KR20100115475A - Wafer distributing apparatus for having double stage and method of distributing the same - Google Patents

Abstract

PURPOSE: A wafer distributing device with a double stage and a method for distributing a wafer using the same are provided to supply a dumping module with a dumping interval changed according to a space between carriers. CONSTITUTION: A wafer distributing device with a double stage includes an external casing(10), first and second stages(21,22), first to third moving members(51,52,53), and a dumping module. The first and second stages are installed on both sides of the external casing in parallel. The first and second moving members are installed behind the first and second stages. The third moving member receives a ball nut of the first and second moving members and moves between the first and second moving members. The dumping module is fixed to the upper side of the third moving member and dumps the wafer.

Description

Wafer distributing apparatus for having double stage and method of distributing the same}

The present invention provides a dumping module in which a carrier according to the thickness of a wafer is a PP carrier (6.3 mm of effector spacing) through a double stage, and at the same time an end effector spacing. The present invention relates to a wafer dispensing apparatus having a double stage having a variable space at a FOSB of 10 mm, and a wafer distributing method using the same.

The wafer dispensing apparatus of the prior art Patent Publication No. 10-2007-0028525 known as a double port wafer distribution method

To minimize wafer contamination, use standardized front opening unified pods (FOUPs) to minimize the time the wafer is exposed to contamination. Another approach to minimizing the exposure of the wafer to the surrounding environment (eg, clean room) is to use a large load lock chamber (eg, 25 wafers) that can accommodate the entire cassette or FOUP of the wafer. However, large load lockchambers cause a number of problems, including the need for complicated and larger volume elevator mechanisms.

To improve this, there is provided a load lock system comprising a first load lock chamber having a first port and a second port, the first axis being perpendicular to the first port and the second axis being perpendicular to the second port.

On the other hand, the distribution device known in the prior art Patent Registration 10-0827676 is an EFEM (Equipment Front End Module) for transferring the wafer from the outside as shown in the accompanying drawings, Figure 1a, Figure 1b; A load lock module for transferring wafers from the EFEM; And a process module for receiving a wafer from the load lock module and performing a predetermined process, wherein the wafer transfer between the EFEM and the load lock module is performed at atmospheric pressure, and the wafer transfer between the load lock module and the process module is vacuum. The load lock module is a robot unit for transferring a wafer between the EFEM and the process module through a linear motion and a rotational movement in a horizontal plane; the robot unit when the robot transfers the wafer from the EFEM to the process module A lower slot that spaces the wafer away from the robot unit while the wafer is seated from the robot unit; and a wafer is seated from the robot unit when the robot unit transfers the wafer from the process module to the EFEM. (up) an upper slot that separates the wafer from the robot portion and a robot unit, a lower slot, and an upper slot, each of which is positioned at a different height, and is controlled by an external control unit.

It has a joint structure like a robot arm and has an end effector at its proximal end. It requires space to realize the movement trajectory of the robot arm. It was unsuitable for a wafer dispensing apparatus having a stage for selecting and transferring wafers to other ports for example.

An object of the present invention is to provide a wafer dispensing apparatus having a double stage capable of dispensing a sheet of wafer.

In addition, one, two, or three wafers in various sizes of wafer transfer ports (also called carriers), such as those that vary in order to distribute wafers from the PP carrier to the FOSB, or move the PP carrier to ports on the other stage. It is an object of the present invention to provide a wafer dispensing apparatus and a wafer dispensing method using the same.

In the wafer dispensing apparatus having a double stage of the present invention for achieving the above object,

A pedestal, first and second stages installed side by side on both sides of the pedestal, and installed at the rear of the first and second stages, respectively, with a drive motor and ball screws installed on the drive shafts of the drive motors; The first and second moving members are installed to be movable as ball nuts and LM guides screwed to the ball screws, and the ball nuts of the first and second moving members are accommodated to move forward and backward. The drive motor is installed between the first and second moving members and is independently movable to the left and right directions, and is movable as a ball screw installed on the drive shaft of the drive motor, a ball nut screwed to the ball screw, and an EL guide. It is achieved as a wafer dispensing apparatus having a double stage including a third moving member which is installed so as to be installed, and a wafer dispensing module fixed above the third moving member and performing a dumping of the wafer.

The dumping module of the wafer distribution device having a double stage of the present invention for achieving the above object,

A casing forming an upper portion, a side portion, and a lower portion, and a center pivot shaft (screw bar) fixedly rotatable between upper and lower portions of the casing; A rotating shaft having a rotational force by a predetermined power and supported by bearings at upper and lower ends thereof; An elevating plate connected to a ball nut so as to be screwed with the pivot shaft, the elevating plate configured to move up and down; The rotation shaft penetrates the center and is positioned in predetermined intervals from the lifting plate in order to move up and down according to the lifting and lowering force of the lifting plate, and a locking jaw is formed to form a locking hole. Second, third ... nth plate; A guide bar for guiding the elevating plate, the first, second, and third ... nth plates to move up and down; A fixing member fixed to the first plate by a coil spring between the first plate and the first plate so that the first, second, third, ..., n-th plates are raised and lowered in turn by the lifting and lowering of the lifting plate; End effectors horizontally connected at sides of the elevating plates; And a head part to be caught by a latching jaw when the plate positioned above the first, second, third ... n-plate is raised, and the lower end thereof is formed of the first, second, third ... It includes a sequential connecting member is fixed to the plate located below the n plate is connected between the two plates each.

The present invention provides a dumping module whose carrier is 200mm PP carrier (effector spacing is 6.3mm) according to the thickness of the wafer, and at the same time provides a dumping module having a variable spacing of 200mmFOSB having an end effector spacing of 10mm. .

That is, in the present invention, when dumping 1: 1 from 6.3mm to 6.3mm, when dumping 1: 1 from 10mm to 10mm, and dumping intervals varying depending on the carrier spacing from 6.3mm to 10mm Has the effect of providing modules.

2A and 2B are a perspective view showing an external appearance of a wafer dispensing apparatus having a double stage of the present invention and an open perspective view, and FIG. 3 is an essential part perspective view taken from a transfer part of the wafer dispensing apparatus having a double stage of the present invention. .

The wafer dispensing apparatus having a double stage of the present invention according to these drawings is composed of an outer casing 10, a double stage 20, a mapping unit 30, a dumping module 40, and a conveying unit 50. .

First, the outer casing 10 is composed of predetermined frames 11 and cover members 12 attached to the frame 11.

The double stage 20 is separated into first and second stages 21 and 22 that are installed in front of the outer casing 10 and are installed side by side on both sides.

The mapping unit 30 is installed inside the door between the front double stage 20 and the dumping module 40 installed on the rear transfer unit 50.

The dumping module 40 is a multi-wafer simultaneous dumping structure for dumping a plurality of wafers, and an independent apparatus in which a rotating shaft, a lifting plate, a plurality of plates, a fixing member, and a connecting member are assembled and lowered to a predetermined height is assembled in the casing. Specific configuration and operation will be described later.

The transfer part 50 is composed of first and second moving members 51 and 52 and a third moving member 53 on which the dumping module 40 is mounted, and its specific configuration and operation will be described later.

4A, 4B, and 4C of the accompanying drawings are excerpts perspective views omitting a part of the present dumping module, and FIG. 4D is a perspective view of an excerpt of a part of the present dumping module, and FIG. 4E is a main part of the present dumping module. It is an enlarged cross section.

The dumping module 40 of the wafer dispensing apparatus having the double stage of the present invention according to the drawings,

A casing 41 covering the upper, lower and side portions, and a bearing 432 between the upper and lower portions of the casing 41 are rotatably fixed, and the driving motor, the belt, and the pulleys of the side portion are omitted. A plurality of pivot shafts 43 to which rotational force is transmitted, and a plurality of plates 44 and 45 to guide the lifting shaft 44 and the plurality of plates 45 to be moved up and down, which will be described later. A fixing member 47 fixed between the guide bar 46 installed vertically and the lifting plate 44 and the coil spring 472 interposed between the lifting plate 44 to generate lifting elasticity of a predetermined interval; A plurality of end effectors 48 which are horizontally connected at the sides of the plates 44 and 45 to dump the wafer and between two plates 45 between the plates 45 And a predetermined interval between the lifting plate 44 and the first plate 45 When the elevating elasticity is generated by forming a connecting member 49 that operates to sequentially narrow or widen the interval.

In particular, the lifting plate 44 is connected to the ball shaft 442 so as to be screwed with the rotation shaft 43 is a structure that is lifted, lowered by receiving a rotational force from the initial rotation shaft (43).

The plurality of plates 45 are sequentially spaced from the elevating plate 44 such that the pivot shaft 43 penetrates a center thereof and ascends and descends according to the elevating and descending force of the elevating plate 44. And the first, second, third, ..., n-th plurality of plates 45 forming the locking jaw portion 451 to form the perforated locking holes 452.

The guide bar 46 guides the lifting plate 44 and the plurality of plates 45 to move up and down, and forms a through hole at a predetermined position.

The fixing member 47 is firstly moved from the elevating plate 44 such that the first, second, third, ... n-th plates 45 are raised and lowered in order by raising and lowering the elevating plate 44. The coil spring 472 is interposed between the plates 45 to fix it.

The sequential connecting member 49 forms a head portion 492 to be caught by the catching jaw portion 451 when the plate 45 positioned above the first, second, third, ... n-th plate is raised. The lower end is fixed to the plates 45 positioned below one of the first, second, third, ... n-th plates 45 so that two plates 45 are connected therebetween. Therefore, the first plate 45 has a sequential lifting connection function of raising or lowering the second plate 45 by a predetermined interval.

The operation of the dumping module of the wafer distribution device having the double stage of the present invention made as described above is as follows.

The wafer dispensing apparatus having the double stage of the present invention starts by driving the drive motor of the transfer section 50 and the dumping module 40 through a predetermined control circuit.

In addition, one, two, or three wafers in various sizes of wafer transfer ports (also called carriers), such as those that vary in order to distribute wafers from the PP carrier to the FOSB, or move the PP carrier to ports on the other stage. The transfer arm is mainly applied to the ports of different stages in the required number of sheets, such as 12 or 24 sheets, but the transfer arm has been mainly applied. It is to improve the problem that did not satisfy the problem.

That is, when the rotation shaft 43 rotates in the first direction, the lifting plate 44 is lowered while being engaged with the ball nut 442 of the lifting plate 44. The spring 472 suppresses the first plate 45 directly below by the lowering of the elevating plate 44 to narrow the gap a, and the lowering of the first plate 44 is lowered. 3. Pressing the n-th play (45) in sequence, the descent is made almost simultaneously with a slight time difference. This results in an overall lowered state of the entire plate 45, but depending on the lowering force of the elevating plate 44, only the first plate, only the first and second plates, or the n plates 45 are sequentially or simultaneously. Can be lowered. This is because the descending distance of the elevating plate 44 is determined according to the rotation time of the screwvine rotating shaft 43, and optionally, one, two, three ... n Two plates 45 can be lowered.

That is, while lowering the connecting member 49 fixed in four places and at the same time between the first and third plates 45, the connecting member 49 penetrates the second plate 45 which can be freely raised and lowered Press down to descend. At this time, the speed of descending is fast or slow depending on the degree of sliding with the guide bar 46. In addition to the lowering of the first and second plates 45, the third plate 45 is also connected to the fourth plate as the connecting member 49, so that the operation to the nth plate is performed in turn.

As the lift of the lowered plate 45 is first retracted by the first plate 45 elastically pressed by the lifting plate 44 lowered in the second direction (counter direction) rotation of the pivot shaft 43, the second ... the n-th plates 45 are raised in sequence.

That is, when the rotation shaft 43 rotates in the second direction, the lifting plate 44 of the whole ball nut 442 engaged with the rotation shaft 43 is raised, and the downward movement of the lifting shaft 44 is suppressed by the spring 472 due to the lifting of the lifting plate 44. The first plate 45 of the spring 472 is resilient to the original position by a predetermined interval, the first plate 45 of the connecting member 49 to the engaging jaw portion 451 when the plate 45 is raised. The head 492 is caught and pulls up another second plate 45 at the bottom thereof, and then the second plate 45 again raises and pulls up and down the plate 45 directly, and then the plates are the same. In this manner, the plates 45 are connected to each other between the plates 45 so that the first plate 45 is the second plate 45 and the second plate 45 is the third plate. The third plate raises the fourth plate--each a predetermined interval, so that at the same time multiple plates ( 45) is made to rise.

This is a function of the end effectors 48 connected to the connection portion 452 of the plurality of plates 45 to load the wafers in the port or to lower the mounted wafers, as described below.

5A to 5D of the accompanying drawings illustrate the mapping operation of the wafer dispensing apparatus having the double stage of the present invention.

The mapping unit 30 of the wafer dispensing apparatus having the double stage according to the present invention includes a frame 310, a mapping panel 320, and a driving unit 330 as illustrated in FIGS. 5A to 5D.

The frame 310 is provided with a guide bar 312 fixed to the door holder side and on both sides of the upper end, and provided with a motor 314 and a pinion gear 316 rotated by the motor 314 at the rear.

In addition, the rear of the frame 310 is provided with a limit sensor (not shown) for detecting the front and rear movement positions of the mapping panel 320 at the bottom thereof, and the motor 314 is supported by the bracket 311. The mapping panel 320 has guide holes 322 penetrating through the guide bar 312 at four corners, so that the mapping panel 320 can be moved forward and backward in a direction perpendicular to the top of the frame 310, and at the same time, a rack on the bottom thereof. The gear 324 may be provided.

The mapping panel 320 further includes transmitting and receiving means 330 on both front sides of the mapping panel 320 to map the loaded state in proximity to the stacked wafers.

The mapping linear of the present invention is a gear 324 installed at the bottom of the mapping panel 320 so that the pinion gear 316 rotates in one direction by driving the motor 314 in response to a power signal, and at the same time, is engaged with it. A predetermined forward and backward movement is made.

That is, when the pinion gear 16 rotates counterclockwise in the drawing, the mapping panel moves backward, and when the pinion gear 16 rotates clockwise, the mapping panel 320 moves forward.

The forward and backward operating distances are detected by the position detection limit sensors installed in the position and controlled.

In addition, through the transmitting and receiving means 330 located at the front end of the mapping panel 320, the positional deviation of the circular peripheral portion of the wafer is detected, and the mapping operation such as detecting whether the tilted in accordance with the horizontal state is detected. Done.

On the other hand, the driving unit 340 for the up and down operation of the mapping panel 320 is screwed with a ball nut (not shown) to the screw bar 341, as shown in Figure 5a and the upper, The slider 343 is installed to be movable, and the upper and lower ends of the screw bar 341 are supported by bearings (not shown), and the pulley 346 and the belt 347 and the driving motor 345 are provided at the lower end. The rotational force is to be transmitted.

Accordingly, the frame 310 is installed on the slider 343, and the mapping panel 320 is installed in the frame 310 so as to be able to move forward and backward independently, thereby performing a mapping operation according to the position of the wafer.

On the other hand, it will be described with the transfer unit 50, the forward and backward at the same time the operation of the dumping module 40 of the present invention.

That is, as shown in FIGS. 6A to 6E of the accompanying drawings, the transfer unit 50 is installed at the rear of the first and second stages 21 and 22, respectively, and the driving motor 511 and the driving motor ( A screw bar 512 mounted to the drive shaft of the 511, a first nut member movably installed as the ball nut 513 and the L guide 514 screwed to the screw bar 512, Only the second guide member 524 formed with only the LM guide 524 is installed side by side on both sides, the ball nut 513 and the LM guide 514 and the second moving member (1) of the first moving member (51) Each of the LM guide 524 of 52 has a slider (not shown) so as to move forward and backward, respectively, and a third installed horizontally between the first and second moving members 51 and 52. The moving member 53 is horizontally installed on the slider, and the third moving member 53 independently drives the drive motor 531, the ball screw 532, the ball nut 533, and the LM guide 534. It can be moved to the left and right by installing.

In particular, when the left and right movement, the lifting shaft 43 of the internal dumping module 40 is rotated by the rotational force of the same driving motor, and the lifting and lowering operation of the dumping module 40 is performed simultaneously with the left and right movement.

The lifting operation at this time can produce an operation of the end effector as if the end effectors 48 of the dumping module 40 are moved up and down at a predetermined height and move left and right at the same time.

Method for distributing a wafer of a wafer dispensing apparatus having a double stage of the present invention,

(a) preparing a first port and a second port on which the wafers to be distributed in different numbers on the first and second stages are prepared;

(b) mapping, by the mapping unit 30, whether the wafer of the port placed on the first stage is normal as a predetermined control signal;

(c) Advancing into the first port while widening or narrowing the end effector with multiple or limited lengths to fit the gaps of the mapped wafers in order to widen the stacking intervals, load the same number of sheets or distribute multiple wafers with a limited number of sheets. Dumping the wafer;

(d) retracting the wafer in the first port as a plurality of end effectors of the dumping module 40;

(e) Between the first and second moving members to widen the stacking interval for distributing the dumping module 40 carrying the reversed wafer to the second port on the second stage or to distribute the plurality of wafers with a limited number of sheets. By moving the third moving member mounted on the side to move the dumping module of the third moving member integral to the left side and the independent operation of the dumping module, the dumping interval of each wafer according to the signal from the controller Widening the spacing;

(f) a mapping step of mapping the gaps and positions of the dumped wafers to seat the dumping modules shifted left and the wafer-to-wafer spacing adjusted to predetermined signals in the ports on the second stage;

(g) final loading the mapped wafer into a port on a second stage; And

(h) the step of waiting for the step (b) to prepare the advanced dumping module back to the original position.

1A and 1B show an example of a conventionally known wafer dispensing apparatus.

2A, 2B, and 2C are perspective views showing an external appearance of a wafer dispensing apparatus having a double stage according to the present invention and an open perspective view thereof;

3 is an essential part perspective view taken from a transfer part of a wafer dispensing apparatus having a double stage of the present invention;

4a, 4b, 4c is an excerpt perspective view omitting a part of the dumping module of the present invention,

Figure 4d is a perspective view of a part omitted omission of the dumping module of the present invention,

Figure 4e is an enlarged cross-sectional view of the main portion of the dumping module of the present invention,

5A to 5D are diagrams for explaining the mapping operation of the wafer dispensing apparatus having the double stage of the present invention;

6A to 6E are operation explanatory diagrams explaining the dispensing operation of the wafer dispensing apparatus having the double stage of the present invention.

Claims (4)

In a wafer dispensing apparatus having a double stage, Outer casing 10; First and second stages 21 and 22 installed side by side on both sides of the outer casing 10; It is installed at the rear of the first and second stages 21 and 22, respectively, a drive motor, ball screws installed on the drive shafts of the drive motors, ball nuts and L guides screwed to the ball screws. First and second moving members 51 and 52 that are movably installed as one another; The drive motor is installed between the first and second moving members so as to receive the ball nuts of the first and second moving members so as to be movable forward and backward, and independently move left and right. A ball screw installed on the drive shaft, and a third movable member 53 movably installed as ball nuts and LM guides screwed to the ball screws; And a wafer dumping module (40) fixed above the third moving member (53) and including a dumping module (40) for dumping the wafer. The method of claim 1, wherein the dumping module 40, A rotating shaft 43 that is rotatably fixed between upper and lower portions of the casing 41 forming upper, side, and lower portions, and comprising a screw bar; A lifting plate 44 connected to the ball nut 442 so as to be screwed with the rotational shaft 43 and rising and falling; The pivot shaft 43 penetrates a center thereof, and is positioned in a predetermined interval from the lifting plate 44 so as to move up and down according to the lifting and lowering force of the lifting plate 44 and the locking jaw portion 422. A plurality of plates 45 formed to form perforated engaging holes 42; A guide bar 46 for guiding the lifting plate 44 and the plurality of plates 45 to move up and down; Fixing member 47 fixed through the coil spring 472 between the plate 45 directly below the elevating plate 44 so that the plate 45 is raised and lowered in sequence by the elevating plate 44, ); End effectors (48) horizontally connected at the sides of the plurality of plates (45); And The lower end of the lower plate 45 is fixed by passing through the head portion 492 to be caught or lowered as it is when the lifting jaw portion 422 of the upper plate 45 of the plurality of plates 45 is raised or lowered. Lifting connection of the plurality of plates 45 by two in the up and down in turn by the connection method to the whole of the plurality of plates 45 are lowered along with the lowering elasticity of the lifting plate 44 as well as the lifting plate ( 45 is a wafer dispensing apparatus having a double stage, characterized in that made of a connecting member (49) to raise the whole plate (45) in turn when the elasticity is released by the rise. The method of claim 1, The guide bar is fixed to the door holder side and provided with guide bars 312 on both sides of the upper side, and has a motor 314 at the rear and a pinion gear 316 rotated by the motor, and the guide bar. A guide hole 322 penetrating through the 312 is formed in four corners to be installed to move forward and backward in a direction perpendicular to the top of the frame 310, and a flat gear mapping having a rack gear 324 formed on the bottom thereof. The panel 320, the mapping panel 320 is a limit sensor for detecting the front and rear moving position of the mapping panel 320 in the front, both sides of the transmission and reception means 330, and the rear of the frame 310 ( 340 is a wafer distribution device having a double stage further comprises a mapping device 330, the mapping panel 320 is moved forward and backward by the driving of the motor 314. In the method of distributing a wafer using a wafer dispensing apparatus having a double stage according to claim 1, (a) preparing a first port and a second port having a wafer to be distributed in different numbers on the first and second stages; (b) mapping, by the mapping unit 30, whether the wafer of the port placed on the first stage is normal as a predetermined control signal; (c) Advancing into the first port while widening or narrowing the end effector with multiple or limited lengths to fit the gaps of the mapped wafers in order to widen the stacking intervals, load the same number of sheets or distribute multiple wafers with a limited number of sheets. Dumping the wafers; (d) retracting the wafer in the first port as a plurality of end effectors of the dumping module 40; (e) Between the first and second moving members to widen the stacking interval for distributing the dumping module 40 carrying the reversed wafer to the second port on the second stage or to distribute the plurality of wafers with a limited number of sheets. By moving the third moving member mounted on the side to move the dumping module of the third moving member integral to the left side and the independent operation of the dumping module, the dumping interval of each wafer according to the signal from the controller Widening the gap; (f) a mapping step of mapping the gaps and positions of the dumped wafers to seat the dumping modules shifted left and the wafer-to-wafer spacing adjusted to predetermined signals in the ports on the second stage; (g) final loading the mapped wafer into a port on a second stage; And (h) a method of dispensing a wafer comprising the step of preparing the advanced dumping module back to its original position.

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