JP4645696B2 - Support mechanism and load lock chamber of workpiece - Google Patents

Description

The present invention relates to a support mechanism and the load lock chamber of the target used when transporting this to perform a predetermined process on a target such as a semiconductor wafer.

  Generally, in order to manufacture a semiconductor integrated circuit, various processes such as film formation, etching, oxidation, and diffusion are performed on a wafer. In order to improve throughput and yield by miniaturization and high integration of a semiconductor integrated circuit, a plurality of processing apparatuses performing the same process or a plurality of processing apparatuses performing different processes are connected through a common transfer chamber. A so-called clustered processing system apparatus, which is coupled to each other and enables continuous processing of various processes without exposing the wafer to the atmosphere, is disclosed in, for example, Japanese Patent Laid-Open Nos. 2000-208589 and 2000-299367. As already disclosed.

In this case, in order to transport the semiconductor wafer in the clustered processing system apparatus as described above, for example, from the cassette to the processing apparatus side or vice versa, the processing system apparatus normally has a bending / stretching process. A plurality of transfer arms that can be turned, rotated, or moved horizontally are provided, and the semiconductor wafer is transferred by sequentially transferring between the transfer arms.
In general, when a wafer is transferred between transfer arms, the wafer is not directly transferred between transfer arms, but is temporarily transferred to a support mechanism for raising and lowering the wafer or a buffer table having this support mechanism. The wafers are held and the wafers are sequentially transferred through the support mechanism and the buffer base.

Also, depending on the processing mode of the wafer, in the transfer chamber provided in the middle of transfer, there is a case where the wafer is temporarily retracted and other wafers may be preferentially transferred. In some cases, a support mechanism or a buffer base as described above is provided, and the wafer is retracted while holding the wafer.
Such a support mechanism and buffer base are disclosed in, for example, Japanese Patent Laid-Open Nos. 4-69917, 9-223727, 2001-176947, and the like.

By the way, when a semiconductor wafer is handled, for example, when a film forming process is taken as an example, a processed semiconductor wafer may have a thin film attached to the back surface as well as the front surface. When an unprocessed semiconductor wafer is handled by bringing the lift pins and the like into direct contact, the unprocessed semiconductor wafer may be contaminated by film pieces attached to the lift pins and the like.
In addition, the apparatus examples disclosed in each of the above-mentioned publications have two lifters for moving the wafer up and down. However, when transferring the wafer, these two lifters are used simultaneously. Therefore, it is difficult to use with a high degree of freedom according to the situation.
The present invention has been devised to pay attention to the above problems and to effectively solve them. An object of the present invention is to provide a support mechanism and a load lock chamber for an object to be processed that can be used alternatively according to the situation.

The related art of the present invention includes a plurality of elevating bases that are individually connected to elevating rods of a plurality of elevating actuators and can be moved up and down in the support mechanism of the object to be processed for transferring the object to be processed, Each lift base includes a plurality of lift pins that stand up from the lift base and support the object to be processed, and a lift control unit that controls the lift actuator independently. The lift pins of the lift bases are substantially in horizontal coordinates. The lift control unit controls the lift actuator so that lift pins of the lift bases alternatively support the target object. This is a support mechanism for the object to be processed.
As a result, a plurality of lift actuators are individually provided with lift bases, and these can be lifted independently, so that the object to be processed is supported by lift pins provided on the lift base. The lifting base can be used alternatively, for example, it is possible to distinguish and use the lifting base dedicated to the unprocessed object and the lifting base dedicated to the processed object Become. As a result, the degree of freedom in handling the object to be processed can be increased.

In this case, for example, pre-Symbol lift pins are provided at least three with respect to the elevating base.
In the related art of the present invention, in the support mechanism for the object to be processed for transferring the object to be processed, it is individually connected to the lifting rods of a plurality of lifting actuators and can be moved up and down. A plurality of elevating bases for supporting the processing object and an elevating control unit for independently controlling each elevating actuator, and each elevating base can support the object to be processed in substantially the same region in horizontal coordinates. The elevating control unit controls the elevating actuator so that each elevating base alternatively supports the object to be processed. As a result, the lifting bases are individually provided to the plurality of lifting actuators, and these can be lifted and lowered independently, so that the workpiece is supported by the lifting base. For example, it is possible to distinguish between a lifting base used exclusively for an untreated object and a lifting base used exclusively for a processed object. As a result, the degree of freedom in handling the object to be processed can be increased.

Further, for example, pre-Symbol each elevating base is arranged so as not to overlap each other in plan view in order not to interfere with each other with respect to movement in the vertical direction.
In this case, since the elevating bases are arranged so as not to overlap with each other in plane, the vertical size can be reduced. Therefore, when the support mechanism is arranged in an airtight chamber that can be evacuated, this air The size of the closed chamber in the vertical direction can be reduced, and the time required for evacuation can be shortened.
Further, for example, pre-Symbol each elevating base is provided in an airtight chamber that is adapted to be evacuated, each lifting rod, together with the provided by penetrating the bottom of the airtight chamber, the through portion of the bottom In order to maintain the airtightness in the airtight chamber, a bellows that can be expanded and contracted is interposed.

According to the first aspect of the present invention, in the support mechanism of the object to be processed for transferring the object to be processed, the support mechanism of the object to be processed is connected to the first lifting rod of the first lifting actuator so as to be movable up and down, and on the upper surface thereof, A first elevating base for supporting the object to be processed; a second elevating base disposed below the first elevating base and connected to a second elevating rod of a second elevating actuator; Elevating control for standing up from the elevating base and extending the tip of the elevating base to the upper side of the first elevating base and independently controlling the plurality of lift pins that support the object to be processed and the first and second elevating actuators. and a section, wherein with being made to the coaxial structure and the first lift rod and said second lifting rod, said first elevating base and the lift pin support friendly said workpiece in a horizontal state The lift control unit controls the first and second lift actuators such that the first lift base or the lift pin selectively supports the process target. It is a support mechanism.
According to a second aspect of the present invention, in the support mechanism for the object to be processed for transferring the object to be processed, a first elevating base connected to the first elevating rod of the first elevating actuator and capable of moving up and down; A plurality of first lift pins that are erected from the first elevating base and whose tips support the object to be processed, are disposed below the first elevating base, and are connected to a second elevating rod of a second elevating actuator. And a plurality of second lift pins that are erected from the second lift base and have tips that extend above the first lift base and support the object to be processed at the tips. And an elevating control unit that independently controls the first and second elevating actuators, and the first elevating rod and the second elevating rod have a coaxial structure, and the first and second elevating rods Each of the two lift pins can support the object to be processed in a horizontal state, and the elevating control unit can support the object to be processed such that the first lift pin or the second lift pin alternatively supports the object to be processed. 1. A support mechanism for an object to be processed, wherein the first and second lift actuators are controlled.
In this case, for example , as defined in claim 3, the coaxial structure is rotatable.

In the related art of the present invention, in the support mechanism for the object to be processed that holds the object to be moved up and down in order to transfer the object to be processed, there are a plurality of arrangements arranged below the raising / lowering region that raises and lowers the object to be processed. The lift actuators are provided on the lift rods of the plurality of lift actuators, the tip of the lift pins that support the object to be processed, and the plurality of lift actuators are divided into a plurality of groups, and each group is independent. The lift actuators in the same group are controlled to be synchronized with each other, and the lift pins can support the workpieces in substantially the same area in the horizontal coordinate. The elevating control unit controls the elevating actuator so that the lift pins selectively support the object to be processed for each group. It is a supporting mechanism of the object to be processed, wherein.
As a result, lift pins are individually provided for a plurality of lift actuators, and the lift pins can be operated independently for each group, and are lifted and lowered simultaneously within the group. The lift pins can be used alternatively. For example, it is possible to distinguish between a lift pin group used for an unprocessed object and a lift pin group used for a processed object.

In this case, for example , at least six lifting actuators are provided, and the one group includes at least three lifting actuators.
Further, each of the lift pins if example embodiment are arranged in a substantially substantially equal pitch intervals on the same circumference in each group.
Further, for example, each lift pin is provided in an airtight chamber that can be evacuated, and each lifting rod is provided so as to penetrate the bottom of the airtight chamber, and the airtight chamber is provided in a through portion of the bottom. In order to maintain the airtightness of the room, a bellows that can be expanded and contracted is interposed.

In the related art of the present invention, in the support mechanism of the object to be processed that holds and moves the object to be processed to transfer the object to be processed, it can be moved up and down individually connected to the lifting rods of a plurality of lifting actuators. And a plurality of lift bases whose upper surfaces support the object to be processed, and lift rods of a plurality of lift actuators, each of which has a plurality of lift pins that support the object to be processed, The lifting actuators are divided into a plurality of groups so that the lifting actuator of one lifting base and the lifting actuator of the one lift pin belong to the same group, and are controlled to be operable independently for each group. The lift actuators in the group include a lift control unit that controls the lift actuators synchronously, and the lift bases and the lift pins are The object to be processed can be supported in substantially the same region in a plane coordinate, and the elevating control unit is configured so that each elevating base and each lift pin alternatively support the object to be processed for each group. And a lifting mechanism for controlling the lift actuator.

  As a result, the lift base and lift pins are individually provided on the plurality of lift actuators, and the combination of these can be lifted independently, thereby supporting the object to be processed by the combination of the lift base and the lift pins. Therefore, depending on the situation, the combination of the lift base and the lift pin can be used alternatively.For example, the combination of the lift base and the lift pin used exclusively for the unprocessed object and the processed object to be processed On the other hand, it is possible to distinguish and use the combination of the lift base and lift pins used exclusively. As a result, the degree of freedom in handling the object to be processed can be increased.

In this case, for example, the elevating bases are arranged so as not to overlap each other in plan view so as not to interfere with the movement in the vertical direction.
Further, for example, as specified in請Motomeko 4, wherein each of the elevating base and the lift pins are provided in an airtight chamber that is adapted to be evacuated, each lift rod through the bottom of the airtight chamber In addition, a bellows that can be expanded and contracted to maintain airtightness in the airtight chamber is interposed in the through portion of the bottom portion.
Further, for example, as prescribed in請Motomeko 5, wherein arranged outside the lifting region of the object to be processed, a pair of auxiliary lifting rod is adapted to be movable up and down, the respectively connected to each auxiliary lifting rods And a pair of auxiliary object support plates that extend in the horizontal direction and hold the upper surface thereof in direct contact with the rear surface of the object to be processed.
According to this, it becomes possible to support another to-be-processed object with a pair of auxiliary | assistant to-be-processed object support plate, and can further improve the freedom degree of the handling of a to-be-processed object.
請Motomeko 6 engaging Ru invention, with an external transfer chamber, if necessary with the vacuum atmosphere and atmospheric pressure are joined and through the gate valve is adapted to be opened and closed hermetically at both ends-option load lock, characterized in that it comprises an intermediate transfer chamber which can be set one manner, and a support mechanism of the object to be processed according to any one of the intermediate conveyance claim was provided in the indoor 1乃Itaru 5 It is a room.

The related art of the present invention is a method for supporting a target object using the support mechanism for the target object, wherein the number of the target objects supported by the lift bases or the lift pins supporting the target objects. Are controlled so as to be substantially equal to each other.
A related art of the present invention is a method of supporting a target object using the support mechanism of the target object, wherein each of the lift bases or each lift pin that supports the target object according to the state of the target object Is a method for supporting an object to be processed.

According to the support mechanism and load lock chamber of the object to be processed of the present invention, the following excellent operational effects can be exhibited.
Lift pins by the present invention lever, first individually to a plurality of elevating and a second temperature descending base provided by the these independently liftable, by elevating base itself, or provided on the lift base In order to support the object to be processed, the lifting base can be used alternatively according to the situation, for example, the lifting base used exclusively for the unprocessed object and the processed object to be processed Therefore, it is possible to distinguish and use the lifting base used exclusively. As a result, the degree of freedom in handling the object to be processed can be increased.
In particular, according to the invention according to claim 6, it is possible to support another object to be processed by the pair of auxiliary object-supporting plates, and to further improve the degree of freedom in handling the object to be processed. .
According to the related art of the present invention , a plurality of lift actuators are individually provided with lift bases, and these can be lifted and lowered independently to support the object to be processed by the lift base. The lift base can be used alternatively according to the type of the lift. For example, the lift base used exclusively for the untreated object and the lift base used exclusively for the processed object should be used separately. Is possible. As a result, the degree of freedom in handling the object to be processed can be increased.

According to the related art of the present invention, since the elevating bases are arranged so as not to overlap in a plane, the size in the vertical direction can be reduced. Therefore, when the support mechanism is arranged in an airtight chamber that can be evacuated. The size of the hermetic chamber in the vertical direction can be reduced, and the time required for evacuation can be shortened.
According to the related technology of the present invention , lift pins are individually provided for a plurality of actuators, and the lift pins can be operated independently for each group, and are lifted and lowered simultaneously in the group. Accordingly, lift pins can be alternatively used for each group. For example, a lift pin group used for an unprocessed object to be processed and a lift pin group used for a processed object to be processed can be distinguished from each other.

According to the related art of the present invention , a plurality of lifting actuators are individually provided with a lifting base and a lift pin, and these combinations can be lifted independently, so that the object to be processed is combined with the lifting base and the lift pin. The combination of the lift base and the lift pin can be used alternatively according to the situation, for example, the combination of the lift base and the lift pin used exclusively for the untreated object and the processing It becomes possible to distinguish and use the combination of the lift base and lift pins used exclusively for the processed object. As a result, it is the child increases the degree of freedom of handling of the object.

Hereinafter, an embodiment of a support mechanism and a load lock chamber for an object to be processed according to the present invention will be described in detail with reference to the accompanying drawings.
<First embodiment>
First, a first embodiment of the present invention will be described.
FIG. 1 is a schematic plan view showing an example of a processing system having a support mechanism for an object to be processed according to the present invention, FIG. 2 is a cross-sectional view showing a transfer chamber having a load lock function to which the support mechanism is attached, and FIG. FIG. 4 is a plan view showing the support mechanism, and FIG. 5 is a partially enlarged view showing the mounting portion of the lifting rod of the support mechanism.
As shown in the figure, this processing system 2 includes a plurality of, for example, four processing apparatuses 4A, 4B, 4C, and 4D, a substantially hexagonal common transfer chamber 6, and first and second intermediate transfers having a load lock function. Chambers (load lock chambers) 8A, 8B, an elongated introduction-side transfer chamber 10, and support mechanisms 12A, 12B according to the first embodiment of the present invention provided in the intermediate transfer chambers 8A, 8B. Have. The common transfer chamber 6 and the first and second intermediate transfer chambers 8A and 8B are airtight chambers that can be evacuated.

Specifically, the processing apparatuses 4A to 4D are joined to four sides of the substantially hexagonal common transfer chamber 6, and the first and second intermediate transfer chambers 8A and 8B are joined to the other two sides. Are joined together. The introduction-side transfer chamber 10 is commonly connected to the first and second intermediate transfer chambers 8A and 8B.
Between the common transfer chamber 6 and the four processing devices 4A to 4D and between the common transfer chamber 6 and the first and second intermediate transfer chambers 8A and 8B, each can be opened and closed in an airtight manner. The gate valves G1 to G4 and G5 and G6 are joined together to form a cluster tool, and can communicate with the common transfer chamber 6 as necessary. Further, between the first and second intermediate transfer chambers 8A and 8B and the introduction-side transfer chamber 10, gate valves G7 and G8 that are airtightly openable and closable are interposed.

  In the four processing apparatuses 4A to 4D, the same type or different types of processing are performed on the semiconductor wafer W which is the object to be processed. On one side of the common transfer chamber 6, the articulated joint can be bent, lifted and lowered and turned to a position where the two intermediate transfer chambers 8A and 8B and the four processing devices 4A to 4D can be accessed. A first transfer means 14 composed of an arm is provided, which has two picks 14A and 14B that can bend and stretch independently in opposite directions, and can handle two wafers at a time. It is like that. In addition, what has only one pick as said 1st conveyance means 14 can also be used.

The introduction-side transfer chamber 10 is formed of a horizontally long box through which inert gas such as N ₂ gas or clean air is circulated. In the illustrated example, a plurality of cassette bases 16A, 16B, and 16C are provided, and one cassette 18A to 18C can be placed on each of them. Each cassette 18A to 18C can accommodate, for example, a maximum of 25 wafers W placed in multiple stages at an equal pitch, and the inside has a sealed structure filled with, for example, an N ₂ gas atmosphere. . A wafer can be carried into and out of the introduction-side transfer chamber 10 through gate doors 20A, 20B, and 20C provided in correspondence with the cassette tables 16A to 16C.

In the introduction side transfer chamber 10, introduction side transfer means 22 for transferring the wafer W along its longitudinal direction is provided. The introduction-side conveyance means 22 is supported so as to be slidable on a guide rail 24 provided so as to extend along the length direction in the central portion in the introduction-side conveyance chamber 10. For example, a linear motor is incorporated in the guide rail 24 as a moving mechanism. By driving the linear motor, the introduction-side conveying means 22 moves in the X direction along the guide rail 24.
The other end of the introduction-side transfer chamber 10 is provided with an orienter 26 as an alignment device for aligning the wafers. Further, the two intermediate transfers are provided in the middle of the introduction-side transfer chamber 10 in the longitudinal direction. The chambers 8A and 8B are provided through the gate valves G7 and G8 that can be opened and closed, respectively.

The orienter 26 has a turntable 28 that is rotated by a drive motor (not shown), and rotates while the wafer W is placed thereon. An optical sensor 30 for detecting the peripheral edge of the wafer W is provided on the outer periphery of the turntable 28, so that the position direction and displacement of the notch and the orientation flat of the wafer W can be detected.
Further, the introduction-side transport means 22 has two transport arms 32 and 34 having a multi-joint shape arranged in two upper and lower stages. Bifurcated picks 32A and 34A are attached to the tips of the transfer arms 32 and 34, respectively, and the wafer W is directly held on the picks 32A and 34A. Accordingly, each of the transfer arms 32 and 34 can be bent and extended in the R direction from the center toward the radial direction, and the bending and extending operations of the transfer arms 32 and 34 can be individually controlled. The rotation axes of the transfer arms 32 and 34 are connected to the base 36 so as to be rotatable coaxially, and can rotate integrally in the θ direction, for example, a turning direction with respect to the base 36. ing.

Next, the support mechanisms 12A and 12B of the present invention provided in the intermediate transfer chambers 8A and 8B will be described.
Since both the support mechanisms 12A and 12B are formed in the same manner, one support mechanism, for example, the support mechanism 12A will be described as an example here.
As shown in FIGS. 2 to 4, the support mechanism 12A is formed of a plurality of thin, for example, aluminum or ceramic, for example, two elevating bases 38 formed by bending as shown by the numeral “7”. , 40. These lift bases 38 and 40 are arranged so as to be mutually incorporated in a bent portion so that they do not overlap each other in plan view so that they do not collide with each other and interfere when they move in the vertical direction. Has been.

A plurality of lift pins 38 </ b> A to 38 </ b> C and 40 </ b> A to 40 </ b> C in the illustrated example are provided to stand upward from each of the lift bases 38 and 40. These lift pins 38A to 38C and 40A to 40C are made of ceramics such as Al ₂ O _3, for example. As shown in FIG. 4, the lift pins 38A to 38C and 40A to 40C for each group are on the same circumference 42. The lift pins 38A to 38C and the tips of 40A to 40C are in direct contact with the back surface of the semiconductor wafer W so that the wafer W is set to have an equal pitch for each group. It can be supported. In FIG. 4, the lift pins 38 </ b> A to 38 </ b> C and 40 </ b> A to 40 </ b> C of both groups are arranged on the same circumference 42, but they may be arranged on different circumferences for each group. It should be noted that at least three lift pins are provided on the one lift base 38 or 40, respectively.

And below the bottom part 44 (refer FIG. 2) which divides this intermediate conveyance chamber 8A, the two raising / lowering actuators 46 and 48 are provided here according to the number of the said raising / lowering bases 38 and 40. As shown in FIG. The elevating rods 50 and 52 of the elevating actuators 46 and 48 are inserted through through holes 54 and 56 provided in the bottom portion 44, and their tips are attached and fixed to the lower surfaces of the elevating bases 38 and 40. . Thus, by driving the lifting actuators 46, 48, the lifting bases 38, 40 can be lifted up and down independently.
In addition, bellows 58 and 60 made of, for example, metal expandable / contractible bellows pipes are provided in the through portions of the lift rods 50 and 52 with respect to the bottom 44. Specifically, as shown in FIG. 5, the upper ends of the bellows 58, 60 are the lower surfaces of the lift bases 38, 40 with the lift rods 50, 52 inserted through the bellows 58, 60, respectively. The lower end of the bottom portion 44 is attached and fixed to the lower surface of the bottom portion 44 with a screw 66 through the seal member 62 and the attachment ring 64 while maintaining airtightness.

By attaching the bellows 58 and 60, the lifting rods 50 and 52 can be lifted and lowered while maintaining the airtightness in the intermediate transfer chamber 8A. The operations of the lift actuators 46 and 48 are controlled by a lift control unit 68 made of, for example, a microcomputer.
Further, for example, at the bottom of each of the intermediate transfer chambers 8A and 8B, an inert gas introduction port 70 such as N ₂ gas and an exhaust port 72 connected to a vacuum system (not shown) are provided. It can be set alternatively to the atmospheric pressure as required.

Next, the operation of the above processing system will be described.
First, a schematic flow of the semiconductor wafer W will be described. Any one of the three cassette tables 16A to 16C, for example, an unprocessed semiconductor wafer W from the cassette container 18C on the cassette table 16C is transferred to one of the transfer arms 22 of the introduction-side transfer means 22, for example, By driving the transfer arm 32, it is picked up and held by the pick 32 </ b> A, and the introduction side transfer means 22 is moved in the X direction to transfer the wafer W to the orienter 26.

Next, the unprocessed semiconductor wafer W on the turntable 26 which has already been transferred and aligned by the orienter 26 is picked up by the pick 34A by driving the other transfer arm 34 in the empty state. This holds the turntable 26 empty.
Next, the unprocessed wafer held on the pick 32 </ b> A of the transfer arm 32 is placed on the turntable 26 that has been emptied first. This wafer is aligned before another unprocessed wafer is transferred.
Next, the unprocessed wafer held by the other transfer arm 34 as described above is moved to either one of the two intermediate transfer chambers 8A and 8B by moving the introduction-side transfer means 22 in the X direction. To the intermediate transfer chamber, for example, 8A.

  On the lift pins of any one group in the intermediate transfer chamber 8A, for example, the lift pins 40A to 40C, a processed wafer that has already been subjected to a predetermined process such as a film forming process or an etching process in the processing apparatus. The intermediate transfer chamber 8A that has already been pressure-controlled is opened by opening the gate valve G7. First, the empty transfer arm 32 is driven to transfer and hold the processed wafer W waiting on the side of the pick 32A. Next, the other transfer arm 34 is driven to transfer the unprocessed wafer W held on the pick 34A onto the lift pins 38A to 38C of the other group and replace the wafer. The processed wafer is returned to the original cassette by the introduction side transfer means 22.

  As described above, when the unprocessed wafer W is transferred onto the lift pins 38A to 38C, the intermediate transfer chamber 8A is sealed by closing the gate valve G7, and then the intermediate transfer chamber 8A is evacuated. After the pressure is adjusted, the gate valve G5 is opened to communicate with the inside of the common transfer chamber 6 that has been previously in a vacuum atmosphere. The unprocessed wafer W is received by the first transfer means 14 in the common transfer chamber 6. At this time, since the first transfer means 14 has two picks 14A and 14B, when the processed wafer is held, the processed wafer and the unprocessed wafer are not processed. Replacement is performed.

The unprocessed wafer W is then subjected to necessary processing in turn, for example, in each of the processing apparatuses 4A to 4D. When the necessary processing is completed, the processed wafer W is returned to the original cassette through the reverse path as described above.
In this case, any of the two intermediate transfer chambers 8A and 8B may be passed, and when the processed wafer W is held in each of the intermediate transfer chambers 8A and 8B, the unprocessed wafer W is not processed. The lift pins 40 </ b> A to 40 </ b> C of a group different from the group that holds the wafer W are held to suppress contamination of the unprocessed wafer W by contaminants such as a thin film as much as possible.
Here, the delivery of the wafer W in the intermediate transfer chamber 8A will be specifically described. The wafer is similarly transferred in the other intermediate transfer chamber 8B.

In this embodiment, as described above, contamination of the wafer W is prevented by using lift pins of different groups for the unprocessed wafer W and the processed wafer W.
Here, for example, an unprocessed wafer W is supported exclusively by three lift pins 38A to 38C provided on one lift base 38 and processed by three lift pins 40A to 40C provided on the other lift base 40. The wafer W is supported exclusively. Specifically, a case where an unprocessed wafer W is introduced from the introduction-side transfer chamber 10 side and the processed wafer W is replaced with an unprocessed wafer will be described as an example. First, lift pins 40A to 40C of one lifting base 40 supporting the processed wafer W are raised, and empty lift pins 38A to 38C of the other lifting base 38 are lowered.

In this state, the empty pick 32A is advanced horizontally into the intermediate transfer chamber 8A and inserted below the processed wafer W being lifted (between the wafer W and the lift base 40). To do. Next, the processed wafer W is moved to the pick 32A side by lowering the lift pins 40A to 40C. Then, the pick 32A is retracted and removed from the intermediate transfer chamber 8A. Next, the other pick 34A holding the unprocessed wafer W is advanced horizontally into the intermediate transfer chamber 8A. Next, the other lift base 38 that has been lowered so far is lifted, and the unprocessed wafer W is pushed up and supported by the lift pins 38A to 38C so that the wafer W can be transferred. . Then, the pick 34A that has become empty is retracted and removed from the intermediate transfer chamber 8A.
Thus, the wafer W transferred from the first transfer means 14 or the introduction-side transfer means 22 to any one of the lift pins 38A to 38C or the lift pins 40A to 40C is subsequently transferred to the first transfer means 14 or the introduction side. Until it is transferred to the conveying means 22, it is continuously supported by the lift pins. That is, during this time, the other lift pin does not support the wafer W. In this regard, the embodiments described later are also the same.

In this way, the processed wafer W and the unprocessed wafer W can be replaced. In addition, when the wafer W is transferred between the common transfer chamber 6, the movement is basically the same as described above.
In this way, a plurality of, for example, two lift bases 38, 40 are provided, and a plurality of, for example, three lift pins 38A-38C, 40A-40C are provided on each lift base 38, 40, and one group of lift pins 38A-- 38C is used exclusively for the unprocessed wafer W, and the lift pins 40A to 40C of the other group are used exclusively for the processed wafer W, so that the unprocessed wafer W is a thin film substance. It is possible to prevent contamination by particles and particles.

In the unlikely event that one of the lift bases or lift actuators breaks down, the wafer W can be transferred in the same manner as described above by continuously raising and lowering the other lift base. It can take a large usage form.
In this first embodiment, two lifting bases 38, 40 are provided, but a third or more lifting bases are further installed so that they do not interfere with both lifting bases 38, 40, and the same. A lift pin may be provided for use.
In addition, the apparatus examples disclosed in each of the above-mentioned publications have two lifters for raising and lowering the wafer. However, when transferring the wafer, these two lifters are used at the same time. Therefore, it is difficult to use with a high degree of freedom according to the situation. Specifically, for example, in JP-A-9-223727, etc., there are two sets of support means (support pins) for the workpieces that operate independently, and these two sets of support means are: In cooperation, one piece of the object to be processed is supported at the same time, or one supporting means supports the object to be processed before processing, and at the same time, the other supporting means supports the object to be processed after processing. ing.

  On the other hand, in the above-described support mechanism for a target object according to the present invention, the target object W in substantially the same region in the horizontal coordinate is transferred to and supported by the transfer device. In addition, two sets (plurality) of support means for the objects to be processed (here, two lifting bases 38 and 40 correspond) are provided so as not to interfere with each other in substantially the same region in the horizontal coordinate. The support means for the two sets (plurality) of objects to be processed alternatively supports the objects to be processed (at the same time, only one support means supports the objects to be processed). That is, when one support means supports the object to be processed, the other support means does not support the object to be processed, and therefore the support mechanism of the present application is structurally completely different from the above prior art. It has a different configuration. In this regard, the embodiments described later are also the same.

<Second embodiment>
In the first embodiment described above, the two lift bases 38 and 40 connected to the lift actuators 46 and 48 are provided, and three lift pins 38A to 38C and 40A to 40C are provided respectively. Although it did, it is not limited to this, You may make it provide a raising / lowering actuator 1: 1 with respect to each lift pin 38A-38C and 40A-40C.
FIG. 6 is a diagram schematically showing the arrangement of the lifting actuators of the second embodiment, and FIG. 7 is a plan view showing the arrangement of lift pins of the second embodiment. In addition, about the same component as the part demonstrated previously with reference to FIGS. 1-5, the same referential mark is attached | subjected and the description is abbreviate | omitted.
As shown, each lift pin 38A-38C and 40A-40C is divided into two groups, a first group of lift pins 38A-38C and a second group of lift pins 40A-40C, below each lift pin, ie, Below these lift areas, lift actuators 80A to 80C and 82A to 82C are arranged corresponding to the lift pins.

  The lift actuators 80A to 80C and 82A to 82C are arranged on the same circumference, but in FIG. 6, they are arranged in a plane for easy understanding. In addition, you may arrange | position one raising / lowering actuators 80A-80C and the other actuators 82A-82C on a respectively different concentric circle. The lift pins 38A to 38C and 40A to 40C are connected to the tips of the lift rods 84A to 84C and 86A to 86C of the lift actuators 80A to 80C and 82A to 82C, respectively. The lift actuators 80 </ b> A to 80 </ b> C and 82 </ b> A to 82 </ b> C are controlled by the lift controller 68. In addition, bellows 88 is provided in the penetration part with respect to the intermediate | middle conveyance chamber bottom part 44 of each raising / lowering rod 84A-84C and 86A-86C, respectively.

In this case, the lift actuators 80A to 80C connected to the lift pins 38A to 38C in one group and the lift actuators 82A to 82C connected to the lift pins 40A to 40C in the other group are moved up and down in synchronization with each other. On the other hand, the raising / lowering operation can be controlled independently for each group.
Also in this case, the lift pins are controlled for each group, that is, for each lift pin 38A to 38C, or for each lift pin 40A to 40C in synchronism and controlled in the same manner as in the first embodiment. For example, the lift pins 38A to 38C of one group are used exclusively for transferring an unprocessed wafer W, and the lift pins 40A to 40C of the other group are transferred to the processed wafer W. It should be used exclusively for the time.

<Third embodiment>
Further, in the first embodiment described above, two lift bases 38, 40 respectively connected to the lift actuators 46, 48 are provided, and three lift pins 38A-38C and 40A-40C are provided for each. However, the present invention is not limited to this, and all the lift pins 38A to 38C and 40A to 40C are not provided, and the upper surfaces of the elevating bases 38 and 40 are in direct contact with the back surface of the wafer W. The wafer W may be supported.
FIG. 8 is a plan view showing such a lifting base of the third embodiment. In addition, about the same component as the part demonstrated previously with reference to FIG. 4, the same referential mark is attached | subjected and the description is abbreviate | omitted.

  As shown in the figure, in the case of the third embodiment, no lift pins are provided on the surfaces of the two elevating bases 38 and 40, and the upper surface is brought into direct contact with the back surface of the wafer W. The wafer W is supported. However, it should be noted that the lift bases 38 and 40 shown in FIG. 8 are not shown in FIG. 3 in order to prevent interference between the lift bases 38 and 40 and the pick, for example, the pick 32A, when the wafer is transferred. The size is set smaller than the lifting bases 38 and 40 of the first embodiment shown in FIG. Also in this case, the same effect as the first embodiment can be exhibited.

<Fourth embodiment>
In the second embodiment, the lift pins are directly joined to the lift rod without providing the lift base. In the third embodiment, the wafer is directly supported by the lift base without the lift pins. However, both of these may be combined.
FIG. 9 is a view showing the arrangement of the lifting actuators of the fourth embodiment, and FIG. 10 is a plan view of the fourth embodiment.
As shown in the figure, in the fourth embodiment, the structure related to the lift pins 38A and 40A is the same as that shown in FIGS. 6 and 7, that is, both lift pins 38A and 40A. Are directly connected to the lifting rod 84A of the lifting actuator 80A and the lifting rod 86A of the lifting actuator 82A, respectively. In contrast, the other lift pins 38B, 38C and 40B, 40C (see FIG. 3) are not provided, and the function of this part is similar to that described in the third embodiment of FIG. The back surface of the wafer W is directly supported by the back surfaces of the elevating bases 38 and 40. However, in this case, each of the elevating bases 38 and 40 is not shaped like the numeral “7” as shown in FIG. 4, but the portion supporting the lift pins 38A and 40A is deleted and removed, for example, “ It is U-shaped.

  In this case, one lift pin 38A and the lift base 38 are grouped and moved up and down synchronously, and the other lift pin 40A and the lift base 40 are grouped and moved up and down synchronously. Also in this case, the same operational effects as in the case of the first embodiment can be exhibited.

<Fifth embodiment>
In each of the above first to fourth embodiments, only one wafer can be handled at any time, and two wafers cannot be handled at the same time. A supporting portion may be provided so that a plurality of, for example, two wafers can be handled at the same time.
FIG. 11 is a perspective view showing the fifth embodiment, and FIG. 12 is a plan view showing the fifth embodiment. The same components as those described above are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in the figure, in the case of the fifth embodiment, the configuration of any one of the first to fourth embodiments is arranged in the central portion of the intermediate transfer chamber 8A. A pair of auxiliary elevating rods 90 and 92 are provided outside the elevating region where the wafer W is raised and lowered in the configuration of this embodiment. The auxiliary lifting rods 90 and 92 are arranged in a direction different from the gate valves G5 and G6 provided on both sides of the intermediate transfer chamber 8A by 90 degrees, and picks 14A and 14B inserted when the wafer is carried in and out. And 34A and 34B. In the illustrated example, the configuration of the first embodiment is arranged at the center of the intermediate transfer chamber 8A. Bellows 94 and 96 that allow the auxiliary lifting rods 90 and 92 to move up and down while maintaining the airtightness of the chamber are interposed in the through portions of the intermediate transfer chamber bottom 44 of the auxiliary lifting rods 90 and 92, respectively. ing.

Under the two auxiliary lifting rods 90 and 92, a lifting actuator (not shown) for lifting and lowering them is provided, and both are lifted and lowered synchronously. Here, the auxiliary lifting rods 90 and 92 are lifted and lowered with a stroke larger than that of the lifting rods 50 and 52. In this case, only one lifting actuator may be provided by connecting the lower ends of the auxiliary lifting rods 90 and 92.
And the auxiliary | assistant to-be-processed body support plates 98 and 100 made from a ceramic, for example extended in the horizontal direction toward the center of 8 A of intermediate | middle conveyance chambers are attached and fixed to the upper end part of each said auxiliary lifting rod 90 and 92, respectively. Has been. Each auxiliary processing object support plate 98, 100 is formed in a “T” shape in the illustrated example so that the upper surface thereof can be in direct contact with the back surface of the wafer W to hold the wafer W. It has become. The support mechanism for the other intermediate transfer chamber 8B is configured in the same manner as the support mechanism for the intermediate transfer chamber 8A.

  In the fifth embodiment configured as described above, as shown in FIG. 11, for example, an unprocessed wafer W is held by the pair of auxiliary processing object support plates 98, 100, In the state where the height is raised upward, the lift pins 38A to 38C and 40A to 40C can perform the operation as described in the first embodiment. That is, in the state where the specific wafer W is lifted high by the auxiliary workpiece support plates 98 and 100 and is in a standby state, another wafer can be carried in and out under this specific wafer W. Therefore, the degree of freedom in handling the object to be processed can be improved.

<Sixth embodiment>
In each of the above embodiments, when a plurality of, specifically, two lifting bases 38 and 40 are used, they are arranged at positions where they do not overlap in plan view. Without being limited thereto, in order to reduce a planar occupation space, both the lifting bases 38 and 40 may be arranged so as to overlap each other in a plan view, that is, both the lifting bases 38 and 40 may overlap in the vertical direction. .
FIGS. 13A and 13B are views showing a sixth embodiment of the present invention. FIG. 13A shows a perspective view and FIG. 13B shows a plan view.

  As shown in the figure, in the sixth embodiment, the first elevating base, for example, the elevating base 38 and the second elevating base, for example, the elevating base 40 are arranged so as to overlap in the vertical direction. The lifting base 38 is located above the second lifting base 40. The first elevating base 38 is supported by a first elevating rod, for example, elevating rod 50, at the center thereof, and the second elevating base 40 is a second elevating rod, for example, elevating rod 52, at the central portion. Is supported by The first and second elevating rods 50 and 52 have a coaxial structure and can be moved up and down individually in the vertical direction. The lower end of the first elevating rod 50 is connected to a first elevating actuator such as an elevating actuator 46 (see FIG. 2), and the lower end of the second elevating rod 52 is connected to a second elevating actuator such as an elevating actuator 48 (see FIG. 2). 2).

Between the first elevating base 38 and the second elevating base 40, a first bellows 110 that is extendable so as to cover the first elevating rod 50 is interposed. A second bellows 112 that is extendable so as to cover the second lifting rod 52 is interposed between the second lifting base 40 and the bottom (not shown) of the transfer chamber.
The second elevating base 40 is formed in a substantially disk shape, and is provided with a plurality of lift pins 40A to 40C that are erected from the peripheral edge, in the illustrated example, the upper end of which is the first elevating base. The upper end of the wafer W can be supported by the upper end thereof. The lift pins 40 </ b> A to 40 </ b> C are arranged at substantially equal intervals in the circumferential direction on the peripheral edge of the second elevating base 40.

On the other hand, the first elevating base 38 is formed in a deformed triangular shape, for example, formed by bending each side of an equilateral triangle toward the center side so as not to interfere with the three lift pins 40A to 40C. Yes. The upper surface of the first elevating base 38 can come into contact with and support the wafer W. In this embodiment, the upper ends of the lift pins 40 </ b> A to 40 </ b> C of the lower second elevating base 40 rise to above the first elevating base 38 when the wafer W is transferred and supported.
In the case of the sixth embodiment, the same operation as described in the first embodiment can be performed. That is, the wafer W can be alternatively supported by the upper surface of the first lift base 38 and the lift pins 40A to 40C provided on the second lift base 40.

Further, since the two elevating bases 38 and 40 are arranged so as to overlap in the vertical direction, each of the elevating bases 38 and 40 can be made small and the planar area occupied by the elevating bases 38 and 40 can be made small. As a result, even if a pick with a small opening at the tip of the pick is used when the wafer is transferred, the pick and the elevating bases 38 and 40 do not interfere with each other. In addition, when the wafer is transferred, the elevation control of the support mechanism is facilitated.
In the sixth embodiment, the wafer W is supported on the upper surface of the first elevating base 38. However, the present invention is not limited to this, as in a modification of the sixth embodiment shown in FIG. A plurality of, in the illustrated example, three lift pins 38 </ b> A to 38 </ b> C may be provided upright at the peripheral edge of the first elevating base 38, and the wafer W may be supported at the upper end. In each of the above-described embodiments, the case where the support mechanism is provided in the intermediate transfer chambers 8A and 8B, which are vacuum-tight airtight chambers, has been described. However, the present invention is not limited thereto, and the empty space in the introduction-side transfer chamber 10 is provided. Alternatively, it may be installed in a vacant space in the common transfer chamber 6 and used as a temporary standby place for semiconductor wafers.

In each of the above embodiments, when the wafer W is supported by the elevating bases 38 and 40 or the auxiliary object support plates 98 and 100, the upper surface of the wafer W is in direct contact with the back surface of the wafer W. However, it is also possible to provide a plurality of convex portions having a height of about 1 mm and a diameter of about 5 mm on the upper surface thereof, and to support the back surface of the wafer with these convex portions. Further, a recess may be provided on the upper surface thereof, and the wafer W may be accommodated and supported in the recess.
Further, in each of the above embodiments, the case where the unprocessed wafer W is supported by one lift pin or the lift base and the processed wafer is supported by the other lift pin or lift base has been described. In the case of using the support mechanism of the present invention, depending on the type of processing (film formation, etching, etc.) performed on the wafer W or on the temperature of the wafer W (before or after heating the wafer W or A plurality of lift pins or lift bases may be used properly depending on the state of the wafer W or before and after cooling.

In each of the above embodiments, the materials of the lift pins or the lift bases are the same. However, depending on the state of the wafer W to be supported, the material for each lift pin or the lift base (for example, heat resistant) is used. You may use properly a material, a material with good heat conductivity, etc.).
Further, the number of wafers supported by each lift pin or the lift base may be controlled to be substantially equal. Thereby, the cleaning cycle of a wafer contact part can be lengthened, and the lifetime of the members of support mechanisms, such as a bellows, can be lengthened. Further, a mechanism for rotating the wafer W may be added to the support mechanism of the present invention.
In each of the above embodiments, the semiconductor wafer is described as an example of the object to be processed. However, the present invention is not limited to this, and the present invention can be applied to a glass substrate, an LCD substrate, and the like.

It is a schematic plan view which shows an example of the processing system which has the support mechanism of the to-be-processed object which concerns on this invention. It is sectional drawing which shows the conveyance chamber which has the load lock function to which the support mechanism was attached. It is a perspective view which shows a support mechanism. It is a top view which shows a support mechanism. It is the elements on larger scale which show the attaching part of the raising / lowering rod of a support mechanism. It is a figure which shows typically the arrangement | sequence of the raising / lowering actuator of a 2nd Example. It is a top view which shows the arrangement | sequence of the lift pin of a 2nd Example. It is a top view which shows the raising / lowering base of a 3rd Example. It is a figure which shows the arrangement | sequence of the raising / lowering actuator of a 4th Example. It is a top view of the 4th example. It is a perspective view which shows a 5th Example. It is a top view which shows a 5th Example. It is a figure which shows a 6th Example. It is a figure which shows the modification of a 6th Example.

Explanation of symbols

2 Processing system 4A-4D Processing device 6 Common transfer chamber 8A, 8B Intermediate transfer chamber (airtight chamber)
DESCRIPTION OF SYMBOLS 10 Introduction side transfer chamber 12A, 12B Support mechanism 38, 40 Lift base 38A-38C, 40A-40C Lift pin 46, 48 Lift actuator 50, 52 Lift rod 58, 60 Bellows 68 Lift control part 80A-80C, 82A-82C Lift actuator 84A to 84C, 86A to 86C Elevating rod 88 Bellows 90, 92 Holding elevating rod 94, 96 Bellows 98,100 Auxiliary object support plate W Semiconductor wafer (object to be processed)

Claims (6)

In the support mechanism for the object to be processed for transferring the object to be processed,
A first elevating base connected to the first elevating rod of the first elevating actuator to be capable of elevating and supporting the object to be processed on its upper surface;
A second elevating base disposed below the first elevating base and connected to a second elevating rod of a second elevating actuator so as to be elevable;
A plurality of lift pins that are erected from the second elevating base and whose tips extend above the first elevating base and support the object to be processed at the tips;
A lifting control unit that independently controls the first and second lifting actuators;
The first elevating rod and the second elevating rod have a coaxial structure, and the first elevating base and the lift pin can support the object to be processed in a horizontal state, and the elevating control unit includes the first elevating rod and the second elevating rod . A support mechanism for a target object, wherein the first and second lift actuators are controlled such that one lift base or the lift pin alternatively supports the target object. In the support mechanism for the object to be processed for transferring the object to be processed,
A first elevating base connected to the first elevating rod of the first elevating actuator and capable of elevating;
A plurality of first lift pins that are erected from the first elevating base and whose tips support the object to be processed;
A second elevating base disposed below the first elevating base and connected to a second elevating rod of a second elevating actuator so as to be elevable;
A plurality of second lift pins that are erected from the second elevating base and whose tips extend above the first elevating base and support the object to be processed at the tips;
A lifting control unit that independently controls the first and second lifting actuators;
The first elevating rod and the second elevating rod have a coaxial structure, and the first and second lift pins can each support the object to be processed in a horizontal state, A support mechanism for an object to be processed , wherein the first and second lift actuators are controlled so that the first lift pin or the second lift pin selectively supports the object to be processed. The coaxial structure according to claim 1 or 2 SL placing the workpiece support mechanism, characterized in that it is adapted to rotatably. The lift bases and the lift pins are provided in an airtight chamber that can be evacuated, and the lift rods are provided through the bottom of the airtight chamber. workpiece support mechanism according to claim 1乃optimum 3 Neu deviation or claim that telescopically made the bellows to hold the airtightness of the airtight chamber, characterized in that it is interposed. A pair of auxiliary lifting rods arranged on the outside of the lifting region of the object to be lifted and lifted;
Each of the auxiliary lifting rods is connected to each other, and includes a pair of auxiliary processing object support plates that extend in the horizontal direction from above and support the target object.
The pair of auxiliary processing object support plates support the object to be processed above a position where each of the lift bases or each lifter pin supports the object to be processed. The support mechanism of the to-be-processed object as described in any one of Claims. An intermediate transfer chamber that is joined to both ends of the external transfer chamber via a gate valve that can be opened and closed in an airtight manner, and can be set alternatively to an atmospheric pressure atmosphere and a vacuum atmosphere as necessary.
A support mechanism of the target object according to claim 1乃optimum 5 gall deviation or claim provided in the intermediate transfer chamber,
A load lock room characterized by comprising:

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