for receiving a wafer from the load lock module and performing a predetermined process, wherein the wafer transfer between the EFEM and the load lock module is performed at atmospheric pressure, and the wafer transfer between the load lock module and the process module is vacuum. The load lock module is a robot unit for transferring a wafer between the EFEM and the process module through a linear motion and a rotational movement in a horizontal plane; the robot unit when the robot transfers the wafer from the EFEM to the process module A lower slot that spaces the wafer away from the robot unit while the wafer is seated from the robot unit; and a wafer is seated from the robot unit when the robot unit transfers the wafer from the process module to the EFEM. (up) an upper slot that separates the wafer from the robot portion and a robot unit, a lower slot, and an upper slot, each of which is positioned at a different height, and is controlled by an external control unit.

It has a joint structure like a robot arm and has an end effector at its proximal end. It requires space to realize the movement trajectory of the robot arm. It was unsuitable for a wafer dispensing apparatus having a stage for selecting and transferring wafers to other ports for example.

An object of the present invention is to provide a wafer dispensing apparatus having a double stage capable of dispensing a sheet of wafer.

In addition, one, two, or three wafers in various sizes of wafer transfer ports (also called carriers), such as those that vary in order to distribute wafers from the PP carrier to the FOSB, or move the PP carrier to ports on the other stage. It is an object of the present invention to provide a wafer dispensing apparatus and a wafer dispensing method using the same.

Wafer distribution device having a double stage of the present invention for achieving the above object,

A base frame; Ball nuts, which are installed at the rear of the first and second stages and the first and second stages, which are installed side by side on the base frame, and which have a ball screw driven as a driving motor between the L guides, To accommodate the first shaft movement, and the other side is composed of only the L-M guide, the first and second moving members to enable the movement of the first axis, the ball nut of the first moving member is accommodated 2 is installed between the movable member and the ball screw installed on the drive shaft of the drive motor to be independently movable in the second axis direction, and the ball nut screwed to the ball screw is installed to be movable along the LM guide It is achieved as a wafer dispensing apparatus having a third moving member, a double stage consisting of a wafer dumping module fixed above the third moving member and performing wafer dumping.

The dumping module of the wafer distribution device having a double stage of the present invention for achieving the above object,

The bearing is installed between the upper and lower parts of the casing forming the upper side, the lower side, and the lower side, and is rotatably fixed. The rotational force is transmitted as the driving motor, the belt, and the pulleys, and the rotating shaft is connected by a screw bar to a predetermined section. The lifting plate is connected to the ball nut to be screwed to the screw bar of the lifting shaft, the lifting shaft is made up and down, and the lifting plate is formed in the guide bar when the bearing is guided up and down, and the rotation shaft penetrates the center, A plurality of hook holes are formed to form a jaw, and are sequentially stacked at a predetermined interval from the lifting plate, and the connecting plates forming a bearing to be guided during the ascent and descent from the guide bar, and the lifting plate and the connecting plate are formed in several. It is installed to guide from several bearings along the holes, and the guide bar and the lifting plate of the lifting plate A plurality of fixing members having a coil spring mounted between the elevating plate and the first connecting plate so as to generate the elevating elasticity so that the several connecting plates stacked up and down in turn are raised and lowered, and the wafers are horizontally connected at one side of the connecting plates. Of the end effectors of the connecting plate and the connecting plate which is located on the upper side of the connecting plate is formed so as to be caught in the jaw portion, the lower end of the connecting plate is fixed to the connecting plates located below the two connecting plates Including a connecting member to be connected to each other,
It is achieved as a wafer dispensing apparatus having a double stage, characterized in that the connecting plate is lowered accompanying the lowering of the elevating plate, and the connecting plates are raised in turn when the elasticity is released by the raising of the elevating plate.

The present invention provides a dumping module whose carrier is 200mm PP carrier (effector spacing is 6.3mm) according to the thickness of the wafer, and at the same time provides a dumping module having a variable spacing of 200mmFOSB having an end effector spacing of 10mm. .

That is, in the present invention, when dumping 1: 1 from 6.3mm to 6.3mm, when dumping 1: 1 from 10mm to 10mm, and dumping intervals varying depending on the carrier spacing from 6.3mm to 10mm Has the effect of providing modules.

2A, 2B and 2C in the accompanying drawings are perspective views showing the external appearance of the wafer dispensing apparatus having the double stage of the present invention and partly open perspective views.

The wafer dispensing apparatus having the double stage of the present invention according to these drawings is composed of a base frame 10, a double stage 20, a mapping unit 30, a dumping module 40, and a transfer unit 50. .

First, the base frame 10 is composed of a frame 11 and cover members 12 attached to the frame 11.

The double stage 20 is separated into first and second stages 21 and 22 which are installed in front of the base frame 10 and are installed side by side on both sides.

The mapping unit 30 is installed inside the door between the front double stage 20 and the dumping module 40 installed on the rear transfer unit 50.

The dumping module 40 is a multi-wafer simultaneous dumping structure for dumping a plurality of wafers, and constitutes an independent apparatus in which a rotating shaft, a lifting plate, a connecting plate, a fixing member, and bearings are assembled in a casing and lowered to a predetermined height. Specific configuration and operation will be described later.

The transfer part 50 is composed of first and second moving members 51 and 52 and a third moving member 53 on which the dumping module 40 is mounted, and its specific configuration and operation will be described later.
3 is an essential part perspective view which extracts the conveyance part of the wafer distribution apparatus which has a double stage of this invention.
The conveying part 50 according to the drawing is installed at the rear of the first and second stages 21 and 22,
The first and second moving members 51 and 52 are installed side by side on both sides so as to be slidable on both side L guides 514 and 524. In addition, the first moving member 51 is a ball screw 512 on the drive shaft which is electrically driven from the drive motor 511 to the drive shaft (not shown) between the drive motor 511 and the pulley (not shown) between the LM guide 514. The first axis of movement of the first moving member 51 (moving block) as a ball nut 513 screwed to the ball screw 512 is connected. The second moving member 52 is made of only the EL guide 524 and can be slidably moved. A third moving member 53 to be described later is mounted across the first and second moving members 51 and 52. .
The third moving member 53 is installed to perform the second axis movement at the same time as the first axis movement of the first and second moving members 51 and 52, and independently in the second axis direction (left and right). Direction) The drive motor 531 is provided so as to be movable. The drive motor 531 is connected to the belt (not shown) and the pulley (not shown) so as to be electrically transmitted to the drive shaft (not shown), and the ball screw (ball screw) 532 is connected, the ball nut 533 is screwed to the ball screw 532 is installed, the ball nut 533 is integrally mounted on the moving block (not shown), the ball screw (532) on both sides sliding By moving the LM guides 534 to be moved side by side, the moving block is installed to be movable in the second axis. The wafer dumping module 40 for dumping the wafer is fixed above the third moving member 53.

In the accompanying drawings, Figure 4a is a perspective view of the dumping module of the present invention, Figure 4b is a perspective view of the main portion of the dumping module of the present invention, Figure 4c is a perspective view omitting the outside of the dumping module of the present invention, Figure 4d is a dumping of the present invention Figure 4e is an enlarged cross-sectional view of the main portion of the dumping module of the present invention, Figure 4f is a side excerpted sectional view of the dumping module of the present invention, Figure 4g is an enlarged cross-sectional view of the main portion of the dumping module of the present invention.

The dumping module 40 of the wafer dispensing apparatus having the double stage of the present invention according to the drawings,

A bearing is installed between the upper and lower parts of the casing 41 covering the upper, lower and side parts to be rotatably fixed, and rotational force is transmitted as driving motors (not shown), belts (not shown), and pulleys (not shown). In the predetermined section, the rotating shaft 43 connected by a screw bar (not shown) is connected to the ball nut 442 to be screwed to the screw bar of the rotating shaft 43, and ascends and descends by the rotational force of the rotating shaft 43. And a lifting plate 44 having a bearing 451 guided when the guide bar 46 is moved up and down by the guide bar 46 and a rotation shaft 43 penetrating the center thereof, and forming a locking jaw portion 422. A plurality of balls 42 and a plurality of connection plates 45 formed by stacking a predetermined interval from the lifting plate 44 in order, and forming a bearing 451 guided when the guide bar 46 moves up and down, In several bearings 451 along several holes 453 formed in the elevating plate 44 and connecting plates 45. The guide plate 46 is installed to be guided, the rest of the vertically installed guide bar 46, and the lifting plate 44 to raise and lower the elasticity so that several stacked connection plates 45 by the lifting and lowering of the lifting plate 44 in order to raise and lower Between the 44 and the first connecting plate 45, a fixed member 47 having the coil spring 472 mounted thereon, and a plurality of end effectors 48 horizontally connected at one side of the connecting plates 45 to dump the wafer. ) And a head portion 492 is formed so as to be caught by the locking jaw portion 422 when the connecting plate 45 located above the several connecting plates 45, and the lower end of the connecting plate 45. It is to form a connecting member 49 is fixed to the connecting plates 45 are positioned so that the two connecting plates 45 are connected to each other.

That is, the elevating plate 44 is connected to the ball shaft 442 so as to be screwed with the rotating shaft 43 is a structure that is raised and lowered by receiving a rotational force from the initial rotating shaft 43.

The plurality of connection plates 45 are sequentially spaced from the elevating plate 44 such that the pivot shaft 43 penetrates a center thereof and ascends and descends according to the elevating and descending force of the elevating plate 44. In addition, the first, second, and second are formed as a bearing 451, which is connected to the guide bar 46, and forms a hole 453 through which the guide bar 46 passes or is connected, and a hole 454 through which the central axis passes. 3. ... consisting of the n-th plurality of connecting plates 45.

The guide bar 46 guides the lifting plate 44 and the plurality of plates 45 to move up and down, and is formed to be connected to or pass through the bearing 451 in the pipe 453.

The fixing member 47 is formed from the elevating plate 44 such that the first, second, third, ..., n-th connecting plates 45 are raised and lowered in sequence by raising and lowering the elevating plate 44. It is fixed through the coil spring 472 between the one connecting plate (45).

The sequential connecting member 49 is a locking jaw portion 422 of the locking hole 42 when the connecting plate 45 located above the first, second, third ... n-th connecting plate 45 is raised. The head portion 492 is formed so as to be caught, and the lower ends thereof are fixed to the plates 45 positioned below one of the first, second, and third n-th connecting plates 45, respectively. As the connecting plates 45 are connected between, the first connecting plate 45 has a sequential lifting connection function of raising or lowering the second connecting plate 45 by a predetermined interval.

The operation of the dumping module of the wafer distribution device having the double stage of the present invention made as described above is as follows.

The wafer dispensing apparatus having the double stage of the present invention starts by driving the drive motor of the transfer section 50 and the dumping module 40 through a predetermined control circuit.

In addition, one, two, or three wafers in various sizes of wafer transfer ports (also called carriers), such as those that vary in order to distribute wafers from the PP carrier to the FOSB, or move the PP carrier to ports on the other stage. The transfer arm is mainly applied to the ports of different stages in the required number of sheets, such as 12 or 24 sheets, but the transfer arm has been mainly applied. It is to improve the problem that did not satisfy the problem.

That is, when the rotation shaft 43 rotates in the first direction, the lifting plate 44 is lowered while being engaged with the ball nut 442 of the lifting plate 44. As the spring 472 is pressed down by the lifting plate 44, the first connecting plate 45 is directly pressed downward to narrow the gap a, and the first plate 44 is lowered. Pressing the third ... n-th play 45 in sequence, the descending is made almost simultaneously with a slight time difference. This results in an overall lowered state of the entire connecting plate 45, but depending on the lowering of the lifting plate 44, only the first plate, only the first and second plates, or the n connecting plates 45 are sequentially or Can be lowered at the same time. This is because the descending distance of the elevating plate 44 is determined according to the rotation time of the screwvine rotating shaft 43, and optionally, one, two, three ... n Connection plate 45 is to be lowered.

That is, the second connecting plate 45 which is positioned between the first and third connecting plates 45 and at the same time is lowered to the connecting member 49 fixed to four places and the connecting member 49 penetrates freely descending. This is because it is pressed down, and together with the lowering of the first and second connecting plates 45, the third connecting plate 45 is also connected as a connecting member 49 between the fourth plate and the next connecting plate ( 45) will be activated.

As the rising of the lowered connection plate 45 is first retracted by the first connection plate 45 elastically pressed by the lifting plate 44 lowered in the second direction (counter direction) rotation of the rotating shaft 43, The second ... n th connecting plates 45 are raised in sequence.

That is, when the rotation shaft 43 rotates in the second direction, the lifting plate 44 of the whole ball nut 442 engaged with the rotation shaft 43 is raised, and the downward movement of the lifting shaft 44 is suppressed by the spring 472 due to the lifting of the lifting plate 44. The first connection plate 45 of the spring 472 is raised to the original position by a predetermined interval, the first connection plate 45 is connected to the engaging jaw portion 422 when the connection plate 45 is raised ( The head portion 492 of 49 is caught and pulls up another second connection plate 45 at the bottom thereof, and then the second connection plate 45 pulls up the connection plate 45 directly below and rises. The plates are then connected in the same way-the two connecting plates 45 between the plates 45 are connected between the first connecting plate 45 and the second connecting plate 45. 2 connecting plate 45 is the third plate, the third plate is the fourth plate-- Prices rise was done at about the same time becomes a rise of the number plate 45.

This is a function of the end effectors 48 connected to the connection portion 452 of the plurality of plates 45 to load the wafers in the port or to lower the mounted wafers, as described below.

5A to 5D of the accompanying drawings illustrate the mapping operation of the wafer dispensing apparatus having the double stage of the present invention.

The mapping unit 30 of the wafer dispensing apparatus having the double stage according to the present invention includes a frame 310, a mapping panel 320, and a driving unit 330 as illustrated in FIGS. 5A to 5D.

The frame 310 is provided with a guide bar 312 fixed to the door holder side and on both sides of the upper end, and provided with a motor 316 and a pinion gear 314 rotating by the motor 316 at the rear.

In addition, the rear of the frame 310 is provided with a limit sensor (not shown) for detecting the front and rear movement position of the mapping panel 320 at the bottom thereof, and the motor 316 is supported by the bracket 311. The mapping panel 320 has guide holes 322 penetrating through the guide bar 312 at four corners, so that the mapping panel 320 can be moved forward and backward in a direction perpendicular to the top of the frame 310, and at the same time, a rack on the bottom thereof. The gear 324 may be provided.

The mapping panel 320 further includes transmitting and receiving means 330 on both front sides of the mapping panel 320 to map the loaded state in proximity to the stacked wafers.

The mapping linear of the present invention is a gear 324 installed at the bottom of the mapping panel 320 so that the pinion gear 314 rotates in one direction by driving the motor 316 in accordance with a power signal, and at the same time, it is engaged with the pinion gear 314. A predetermined forward and backward movement is made.

That is, when the pinion gear 16 rotates counterclockwise in the drawing, the mapping panel moves backward, and when the pinion gear 16 rotates clockwise, the mapping panel 320 moves forward.

The forward and backward operating distances are detected by the position detection limit sensors installed in the position and controlled.

In addition, through the transmitting and receiving means 330 located at the front end of the mapping panel 320, the positional deviation of the circular peripheral portion of the wafer is detected, and the mapping operation such as detecting whether the tilted in accordance with the horizontal state is detected. Done.

On the other hand, the driving unit 340 for the up and down operation of the mapping panel 320 is screwed with a ball nut (not shown) to the screw bar 341, as shown in Figure 5a and the upper, The slider 343 is installed to be movable, and the upper and lower ends of the screw bar 341 are supported by bearings (not shown), and the pulley 346 and the belt 347 and the driving motor 345 are provided at the lower end. The rotational force is to be transmitted.

Accordingly, the frame 310 is installed on the slider 343, and the mapping panel 320 is installed in the frame 310 so as to be able to move forward and backward independently, thereby performing a mapping operation according to the position of the wafer.

On the other hand, it will be described with the transfer unit 50, the forward and backward at the same time the operation of the dumping module 40 of the present invention.

That is, as shown in FIGS. 6A to 6E of the accompanying drawings, the transfer unit 50 is installed at the rear of the first and second stages 21 and 22, respectively, and the driving motor 511 and the driving motor ( A screw bar 512 mounted to the drive shaft of the 511, a first nut member movably installed as the ball nut 513 and the L guide 514 screwed to the screw bar 512, Only the second guide member 524 formed with only the LM guide 524 is installed side by side on both sides, the ball nut 513 and the LM guide 514 and the second moving member (1) of the first moving member (51) Each of the LM guide 524 of 52 has a slider (not shown) so as to move forward and backward, respectively, and a third installed horizontally between the first and second moving members 51 and 52. The moving member 53 is horizontally installed on the slider, and the third moving member 53 independently drives the drive motor 531, the ball screw 532, the ball nut 533, and the LM guide 534. It can be moved to the left and right by installing.

In particular, when the left and right movement, the lifting shaft 43 of the internal dumping module 40 is rotated by the rotational force of the same driving motor, and the lifting and lowering operation of the dumping module 40 is performed simultaneously with the left and right movement.

The lifting operation at this time can produce an operation of the end effector as if the end effectors 48 of the dumping module 40 are moved up and down at a predetermined height and move left and right at the same time.

Method for distributing a wafer of a wafer dispensing apparatus having a double stage of the present invention,

(a) preparing a first port and a second port on which the wafers to be distributed in different numbers on the first and second stages are prepared;

(b) mapping, by the mapping unit 30, whether the wafer of the port placed on the first stage is normal as a predetermined control signal;

(c) Advancing into the first port while widening or narrowing the end effector with multiple or limited lengths to fit the gaps of the mapped wafers in order to widen the stacking intervals, load the same number of sheets or distribute multiple wafers with a limited number of sheets. Dumping the wafer;

(d) retracting the wafer in the first port as a plurality of end effectors of the dumping module 40;

(e) Between the first and second moving members to widen the stacking interval for distributing the dumping module 40 carrying the reversed wafer to the second port on the second stage or to distribute the plurality of wafers with a limited number of sheets. By moving the third moving member mounted on the side to move the dumping module of the third moving member integral to the left side and the independent operation of the dumping module, the dumping interval of each wafer according to the signal from the controller Widening the spacing;

(f) a mapping step of mapping the gaps and positions of the dumped wafers to seat the dumping modules shifted left and the wafer-to-wafer spacing adjusted to predetermined signals in the ports on the second stage;

(g) final loading the mapped wafer into a port on a second stage; And

(h) the step of waiting for the step (b) to prepare the advanced dumping module back to the original position.

1A and 1B show an example of a conventionally known wafer dispensing apparatus.

2A, 2B, and 2C are perspective views showing an external appearance of a wafer dispensing apparatus having a double stage according to the present invention and an open perspective view thereof;

3 is an essential part perspective view taken from a transfer part of a wafer dispensing apparatus having a double stage of the present invention;

Figure 4a is a perspective view of the dumping module of the present invention,
Figure 4b is a perspective view of the main portion of the dumping module of the present invention,
Figure 4c is a perspective view, omitting the outside of the dumping module of the present invention,

Figure 4d is a perspective view of a part omitted omission of the dumping module of the present invention,

Figure 4e is an enlarged cross-sectional view of the main portion of the dumping module of the present invention,
Figure 4f is a side cross-sectional view of the dumping module of the present invention,
Figure 4g is an enlarged cross-sectional view of the main portion of the dumping module of the present invention.

5A to 5D are diagrams for explaining the mapping operation of the wafer dispensing apparatus having the double stage of the present invention;

6A to 6E are operation explanatory diagrams explaining the dispensing operation of the wafer dispensing apparatus having the double stage of the present invention.

Claims (4)

delete Base frame, the first and second stages installed side by side on the base frame, the first and second stages are installed in the rear, one side of the ball guides to drive as a drive motor between the LM guide, but is screwed in The first and second moving members and the ball nut of the first moving member to accommodate movement of the first shaft by accommodating the ball nut to enable the first axis movement, and the other side is composed of only the L guide. It is installed between the 1st and 2nd moving members, and it can move along an L guide by accommodating the ball screw installed in the drive shaft of a drive motor so that it can move independently to a 2nd axis direction, and the ball nut screwed to this ball screw. A wafer dispensing apparatus having a double stage comprising a third dumping member which is installed to be securely installed, and a wafer dumping module which is fixed above the third movable member and performs dumping of the wafer. In, Dumping module 40, The bearing 432 is installed between the upper and lower parts of the casing 41 to cover the upper, lower and side portions, and is rotatably fixed. The rotational force is transmitted as a driving motor, a belt and a pulley, and a screw bar is connected to a predetermined section. A coaxial 43; The ball nut 442 is connected to the screw bar of the rotating shaft 43 by a ball nut 442, and the lifting and lowering is made by the rotational force of the rotating shaft 43, and the guide bar 46 when the lifting and lowering guide 451 An elevating plate 44 formed with; The rotating shaft 43 penetrates the center and forms a plurality of locking holes 42 having the locking jaw portion 422, and is sequentially stacked from the lifting plate 44 at predetermined intervals, and is lifted from the guide bar 46. Connection plates 45 forming a bearing 451 to be guided when descending; A guide bar 46 installed to be guided by several bearings 451 along the plurality of pipes 453 formed in the elevating plate 44 and the connecting plates 45, and the rest of the guide bars 46 being vertically passed through; Coil spring 472 between the elevating plate 44 and the first connecting plate 45 so as to generate the elevating elasticity so that several stacked connection plates 45 are raised and lowered in turn by raising and lowering the elevating plate 44. A fixing member 47 which has a carbon; A plurality of end effectors 48 horizontally connected at one side of the connecting plates 45 to dump the wafer; And The head portion 492 is formed to be caught by the catching jaw portion 422 when the connecting plate 45 located above the several connecting plates 45 is formed, and a lower end of the connecting plate 45 is connected to the connecting plate 45. Including a connecting member 49 fixed to the plates 45 so that the two connecting plates 45 are connected to each other, When the connection plate 45 is lowered accompanying the lowering of the elevating plate 44 and the elasticity is released by the elevating of the elevating plate 45, the connecting plate 45 has a double stage, characterized in that to be raised in turn Wafer Dispenser. 3. The method of claim 2, A frame 310 having a guide bar 312 fixed to the door holder side and having a guide bar 312 on both sides of the upper side, and having a motor 316 and a pinion gear 314 rotated by the motor 316 at the rear thereof; A guide hole 322 penetrating through the guide bar 312 is formed in four corners to be installed to move forward and backward at right angles to the upper end of the frame 310, and at the same time the rack gear 324 is provided on the bottom thereof. Type mapping panel 320, the mapping panel 320 is a limit for detecting the front and rear movement position of the mapping panel 320 in the front, both sides of the transmission and reception means 330, and the frame 310 in the rear Wafer distribution device having a double stage further comprises a mapping device consisting of a sensor 340, the mapping panel 320 is moved forward and backward by the driving of the motor 316. In the method of distributing a wafer using a wafer dispensing apparatus having a double stage, (a) preparing two ports for each load consisting of a first port and a second port in which wafers to be distributed in different numbers on the first and second stages are prepared; (b) mapping, by the mapping unit 30, whether the wafer of the port placed on the first stage is normal as a predetermined control signal; (c) Dumping wafers by advancing into the first port while widening or narrowing end effector spacing to match the spacing of the mapped wafers in order to widen the stacking intervals, load the same number of sheets, or distribute multiple wafers with a limited number of sheets. step; (d) retracting the wafer in the first port as a multi-end effector of the dumping module; (e) the first and second moving members mounted between the first and second moving members to widen the stacking intervals or to distribute the plurality of wafers respectively for distributing the dumping module carrying the reversed wafer to the second port on the second stage. Moving the dumping module integrally with the third moving member by laterally moving the third moving member and widening the dumping interval of each wafer according to the control signal by independent operation of the dumping module; (f) A mapping step of mapping the spaced and position of the dumped wafer to seat the dumping module, which has been moved left and the wafer-to-wafer adjusted in the port on the second stage: (g) final loading the mapped wafer into a port on a second stage; And (h) a method of dispensing a wafer comprising the step of preparing the advanced dumping module back to its original position.

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