JPH0982780A - Wafer transfer device - Google Patents

Wafer transfer device

Info

Publication number
JPH0982780A
JPH0982780A JP26346695A JP26346695A JPH0982780A JP H0982780 A JPH0982780 A JP H0982780A JP 26346695 A JP26346695 A JP 26346695A JP 26346695 A JP26346695 A JP 26346695A JP H0982780 A JPH0982780 A JP H0982780A
Authority
JP
Japan
Prior art keywords
robot
arm
transfer
transfer device
lifting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26346695A
Other languages
Japanese (ja)
Inventor
Satoshi Sato
敏 佐藤
Masayuki Tomita
雅之 富田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Priority to JP26346695A priority Critical patent/JPH0982780A/en
Publication of JPH0982780A publication Critical patent/JPH0982780A/en
Pending legal-status Critical Current

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  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent the dust generation and contamination in a vacuum vessel and to further reduce the area occupied by a wafer transfer device. SOLUTION: The wafer transfer device comprises a vertically moving robot 28 of a three-joint link structure at a vertical surface, a transfer robot 14 of a three-joint link structure at a vertically moving third arm 33 disposed at the end of the robot 28, and makes it possible to hold a wafer 19 by the third joint arm 18 disposed at the end of the transfer robot. The transfer device can telescopically move the rotary shaft engaged with the first arm of the robot 28 disposed at a base side toward the shaft center. The transfer operation is conducted by the combination of the rotations. The transfer device does not have a slide part, and has extremely small dust generation. The transfer range is extended by telescopically moving the rotary shaft for engaging the first arm of the robot 28 toward the shaft center, and the robot 14 can be moved in parallel in the horizontal direction of the robot 14, thereby simplifying the constitution of the system including the transfer device.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は半導体製造工程で使
用される基板搬送装置、特に真空容器内で基板を搬送す
る為の基板搬送装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate transfer device used in a semiconductor manufacturing process, and more particularly to a substrate transfer device for transferring a substrate in a vacuum container.

【0002】[0002]

【従来の技術】真空容器内で基板を搬送する従来の基板
搬送装置を図4に於いて説明する。
2. Description of the Related Art A conventional substrate transfer device for transferring a substrate in a vacuum container will be described with reference to FIG.

【0003】図4中、1は真空容器であり、該真空容器
1の天井、底板にそれぞれ軸受板2,3が設けられ、該
軸受板2,3に掛渡ってガイド軸4,5が設けられ、該
両ガイド軸4,5の間に螺子軸6が設けられ、該螺子軸
6の上端下端は回転軸受7,8を介して支承されてい
る。前記螺子軸6の上端は真空容器1より突出し、該突
出端は真空容器1外部に設けられたモータ駆動部9に連
結され、前記突出端の真空容器1貫通部は磁気シール1
0により気密にシールされている。
In FIG. 4, reference numeral 1 denotes a vacuum container, bearing plates 2 and 3 are provided on a ceiling and a bottom plate of the vacuum container 1, and guide shafts 4 and 5 are provided so as to extend over the bearing plates 2 and 3. A screw shaft 6 is provided between the guide shafts 4 and 5, and the upper and lower ends of the screw shaft 6 are supported by rotary bearings 7 and 8. The upper end of the screw shaft 6 projects from the vacuum container 1, and the projecting end is connected to a motor driving unit 9 provided outside the vacuum container 1. The penetrating part of the vacuum container 1 at the projecting end is a magnetic seal 1.
It is hermetically sealed by 0.

【0004】前記ガイド軸4,5には昇降基板11がガ
イドブロック12を介して摺動自在に嵌合し、又前記昇
降基板11は螺子ブロック13を介して前記螺子軸6に
螺合している。
An elevating board 11 is slidably fitted to the guide shafts 4 and 5 via a guide block 12, and the elevating board 11 is screwed to the screw shaft 6 via a screw block 13. There is.

【0005】前記昇降基板11には3関節リンク構造の
搬送ロボット14が設けられている。該搬送ロボット1
4は前記昇降基板11下面に設けられたモータ15が設
けられ、該モータ15の出力軸に第1節アーム16が嵌
着され、又第1節アーム16には第2節アーム17が、
又第2節アーム17には第3節アーム18が順次連結さ
れ、該第3節アーム18の先端は基板19が載置される
様になっている。
The elevator board 11 is provided with a transfer robot 14 having a three-joint link structure. The transfer robot 1
Reference numeral 4 denotes a motor 15 provided on the lower surface of the elevating board 11, a first joint arm 16 is fitted to the output shaft of the motor 15, and a second joint arm 17 is attached to the first joint arm 16.
A third joint arm 18 is sequentially connected to the second joint arm 17, and a substrate 19 is placed on the tip of the third joint arm 18.

【0006】前記モータ15の出力軸は2重軸構造であ
り、2重軸の一方が前記第1節アーム16に固着され、
又2重軸の他方がベルト等を介して前記第2節アーム1
7の回転軸に連結され、更に該第2節アーム17の回転
軸は前記第3節アーム18の回転軸にベルト等を介して
連結されている。尚、前記2重軸の回転部分には磁気シ
ール(図示せず)が設けられている。
The output shaft of the motor 15 has a double shaft structure, and one of the double shafts is fixed to the first joint arm 16.
Further, the other of the double shafts has the second joint arm 1 through a belt or the like.
7, the rotation shaft of the second joint arm 17 is connected to the rotation shaft of the third joint arm 18 via a belt or the like. A magnetic seal (not shown) is provided on the rotating portion of the double shaft.

【0007】而して、前記モータ15は第1節アーム1
6、第2節アーム17、第3節アーム18全体をモータ
15の2重軸を中心に回転させ得ると共に第1節アーム
16、第2節アーム17、第3節アーム18を屈伸さ
せ、第3節アーム18の姿勢を変えることなく進退させ
得る構成となっている。又、前記モータ駆動部9により
前記螺子軸6を回転させることで前記第1節アーム1
6、第2節アーム17、第3節アーム18、昇降基板1
1等、即ち搬送ロボット14が昇降する。
Thus, the motor 15 is the first joint arm 1
6, the second joint arm 17 and the third joint arm 18 as a whole can be rotated about the double shaft of the motor 15, and the first joint arm 16, the second joint arm 17, and the third joint arm 18 are bent and extended to The three-joint arm 18 can be moved back and forth without changing its posture. Further, by rotating the screw shaft 6 by the motor drive unit 9, the first joint arm 1
6, second joint arm 17, third joint arm 18, lift board 1
1, etc., that is, the transfer robot 14 moves up and down.

【0008】前記第3節アーム18の進退、昇降基板1
1の昇降の協働で基板19の立体的な搬送が可能とな
る。
Advancement / retreat of the third joint arm 18 and elevation substrate 1
The three-dimensional transportation of the substrate 19 is possible by the cooperation of the lifting and lowering of 1.

【0009】搬送の態様を図7、図8により説明する。The mode of conveyance will be described with reference to FIGS. 7 and 8.

【0010】図7は前記真空容器1に代わる真空搬送室
21の一面に複数の処理室22a,22b,22c,2
2d,22eが上下に連設され、前記真空搬送室21の
前記一面に対峙する面にロードロック室23a,23b
が上下に設けられ、前記搬送ロボット14は真空搬送室
21内に収納されている。
FIG. 7 shows a plurality of processing chambers 22a, 22b, 22c, 2 on one surface of a vacuum transfer chamber 21 which replaces the vacuum container 1.
2d and 22e are vertically arranged in series, and load lock chambers 23a and 23b are provided on a surface of the vacuum transfer chamber 21 that faces the one surface.
Are provided above and below, and the transfer robot 14 is housed in a vacuum transfer chamber 21.

【0011】前記第3節アーム18の進退、前記第1節
アーム16の180°回転、前記昇降基板11の昇降で
前記ロードロック室23a,23bと処理室22a,2
2b,22c,22d,22eとの間での基板19の搬
送が可能となる。
By moving the third joint arm 18 back and forth, rotating the first joint arm 180 °, and moving the elevating substrate 11 up and down, the load lock chambers 23a and 23b and the processing chambers 22a and 2a.
The substrate 19 can be transported between the 2b, 22c, 22d, and 22e.

【0012】図8は真空搬送室26が対峙する2組の面
を有し(図は平面形状が6角を示している)、1組の対
峙する2面に複数の処理室22a,22b,22c,2
2d,22e、及びロードロック室23を設け、もう1
組の面に複数の処理室24a,24b,24c,24
d,24e及びロードロック室25を設け、処理室22
a,22b,22c,22d,22e、ロードロック室
23、処理室24a,24b,24c,24d,24
e、ロードロック室25を放射状に配設したものであ
る。
In FIG. 8, the vacuum transfer chamber 26 has two sets of surfaces facing each other (the plan view shows a hexagonal shape), and one set of two facing surfaces has a plurality of processing chambers 22a, 22b. 22c, 2
2d, 22e and load lock chamber 23 are provided, and another
A plurality of processing chambers 24a, 24b, 24c, 24 on the set surface
d, 24e and the load lock chamber 25 are provided, and the processing chamber 22
a, 22b, 22c, 22d, 22e, load lock chamber 23, processing chambers 24a, 24b, 24c, 24d, 24
e, the load lock chambers 25 are arranged radially.

【0013】而して、図8に於ける構成に於いても、前
記第3節アーム18の進退、前記第1節アーム16の回
転、前記昇降基板11の昇降で、前記ロードロック室2
3,25と処理室22a,22b,22c,22d,2
2e、処理室24a,24b,24c,24d,24e
との間での基板19の搬送が可能となる。
In the structure shown in FIG. 8, the load lock chamber 2 is moved by moving the third joint arm 18 back and forth, rotating the first joint arm 16 and raising and lowering the elevating board 11.
3, 25 and processing chambers 22a, 22b, 22c, 22d, 2
2e, processing chambers 24a, 24b, 24c, 24d, 24e
It is possible to transfer the substrate 19 between and.

【0014】[0014]

【発明が解決しようとする課題】半導体の製造に於い
て、清浄雰囲気は高品質の半導体を得る為には必要不可
欠である。上記した従来の基板搬送装置では昇降基板1
1の垂直移動機構部のガイド軸4,5、螺子軸6、回転
軸受7,8等の摺動部、可動部が真空容器1内に設けら
れ露出している為、摺動部、可動部からの発塵、汚染が
有り、問題となっていた。
In the manufacture of semiconductors, a clean atmosphere is indispensable for obtaining high quality semiconductors. In the above-mentioned conventional substrate transfer device, the lifting substrate 1
The sliding parts, such as the guide shafts 4, 5, the screw shaft 6, and the rotary bearings 7, 8 of the vertical movement mechanism part 1 and the movable part are provided in the vacuum container 1 and are exposed. There was dust and pollution from the building, which was a problem.

【0015】又、処理室、ロードロック室の数を増やす
と処理室、ロードロック室の配置は真空搬送室26に対
して放射状とならざるを得ず基板搬送装置を含むシステ
ムの占有面積が大きくなっていた。
Further, when the number of processing chambers and load lock chambers is increased, the arrangement of the processing chambers and load lock chambers is inevitably radial with respect to the vacuum transfer chamber 26, and the occupied area of the system including the substrate transfer device is large. Was becoming.

【0016】本発明は斯かる実情に鑑み、真空容器内に
摺動部を有さない基板搬送装置を提供し、真空容器内で
の発塵、汚染を防止し、更に装置の占有面積を小さくし
ようとするものである。
In view of the above situation, the present invention provides a substrate transfer device having no sliding portion in the vacuum container, preventing dust generation and contamination in the vacuum container, and further reducing the occupied area of the device. Is what you are trying to do.

【0017】[0017]

【課題を解決するための手段】本発明は、垂直面に3関
節リンク構造の昇降用ロボットを設け、該昇降用ロボッ
トの先端に位置する昇降第3アームに3関節リンク構造
の搬送ロボットを設け、該搬送ロボットの先端に位置す
る第3節アームが基板を保持可能とした基板搬送装置、
更に基側に位置する前記昇降用ロボットの昇降第1アー
ムが嵌着する回転軸を軸心方向に出入り可能とした基板
搬送装置に係るものであり、回転の合成で搬送作動を行
い、摺動部がないので発塵が極めて少なく、又昇降用ロ
ボットの昇降第1アームが嵌着する回転軸を軸心方向に
出入り可能とすることで搬送範囲が広がると共に搬送ロ
ボットの水平方向の平行移動が可能となり、基板搬送装
置を含むシステムの構成が簡潔となる。
According to the present invention, a lifting robot having a three-joint link structure is provided on a vertical surface, and a transfer robot having a three-joint link structure is provided on a third lifting / lowering arm located at the tip of the lifting robot. A substrate transfer device capable of holding a substrate by a third joint arm located at the tip of the transfer robot,
Further, the present invention relates to a substrate transfer device in which a rotary shaft to which the first lifting arm of the lifting robot located at the base side is fitted can be moved in and out in the axial direction. Since there is no part, dust generation is extremely small, and the rotation axis on which the lifting first arm of the lifting robot fits can be moved in and out in the axial direction to widen the transport range and to move the transport robot in parallel in the horizontal direction. This enables the configuration of the system including the substrate transfer device to be simple.

【0018】[0018]

【発明の実施の形態】以下、図面を参照しつつ本発明の
実施の形態を説明する。
BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

【0019】尚、図1中、図4中で示したものと同様の
ものには同符号を付してある。
In FIG. 1, the same components as those shown in FIG. 4 are designated by the same reference numerals.

【0020】真空容器1の側壁面27に3関節リンク構
造の昇降用ロボット28を設け、該昇降用ロボット28
のアーム先端に搬送ロボット14を設ける。
An elevating robot 28 having a three-joint link structure is provided on the side wall surface 27 of the vacuum container 1, and the elevating robot 28 is provided.
The transfer robot 14 is provided at the tip of the arm.

【0021】前記昇降用ロボット28は前記搬送ロボッ
ト14と同様な構成を有し、昇降用モータ30の出力軸
に昇降第1アーム31が嵌着され、又該昇降第1アーム
31には昇降第2アーム32が、又該昇降第2アーム3
2には昇降第3アーム33が順次連結されている。該昇
降第3アーム33は上記した従来例の昇降基板11に相
当し、前記昇降第3アーム33に搬送ロボット14が設
けられている。該搬送ロボット14については従来例と
同様であるので説明を省略する。尚、前記昇降用モータ
30の2重軸の回転部分には磁気シールが設けられてい
る。
The ascending / descending robot 28 has a structure similar to that of the transfer robot 14. An elevating / lowering first arm 31 is fitted to an output shaft of an ascending / descending motor 30, and the ascending / descending first arm 31 has an elevating / lowering first arm 31. 2 arm 32 is also used for the lifting second arm 3
An elevating third arm 33 is sequentially connected to 2. The lifting / lowering third arm 33 corresponds to the lifting / lowering substrate 11 of the conventional example described above, and the transfer robot 14 is provided on the lifting / lowering third arm 33. Since the transfer robot 14 is the same as the conventional example, its description is omitted. A magnetic seal is provided on the rotating portion of the double shaft of the lifting motor 30.

【0022】前記昇降用モータ30を駆動することで、
前記昇降第1アーム31、昇降第2アーム32が上下方
向に伸縮し、前記昇降第3アーム33が水平を保持して
昇降し、又前記昇降第3アーム33を任意の位置で保持
可能である。更に、前記モータ15を駆動することで前
記第3節アーム18が水平方向に進退する。而して、前
記昇降用ロボット28と搬送ロボット14との協動によ
り図7、図8で示す搬送作動が可能となる。
By driving the lifting motor 30,
The elevating and lowering first arm 31 and the elevating and lowering second arm 32 extend and contract in the vertical direction, the elevating and lowering third arm 33 can be raised and lowered while keeping horizontal, and the elevating and lowering third arm 33 can be held at an arbitrary position. . Further, by driving the motor 15, the third joint arm 18 advances and retracts in the horizontal direction. Thus, by the cooperation of the lifting robot 28 and the transfer robot 14, the transfer operation shown in FIGS. 7 and 8 can be performed.

【0023】図3は本発明の他の実施の形態を示してお
り、前記昇降第1アーム31が嵌着する回転2重軸34
を軸心方向に出入り可能とし、該回転2重軸34の側壁
面27を貫通する部分にベローズを設け、回転2重軸3
4の貫通箇所を気密とする。
FIG. 3 shows another embodiment of the present invention, in which the rotating double shaft 34 to which the lifting first arm 31 is fitted.
Can be moved in and out in the axial direction, and a bellows is provided at a portion penetrating the side wall surface 27 of the rotary double shaft 34.
The penetration point of 4 is made airtight.

【0024】前記昇降用モータ30により回転2重軸3
4を突出、引込みすることで昇降第3アーム33を画搬
送ロボット14の進退方向と直角方向に水平移動する。
従って、搬送ロボット14の進退作動、前記昇降用ロボ
ット28の昇降作動に加えて、前記回転2重軸34の入
出作動との協動で更に立体的な搬送作動が可能となる。
Double shaft 3 rotated by the lifting motor 30
By projecting and retracting 4 the third lifting / lowering arm 33 is horizontally moved in the direction perpendicular to the forward / backward direction of the image transfer robot 14.
Therefore, in addition to the advancing / retreating operation of the transfer robot 14 and the elevating / lowering operation of the lifting / lowering robot 28, a three-dimensional transfer operation can be performed in cooperation with the moving-in / out operation of the rotating double shaft 34.

【0025】図5、図6に於いて前記回転2重軸34の
入出作動を加えた搬送態様について説明する。
A conveyance mode in which the rotary double shaft 34 is moved in and out will be described with reference to FIGS. 5 and 6.

【0026】図5に於いて、真空搬送室21の一面に上
下方向に2列をなす処理室22a,22b,22c,2
2d,22e、処理室24a,24b,24c,24
d,24eが連設され、前記真空搬送室21の前記一面
に対峙する面にロードロック室23a,23bが上下に
設けられ、前記搬送ロボット14は真空搬送室21内に
収納されている。
In FIG. 5, the processing chambers 22a, 22b, 22c, 2 arranged in two rows in the vertical direction on one surface of the vacuum transfer chamber 21.
2d, 22e, processing chambers 24a, 24b, 24c, 24
d and 24 e are connected in series, load lock chambers 23 a and 23 b are vertically provided on a surface of the vacuum transfer chamber 21 facing the one surface, and the transfer robot 14 is housed in the vacuum transfer chamber 21.

【0027】前記第3節アーム18の進退、前記第1節
アーム16の180°回転、前記昇降基板11の昇降、
及び前記回転2重軸34の入出で、基板19を保持する
前記第3節アーム18が水平方向、垂直方向のいずれに
もクランク状の動きが可能となり、図5(A)(B)中
矢印で示す搬送作動が可能となる。
Advancing and retracting the third joint arm 18, rotating the first joint arm 180 by 180 °, elevating the elevating board 11.
Also, when the rotary double shaft 34 moves in and out, the third joint arm 18 holding the substrate 19 can move in a crank shape in both horizontal and vertical directions. The conveyance operation shown by can be performed.

【0028】又、図6に示す様に処理室22a,22
b,22c,22d,22eの列に対してロードロック
室23を設け、処理室24a,24b,24c,24
d,24eの列に対してロードロック室25をそれぞれ
設けたものであり、本処理室、ロードッロック室の配置
に対しても、ロードロック室23、ロードロック室25
の任意の一方と処理室22a,22b,22c,22
d,22e、処理室24a,24b,24c,24d,
24eの任意の1つとの間で基板19の搬送が可能とな
る。尚、上記昇降用ロボット28は側壁面27に限らず
垂直な面に設けられればよい。
Further, as shown in FIG. 6, the processing chambers 22a, 22
The load lock chamber 23 is provided for each of the rows b, 22c, 22d, and 22e, and the process chambers 24a, 24b, 24c, and 24 are provided.
The load lock chamber 25 is provided for each of the rows d and 24e, and the load lock chamber 23 and the load lock chamber 25 are also arranged for the main processing chamber and the load lock chamber.
And any one of the processing chambers 22a, 22b, 22c, 22
d, 22e, processing chambers 24a, 24b, 24c, 24d,
It is possible to transfer the substrate 19 to and from any one of 24e. The lifting robot 28 is not limited to the side wall surface 27 and may be provided on a vertical surface.

【0029】[0029]

【発明の効果】以上述べた如く本発明によれば、水平作
動が3関節リンク構成の搬送ロボットによりなされ、又
昇降作動が3関節リンク構成の昇降用ロボットによりな
され、いずれもアームの回転の合成で動きが構成され、
摺動部が真空容器内に存在しないので発塵、汚染が大幅
に低減する。又、昇降用ロボットに水平移動機能を持た
せることで搬送態様の多様化が可能となり、又基板搬送
装置に対する処理室等の配置が簡略化しシステムの占有
面積が小さくなる等の優れた効果を発揮する。
As described above, according to the present invention, the horizontal operation is performed by the transfer robot having the three-joint link structure, and the elevating operation is performed by the ascending / descending robot having the three-joint link structure. The movement is composed of
Since the sliding part does not exist in the vacuum container, dust generation and contamination are greatly reduced. Also, by providing the lifting robot with the horizontal movement function, it becomes possible to diversify the transfer mode, and the arrangement of the processing chamber and the like with respect to the substrate transfer device is simplified and the system occupying area is reduced, which is an excellent effect. To do.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施の形態を示す正面方向からの斜視
説明図である。
FIG. 1 is an explanatory perspective view from the front direction showing an embodiment of the present invention.

【図2】同前実施の形態を示す側面方向からの斜視説明
図である。
FIG. 2 is an explanatory perspective view from the side direction showing the embodiment.

【図3】本発明の他の実施の形態を示す正面方向からの
斜視説明図である。
FIG. 3 is a perspective explanatory view from the front direction showing another embodiment of the present invention.

【図4】従来例を示す正面方向からの斜視説明図であ
る。
FIG. 4 is an explanatory perspective view from the front direction showing a conventional example.

【図5】(A)(B)は本発明の実施の形態に於ける搬
送態様を示す説明図である。
5 (A) and 5 (B) are explanatory views showing a conveyance mode in the embodiment of the present invention.

【図6】(A)(B)は本発明の実施の形態に於ける他
の搬送態様を示す説明図である。
6 (A) and 6 (B) are explanatory views showing another conveyance mode in the embodiment of the present invention.

【図7】基板搬送装置の搬送態様の一例を示す説明図で
ある。
FIG. 7 is an explanatory diagram showing an example of a carrying mode of the substrate carrying apparatus.

【図8】基板搬送装置の搬送態様の他の例を示す説明図
である。
FIG. 8 is an explanatory diagram showing another example of the carrying mode of the substrate carrying apparatus.

【符号の説明】[Explanation of symbols]

1 真空容器 14 搬送ロボット 15 モータ 16 第1節アーム 17 第2節アーム 18 第3節アーム 19 基板 31 昇降第1アーム 32 昇降第2アーム 33 昇降第3アーム 34 回転2重軸 1 Vacuum Container 14 Transfer Robot 15 Motor 16 First Section Arm 17 Second Section Arm 18 Third Section Arm 19 Substrate 31 Elevating First Arm 32 Elevating Second Arm 33 Elevating Third Arm 34 Rotating Double Axis

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 垂直面に3関節リンク構造の昇降用ロボ
ットを設け、該昇降用ロボットの先端に位置する昇降第
3アームに3関節リンク構造の搬送ロボットを設け、該
搬送ロボットの先端に位置する第3節アームが基板を保
持可能としたことを特徴とする基板搬送装置。
1. A lifting robot having a three-joint link structure is provided on a vertical surface, a transfer robot having a three-joint link structure is provided at a lifting third arm located at the tip of the lifting robot, and the robot is positioned at the tip of the transfer robot. A substrate transfer device characterized in that the third section arm is capable of holding a substrate.
【請求項2】 基側に位置する昇降用ロボットの昇降第
1アームが嵌着する回転軸を軸心方向に出入り可能とし
た請求項1の基板搬送装置。
2. The substrate transfer apparatus according to claim 1, wherein a rotating shaft to which the first lifting / lowering arm of the lifting / lowering robot located on the base side is fitted can move in and out in the axial direction.
JP26346695A 1995-09-18 1995-09-18 Wafer transfer device Pending JPH0982780A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26346695A JPH0982780A (en) 1995-09-18 1995-09-18 Wafer transfer device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26346695A JPH0982780A (en) 1995-09-18 1995-09-18 Wafer transfer device

Publications (1)

Publication Number Publication Date
JPH0982780A true JPH0982780A (en) 1997-03-28

Family

ID=17389908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26346695A Pending JPH0982780A (en) 1995-09-18 1995-09-18 Wafer transfer device

Country Status (1)

Country Link
JP (1) JPH0982780A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1142674A3 (en) * 2000-04-07 2002-07-24 Kawasaki Jukogyo Kabushiki Kaisha Robot system for transferring workpieces along a straight line
JP2002210684A (en) * 2000-11-14 2002-07-30 Daihen Corp Transfer robot
WO2002082507A1 (en) * 2001-04-06 2002-10-17 Wafermasters, Inc. Wafer handling system and apparatus
WO2012001318A1 (en) * 2010-07-01 2012-01-05 Universite Pierre Et Marie Curie (Paris 6) Sealed mechanism for transmitting movements for a confined chamber, and system for the vacuum-deposition of a material on a substrate
CN108247675A (en) * 2018-03-21 2018-07-06 东莞市特力精密夹具有限公司 A kind of air-cylinder type multiaxis combined machine arm system
WO2022070952A1 (en) * 2020-09-29 2022-04-07 東京エレクトロン株式会社 Substrate processing apparatus, conveyance mechanism and substrate processing method

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1142674A3 (en) * 2000-04-07 2002-07-24 Kawasaki Jukogyo Kabushiki Kaisha Robot system for transferring workpieces along a straight line
US6570356B2 (en) 2000-04-07 2003-05-27 Kawasaki Jukogyo Kabushiki Kaisha Robot system
JP2002210684A (en) * 2000-11-14 2002-07-30 Daihen Corp Transfer robot
JP4558981B2 (en) * 2000-11-14 2010-10-06 株式会社ダイヘン Transfer robot
WO2002082507A1 (en) * 2001-04-06 2002-10-17 Wafermasters, Inc. Wafer handling system and apparatus
WO2012001318A1 (en) * 2010-07-01 2012-01-05 Universite Pierre Et Marie Curie (Paris 6) Sealed mechanism for transmitting movements for a confined chamber, and system for the vacuum-deposition of a material on a substrate
FR2962065A1 (en) * 2010-07-01 2012-01-06 Univ Paris Curie MOVEMENT TRANSMISSION SEALING MECHANISM FOR A CONFINED ENCLOSURE AND ENCLOSURE PROVIDED WITH SUCH A MECHANISM.
CN108247675A (en) * 2018-03-21 2018-07-06 东莞市特力精密夹具有限公司 A kind of air-cylinder type multiaxis combined machine arm system
WO2022070952A1 (en) * 2020-09-29 2022-04-07 東京エレクトロン株式会社 Substrate processing apparatus, conveyance mechanism and substrate processing method

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