JPH0846013A - Multichamber treatment system conveyer - Google Patents

Abstract

PURPOSE:To provide a multichamber treatment system conveyer whose loader chambers and a conveyer arm can be used as common components while a transfer chamber only is replaced when the number of vacuum treatment chambers provided around the vacuum treatment chamber is changed and which is easy to manufacture and easy to assemble. CONSTITUTION:A polygonal transfer chamber 11 with which three vacuum treatment chambers P1-P3 are communicated through gate valves G1, two loader chambers 12 and 13 which are linked with the transfer chamber 11 through gate valves G2 and a conveyer arm 14 which is provided in the transfer chamber 11 so as to be able to rotate and stretch and contract and which transfers wafers W between the loader chambers 12 and 13 and the vacuum treatment chambers P1-P3 are provided. Although the shape and size of the transfer chamber 11 are changed in accordance with the number of the vacuum treatment chambers provided around the transfer chamber 11, the connection parts 11f and 11g between the transfer chamber 11 and the loader chambers 12 and 13 are not changed. The conveyer arm 14 has a minimum revolving radius R which allows the conveyer arm 14 to revolve in the smallest transfer chamber 11 and has a maximum arm stretching length which allows the conveyer arm 14 to convey the wafers W from the largest transfer chamber 11 to the vacuum treatment chamber.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for transporting an object to be processed in a multi-chamber processing system having a plurality of vacuum processing chambers for mainly processing an object to be processed such as a semiconductor wafer and an LCD substrate.

[0002]

2. Description of the Related Art In recent years, for example, miniaturization of semiconductor devices
With higher integration, various measures have been taken in the semiconductor manufacturing process. For example, in the vacuum processing system for semiconductor wafers, it is possible to easily deal with the reforms and changes of various processes, and to shorten the process by consistent processing. As described above, a multi-chamber processing system called a cluster tool, which is provided with a state in which a plurality of vacuum processing chambers are arranged, is being developed.

A conventional multi-chamber processing system of this type is provided with a required number (for example, a minimum of 3 to a maximum of 6) of vacuum processing chambers (process chambers) corresponding to various semiconductor manufacturing processes, and As a transfer system for loading and unloading an object to be processed into and out of the vacuum processing chamber, one or two loader chambers and a plurality of connection ports that are in air-tight communication with each other through the gate valves in a state where each vacuum processing chamber and the loader chamber are arranged There is known a configuration including a polygonal transfer chamber (transfer chamber) having a peripheral wall with a transfer arm and a transfer arm (transfer robot) installed in the transfer chamber and capable of rotating and expanding / contracting. There is.

In such a multi-chamber processing system, for example, a semiconductor wafer (hereinafter simply referred to as a wafer) as an object to be processed is carried into the loader chamber in cassette units by an external carrier, and the loader chamber is evacuated or inactivated therein. After separating from the outside by replacing with gas, open the gate valve on the transfer chamber side of the loader chamber,
Wafers are taken one by one from the cassette in the loader chamber into the transfer chamber by the transfer arm and sequentially carried into the required vacuum processing chamber, where predetermined processing such as film formation and etching is performed, and the processed wafers are It is taken out by the transfer arm into the transfer chamber and returned to the cassette in the loader chamber.

In such a multi-chamber processing system, the loader chamber, the transfer chamber, and the transfer arm, which are transfer systems, can be shared by a plurality of vacuum processing chambers arranged around each other. In comparison with a conventional processing device that has a transport system, the configuration is simplified, the installation space is reduced, and the transport efficiency is improved, which is very advantageous.

[0006]

However, in the conventional multi-chamber processing system, the required number of vacuum processing chambers are selected and prepared for each process according to the needs of the user. Based on the number, shape, and size, a transfer chamber with an appropriate shape and size (size) is manufactured in consideration of the interface with these, and the vacuum processing chambers are gated around the transfer chamber. It is assembled and fixed in a state where it is in air-tight communication via a valve, and a loader chamber is manufactured and assembled at the peripheral wall end (loading part side) of the transfer chamber, and the transfer chamber is adapted to the transfer chamber. That is, the minimum turning radius that allows the transfer arm to swivel in the transfer chamber, and the maximum arm extension distance (maximum arm lift distance) that allows wafers to be loaded and unloaded from the transfer chamber to and from the vacuum processing chamber and the loader chamber. The transport arm that was configured with a switch) and installed assembling has been completed.

Therefore, in order to construct a multi-chamber processing system in which the number of distributed vacuum processing chambers varies according to process changes, it is of course necessary to remake a transfer chamber having a shape and size (size) corresponding to the multi-chamber processing system. Therefore, it is necessary to remake the loader chamber so that it can be connected to the transfer chamber, and to manufacture and assemble a transfer arm having a minimum turning radius and a maximum arm reach suitable for the transfer chamber. In other words, it is necessary to reassemble and assemble the transfer chamber, the transfer arm, and the loader room, which are the transfer system, for each process according to the needs of the user, and the design and manufacture of the transfer system is troublesome and the cost is increased each time. There was a problem you were inviting.

Further, when the multi-chamber processing system constructed for each process is used, since the shape and size of the vacuum processing chamber are different, the transfer arm is moved in the transfer chamber to transfer the object to be processed and the distance. Has to be stored and stored in the program control section, which is troublesome and requires a lot of time to start up before use.

The present invention has been made in order to solve the above problems, and an object of the present invention is to transfer a transfer system among transfer systems even if the number of vacuum processing chambers arranged is increased or decreased in accordance with a process change. Only by changing the shape and size of the loading chamber, all other loader chambers and transfer arms can be handled by common products, making it extremely easy to manufacture and assemble and reduce costs. An object is to provide a carrier device for a system.

Further, an object of the present invention is that, even if the shape and size of the transfer chamber are variously changed according to the increase and decrease of the number of peripherally arranged vacuum processing chambers due to the process change, the transfer arm of the transfer arm is changed each time. It is an object of the present invention to provide a transfer device for a multi-chamber processing system which enables immediate and appropriate control operation of the transfer arm without the need to teach the transfer route and distance of the object to be processed.

[0011]

The invention according to claim 1 has a plurality of connection ports in the peripheral wall, which are connected to each other through a gate valve in a state in which a plurality of vacuum processing chambers corresponding to a process are circumferentially arranged. The substantially polygonal transfer chamber, one or more loader chambers communicating with the end of the peripheral wall of the transfer chamber via a gate valve, and the treatment chamber is loaded into the transfer chamber from the loader chamber and the vacuum is applied. In a transfer device for a multi-chamber processing system, which is provided with a transfer arm that is carried into a processing chamber, takes out a processed object in a vacuum processing chamber, and returns the processed object to the loader chamber, the transfer chamber is a process. With the change, the shape and size will be changed according to the increase and decrease of the number of peripherals in the vacuum processing chamber, but other loader chambers and transfer arms can be handled by common products,
The transfer chamber has a fixed connection to the loader chamber at the end of the peripheral wall in any case, and the transfer arm can be swung in the transfer chamber of the minimum size according to the minimum number of the vacuum processing chambers. It is characterized by having a minimum turning radius and a maximum arm extension distance capable of loading and unloading the object to be processed into and from each vacuum processing chamber from the largest transfer chamber corresponding to the maximum number of peripherals of the vacuum processing chamber. To do.

With the transfer apparatus for a multi-chamber processing system having such a structure, even if the number of peripherals of the vacuum processing chamber is increased or decreased due to a process change, only the transfer chamber of the transfer system is changed in shape and size. However, the loader chamber and the transfer arm other than the above can be dealt with by a common product, and the manufacturing and assembling can be made very easy and the cost can be reduced. In the transfer apparatus for a multi-chamber processing system of the present invention, an alignment mechanism for once receiving and aligning an object to be processed from the transfer arm is installed at a fixed position that does not interfere with the swinging / expanding operation of the transfer arm in the transfer chamber. Characterize.

In the case of the multi-chamber processing system transfer apparatus having the above-described structure, in addition to the above-described operation, the object to be treated is taken in from the loader chamber to the transfer chamber by the transfer arm and is carried into the vacuum processing chamber. It becomes possible to receive the processing body once by the alignment mechanism and to align the orientation.

According to a third aspect of the present invention, in the transfer apparatus for a multi-chamber processing system according to the second aspect of the present invention, the two loader chambers are suitable for each other so that the center lines of the two loader chambers are oriented toward the center of the rotation axis of the transfer arm. Arranged in parallel with an opening angle,
The alignment mechanism is installed at a position slightly outside the minimum turning radius of the transfer arm in the transfer chamber communicating with the loader chambers and at a position between the center lines of the loader chambers.

The multi-chamber processing system transfer apparatus having such a structure has two loader chambers, so that both loader chambers can be used in combination to smoothly carry in / out the object to be processed by the transfer arm. It is possible to achieve a high through top. In addition, the two loader chambers are arranged in parallel with each other with an appropriate opening angle with their center lines directed to the center of the swivel axis of the transfer arm in the transfer chamber, and the transfer arms move forward and backward with respect to the loader chambers. Since the alignment mechanism is arranged in the empty space between the routes, the alignment mechanism does not interfere with the operation of the transfer arm and the transfer chamber can be downsized.

According to a fourth aspect of the present invention, in the transfer apparatus for a multi-chamber processing system according to any of the first to third aspects, various types of transfer are changed in size in response to an increase / decrease in the number of vacuum processing chambers arranged along with a process change. A control means is stored in advance for the transfer route / distance of the object to be processed for each mounting chamber, and the transfer arm is swung / extended / contracted according to the transfer route / distance of the object to be processed in the transfer chamber actually installed. It is characterized by having.

According to a fifth aspect of the present invention, in the transfer apparatus for a multi-chamber processing system according to the first aspect, the transfer chamber has a lid on its upper surface for sealing the transfer chamber, and this lid is It is characterized by being divided into at least two and at least one of which can be opened and closed.

With the transfer apparatus for a multi-chamber processing system having such a structure, even if the shape and size of the transfer chamber are variously changed in response to an increase or decrease in the number of peripherally arranged vacuum processing chambers due to a process change, the transfer chamber is changed each time. It is not necessary to teach the transfer route and distance of the object to be transferred of the transfer arm, and it becomes possible to immediately and accurately control the transfer arm.

[0019]

Embodiments of the present invention will be described below with reference to the drawings. 1 is a horizontal sectional view of a transfer device in a multi-chamber processing system in which three vacuum processing chambers are arranged, FIG. 2 is a vertical sectional view taken along line XX of FIG. 1, and FIG. FIG. 4 is a plan view of the transfer arm used when the transfer arm is expanded and contracted, and FIG. 4 is a horizontal cross-sectional view of a transfer device in a multi-chamber processing system in which six vacuum processing chambers are arranged.

First, referring to FIGS. 1 to 3, three vacuum processing chambers P ₁ , P ₂ , P ₃ for processing, for example, a semiconductor wafer (hereinafter simply referred to as a wafer) W as an object to be processed.
A multi-chamber processing system in which the above are arranged in one transfer system and this transfer device will be described. Those vacuum processing chambers P ₁ , P
_As shown in FIGS. 1 and 2, reference numerals 2 and P ₃ are cubic airtight processing containers called process chambers and the like mounted on a pedestal 2 having a predetermined height, respectively, which are objects to be processed inside. Each table is provided with a mounting table (susceptor) mounting table 3 having a plurality of lifting support pins 3a for mounting and holding the wafer W for processing.

Of the three, two vacuum processing chambers P ₁ ,
P ₂ has a required processing function for the wafer W, for example, a processing function selected from sputtering, CVD, etching, ashing, oxidation, diffusion, etc., and the remaining one vacuum processing chamber P ₃ Is a preliminary vacuum treatment chamber for performing pre-processing and post-processing such as heating and cooling of the wafer W. For the purpose of the processing, a vacuum suction mechanism, a process gas injection mechanism, a heating / cooling mechanism, etc., which are not shown, are provided.

Generally, in this type of multi-chamber processing system, it is assumed that the minimum unit is a pattern including the _three vacuum processing chambers P ₁ , P ₂ and P ₃ as the number of vacuum processing chambers to be distributed.

The transfer device for the multi-chamber processing system of this minimum pattern is composed of three vacuum processing chambers P ₁ , P ₂ ,
Polygonal transfer chambers 11 are respectively connected in a circumferential arrangement in which P ₃ is surrounded from _three sides, and one or more (two in the illustrated embodiment) loader chambers connected to the front end side of the transfer chamber 11. 1
2, 13 and the loader chamber 12 in the transfer chamber 11,
The wafer W is taken in from inside the vacuum processing chamber P.
A transfer arm 14 capable of swiveling and expanding / contracting, which carries in the wafers ₁ , ₁ , P ₂ and P ₃ and takes out the processed wafers W in the vacuum processing chambers and returns them into the loader chambers 12 and 13, and the wafers W from the transfer arms 14. It is provided with an alignment mechanism 15 for once receiving and aligning as described later.

Incidentally, these transfer chamber 11 and loader chamber 1
2 and 13 are mounted and supported on a fixed mount 16 as shown in FIG. An external cassette carrying device 18 is provided on the front side of the loader chambers 12 and 13 via a mount 17.

The transfer chamber 11 is also called a vacuum transfer chamber (transfer chamber) or the like. As shown in FIGS. 1 and 2, the three vacuum processing chambers P ₁ , P ₂ and P ₃ are arranged on the left and right sides. Around the rear three sides in a well-balanced manner and connectable, the planar U-shaped peripheral wall portions, that is, the left and right wall portions 11a parallel to each other,
11b and a rear end wall portion 11c perpendicular to them, and the two (left and right pair) loader chambers 12, 1 on the front end side.
The left and right wall portions 11a and 11b can be connected in parallel.
From the left and right expansion wall portion 11 that extends slightly from the front to the front side
It is a planar polygon having d and 11e and front end wall portions 11f and 11g which are connected to their front ends and are arranged in a V-shape with an inclination angle. Moreover, this transfer room 11
As described above, the pattern processing system with the smallest number of vacuum processing chambers (three) is installed in the vacuum processing chamber so that the space is as small as possible and the pattern processing system is the most used than the other pattern processing systems described later. It is made small.

Left and right wall portions 11a and 11b of the transfer chamber 11
And connection ports 21 are formed in the rear end wall 11c,
The vacuum processing chambers P ₁ , P ₂ and P ₃ are respectively installed on the outside of each of these chambers so as to communicate with each other via a gate valve G ₁ . Further, the front end wall portions 11f and 11g are connecting portions (interfaces) to the two loader chambers 12 and 13, respectively, and a connection port 22 is formed in each of them, and the front side of each of the two loader chambers (left and right). 12,
13 connects the rear end side ports individually and gate valves G ₂ respectively
Are arranged side by side so as to communicate internally.

The transfer chamber 11 is usually an airtight container with a lid 23 fitted as shown in FIG. 2, and a vacuum suction mechanism or an inert gas such as N 2 gas for holding the inside of the transfer chamber 11 in vacuum at a required reduced pressure state. Is equipped with a gas supply mechanism (none of which is shown).

Further, the bottom plate portion of the transfer chamber 11 is located at virtual centers equidistant from the left and right wall portions 11a and 11b and the rear end wall portion 11c, respectively, and is provided with a swing shaft mounting hole for the transfer arm 14. 24 is formed in which the transfer arm 14 is formed.
The pivot shaft 28 described later is mounted.

The two loader chambers 12 and 13 are in the form of transport ducts which are bent in the shape of a dogleg in the middle and are oriented forward and backward.
It is made symmetrical to each other. Then, the rear end sides of the loader chambers 12 and 13 are joined to the front end wall portions 11f and 11g arranged in a V shape, which are the connecting portions (loader chamber interface) of the transfer chamber 11 as described above. With the loader chambers 12 and 13 having their respective center lines L ₁ and L ₂ oriented toward the center O of the rotation axis of the transfer arm 14 in the transfer chamber 11, an appropriate opening angle θ (for example, 45) is formed in a V shape.
Are arranged side by side symmetrically.

As a result, the three vacuum processing chambers P ₁ , P ₂ , P ₃ and the loader chambers 12, 13 extend straight from the center O of the rotation axis of the transfer arm 14 around the transfer chamber 11. The wafer W is connected by being distributed around the radiation, and the wafer W can be inserted into and removed from each of them by the transfer arm 14.

Each of the two loader chambers 12 and 13 has a cassette mounting table 25 substantially in the center thereof, on which a wafer W from the outside (front working chamber) is, for example, a unit of 25 wafers in a vertical multi-stage manner. This is a so-called cassette carry-in chamber in which the cassette C stored horizontally can be carried in and carried out by the external cassette carrying device 18. In addition, the cassette mounting table 2
5 is supported by an elevating mechanism (elevator) 26 provided at the bottom of the loader chambers 12 and 13 so as to be able to ascend and descend.

Further, both loader chambers 12 and 13 are external to the front end side opening portion which is a cassette carry-in port (front side working chamber).
Each of them has a gate valve G ₃ for opening and closing, and can be kept airtight like a kind of load lock chamber, and can be evacuated by a vacuum suction mechanism (not shown) or an inert gas such as N 2 by a gas supply mechanism. It can be isolated from the outside atmosphere by replacing it with gas.

The transfer arm 14 is a kind of transfer robot, and a swing shaft 28 is erected from a drive unit 27 mounted and supported on the lower part of the transfer chamber 11 or the pedestal 16 shown in FIG. The transfer chamber 11 is pierced upward in a virtual center of the swivel shaft mounting hole 24 in an airtight state, and a series of articulated arms 29, 30 are provided at the upper end of the swivel shaft 28 as shown in FIGS. , 31 are connected in series, and a substantially U-shaped hand portion 31a for supporting the wafer W by means such as vacuum suction is provided at the tip of the arm 31.

The transfer arm 14 is an articulated arm 2
As described above, the minimum turning radius R in the shortened state in which 9, 30, 31 are folded to each other is the minimum number (3) of the vacuum processing chambers.
It is set to be slightly smaller than the inner radius of the transfer chamber 11 of the smallest shape corresponding to the number of individual pieces. The minimum radius of the transfer chamber 11 may be either the distance from the center O of the turning axis to the inner surface of the peripheral wall or the distance to the inner side of the connection port 21 as shown by an imaginary line in FIG. Then, the multi-joint arms 29, 30, and 31 are driven by the drive unit 27 via the swivel shaft 28 so that the wafer W is held on the tip hand unit 31a while the transfer chamber 1 is being held.
1 can be horizontally swung, and can be expanded and contracted to move the wafer W into the vacuum processing chambers P ₁ , P ₂ , P _{3 and the} loader chamber 1
It can be put in and taken out of the inside of 2,3.

The alignment mechanism 15 includes a transfer chamber 11
A turntable 33 that temporarily receives the wafers W one by one from the transfer arm 14 and holds them by electrostatic attraction means or the like.
A rotary drive unit 35 for rotating the rotary table 33 via a rotary shaft 34, and an elevating and lowering drive section 36 for elevating and lowering the rotary table 33; A light emitting unit 37 that irradiates light as a strip-shaped parallel light beam, a light receiving unit 38 that receives the light beam above and outputs an electric signal in accordance with the light receiving area, and a light receiving unit 38 that uses a PIN photodiode, for example. A control unit that controls the rotation drive unit 35 by detecting the center position of the wafer W and the orientation of the orientation flat (hereinafter simply referred to as “orientation flat”) when the wafer W is rotated once by the turntable 33 based on the electric signal. (Not shown)
With this rotation control, the wafer W can be aligned in a predetermined direction and transferred to the transfer arm 14 so that the wafer W can be properly loaded and set in the vacuum processing chambers P ₁ , P ₂ and P ₃ . There is.

As described above, the alignment mechanism 15 interferes with the rotation and expansion / contraction operation of the transfer arm 14 in the transfer chamber 11 of the minimum size corresponding to the minimum number of the vacuum processing chambers (3). Not installed in place. That is,
Slightly outside the minimum turning radius R of the transfer arm 14 in the transfer chamber 11, and as described above, an appropriate opening angle θ.
A rotary table 33 is installed via the rotary shaft 34 at an intermediate position between the center lines L ₁ and L ₂ of the _two loader chambers 12 and 13 arranged in parallel with each other.

The operator may manually insert and remove the cassette C containing the wafer W into the left and right loader chambers 12 and 13, but in that case, the gate valve G is used.
Since there is some danger due to the presence of _{3 or} the like, an external cassette carrying device 18 is installed in front of the left and right loader chambers 12 and 13 via a pedestal 17 here. The external cassette carrying device 18 includes a rotary drive unit 40 mounted and supported on a gantry 17, a rotary shaft 41 erected from the rotary drive unit 40, and the rotary shaft 4
1 has a uniaxial structure composed of a rotating arm 42 mounted at a right angle on the upper end and a handling arm 43 continuously provided at the tip. The external cassette carrying device 18 receives the cassette C separately from the cassette transfer robot (not shown) or the operator at the cassette mounting portion 17a on the pedestal 17 and selectively rotates the cassette C left and right to load the cassette C into the loader. Cassette mounting table 25 in chamber 12 or 13
It can be loaded and set on the upper side, or conversely, the cassette W containing the processed wafers can be unloaded from the loader chambers 12 and 13.

Further, reference numeral 45 in FIG. 1 denotes a control unit as a control means, in which a control device such as a CPU provided with a memory storing programs of various operation modes,
An operation panel for selecting programs and setting conditions is provided.

The operation of the transfer device in the multi-chamber processing system having such a configuration will be described. When the cassette C containing a predetermined number of wafers W as the objects to be processed is mounted on the external cassette carrying device 18, the external cassette carrying device 18 will be operated while the respective parts are automatically controlled by the controller of the control unit 45. It is operated to carry it into one of the left and right loader chambers 12, 13 which is open, and the cassette mounting table 25 in the loader chamber is raised by the elevating mechanism 26 to receive the cassette C, and the external cassette carrying device 18 is moved forward. Turn back to.

Thus, for example, the cassette C as shown in FIG.
The loader chamber 12 on the right side, which stores therein, has a front end side closed by a gate valve G ₃ and is in a hermetically sealed state. In this state, vacuum suction is performed by a vacuum suction mechanism or replacement with an inert gas such as N 2 gas is performed by a gas supply mechanism. Is performed and is isolated from the external atmosphere (load lock), G ₂ on the rear end side of the loader chamber 13 is opened, and similarly, the transfer chamber 11 is evacuated or replaced with an inert gas. Internal communication with.

In this state, the cassette C in the loader chamber 12 is moved up and down together with the cassette mounting table 25 by the elevating mechanism 26, while the transfer arm 16 in the transfer chamber 11 is swung and extended to move in the loader chamber 12. The wafers W in the cassette C are taken into the transfer chamber 11 one by _one , and the gate valves G ₁ are opened into the required vacuum processing chambers P ₁ , P ₂ and P ₃ according to the program mode each time. Carry-in and set one after another and perform predetermined processing.

That is, for example, the wafer W is first loaded into the pre-vacuum processing chamber P ₃ by the transfer arm 14 to be preheated, returned to the transfer chamber 11, and the rotary table 33 of the alignment mechanism 15 is raised. Then, the center of the wafer W and orientation of the wafer W are detected by the rotation control, and the wafer is aligned with the orientation in a predetermined direction. Then, the rotary table 33 is descended to transfer it to the transfer arm 14 and the first vacuum processing chamber P ₁ ,
The P ₂ is sequentially loaded and set, and a predetermined process such as film formation or etching is performed. The processed wafer W is returned to the cassette C in the loader chamber 12 by the transfer arm 14.

In this way, the wafers W in the cassette C are taken in one by one, processed and returned, and when the processing of all the wafers W in the cassette C is completed, after the G ₂ on the rear end side of the loader chamber 12 is closed, The gate valve G ₃ at the front end side opening is opened, and the external cassette carrying device 18 is moved to the gate valve G ₃ to take out the cassette C containing the processed wafer to the outside.

Further, as described above, the wafers W are successively loaded from the cassette C in the loader chamber 12 on the right side into the transfer chamber 11 and are subjected to predetermined processing in the vacuum processing chambers P ₁ , P ₂ and P ₃ . During the process, the unprocessed wafer W is loaded in the left loader chamber 13.
The next cassette C containing the
Then, the loader chamber 13 on the left side is brought into a load lock state and is on standby. And the loader chamber 13 on the right side
Simultaneously with the completion of the processing for loading and unloading the wafer W from and to the left, the gate valve G ₂ of the left loader chamber 13 is opened, and the wafer W is taken into the transfer chamber 11 by the transfer arm 14 from the next cassette C in the gate valve G _2. It comes to perform continuous processing.

Next, a multi-chamber processing system in which the six vacuum processing chambers P ₁₁ , P ₁₂ , P ₁₃ , P ₁₄ , P ₁₅ , P ₁₆ of the embodiment shown in FIG. . It should be noted that, here, components having the same structural effects as those of the embodiments shown in FIGS. 1 to 3 are given the same reference numerals to simplify the description, and the configurations shown in FIGS. 2 and 3 are almost the same. 2 and 3 will be referred to again without being shown.

First, the six vacuum processing chambers P _{11 to} P
Reference numeral ₁₆ denotes a cubic airtight processing container mounted on the pedestal 2 similar to the above-mentioned embodiment. Of these six, four vacuum processing chambers P ₁₁ , P ₁₂ , P ₁₃ , P ₁₄ are wafers W. The other two vacuum processing chambers P ₁₅ and P ₁₆ are equipped with a processing function selected from sputtering, CVD, etching, ashing, oxidation and diffusion. It is a preliminary vacuum treatment chamber for performing pre-processing and post-processing such as heating and cooling of W.

Generally, in this type of multi-chamber processing system, it is assumed that the maximum unit is the pattern including the six vacuum processing chambers P _{11 to} P ₁₆ as the number of peripherally arranged vacuum processing chambers. The transfer device for the multi-chamber processing system having the maximum pattern is provided with a polygonal transfer chamber 51 to which the six vacuum processing chambers P _{11 to} P ₁₆ are respectively connected in a radial arrangement, and other than this. Is a pair of left and right (two) loader chambers 12, 13 similar to the above-mentioned embodiment, a transfer arm 14,
An alignment mechanism 15 is provided. Further, similarly to the case shown in FIG. 2, a fixed mount 16 for mounting and supporting the transfer chamber 11A and the loader chambers 12, 13 and an external cassette transfer device 18 are provided on the front side of the loader chambers 12, 13 via the mount 17. Has been.

Here, the transfer chamber 51 has the six vacuum processing chambers P _{11 to} P _{16 in} order to reduce the size of the entire system.
And the two loader chambers 12 and 13 are connected to each other with peripheral wall portions 51a, 51b, in order to be connected in a radially well-balanced manner in a state in which they are as close to each other as possible without interfering with each other.
It is a substantially octagonal plane container having an appropriate outer diameter and having 51c, 51d, 51e, 51f, 51g, 51h. Naturally, the transfer chamber 51 is the transfer chamber 11 in the case of the pattern processing system having the number of vacuum processing chambers (three) in the above-described embodiment, or the number of vacuum processing chambers (not shown). The size is the largest compared to the transfer chamber in the case of a pattern processing system having four or five intermediate sizes.

The peripheral wall portions 51a to 51h of the transfer chamber 51.
Connection port 52 are formed respectively, these second half side of the peripheral wall portion 51a, 51b, 51c, the outside of each of 51d vacuum processing chamber _{P 11, P 12, P 13} , the gate valve G ₁ P ₁₄ is each individually And the front left and right peripheral wall portions 51e and 51h of the front side thereof are installed so as to communicate internally with each other.
Further, the preliminary vacuum processing chambers P ₁₅ and P ₁₆ are individually installed so as to be internally communicated with each other through a gate valve G ₁ ′.

Further, the left and right peripheral wall portions 51f, 11 on the front end side thereof
g are arranged in a V shape with respect to each other at the same angle as in the above-mentioned embodiment, and a connection port 53 is formed in each. That is, also in this large-sized octagonal transfer chamber 51, a loader chamber connecting portion (interface) having exactly the same size and shape as that of the above-mentioned embodiment is formed on the front end side, and the front side of each of them is similar to the above-described embodiment. Two (left and right pair) loader chambers 12, 13 are arranged side by side in a state of connecting the rear end side ports and internally communicating via a gate valve G ₂ . That is, the two loader chambers 12 and 13 having exactly the same structure as those of the above-described embodiment have the center lines L ₁ and L ₂ of the transfer chamber 51 in the same manner as in the above-described embodiment, and the transfer arms in the transfer chamber 51. In the state of being directed to the center O of a turning shaft 14 described later, they are arranged in parallel in a left-right symmetric manner with an appropriate opening angle θ (for example, 45 degrees).

A swivel shaft mounting hole 54 is formed at the center position of the octagon of the bottom plate of the transfer chamber 51, and the swivel shaft 31 is inserted into the swivel shaft 31 through the swivel shaft 31 in the same manner as in the previous embodiment. Has been done.

With this, the six vacuum processing chambers P _{11 to} P ₁₆ and the two loader chambers 12 and 13 extend straight from the center O of the rotation axis of the transfer arm 14 around the transfer chamber 51. The wafer W is connected by being distributed around the radiation, and the wafer W can be inserted into and removed from each of them by the transfer arm 14.

The transfer chamber 51 is usually fitted with a lid 23 (having a different shape) as shown in FIG. 2 to form an airtight container, and a vacuum suction mechanism for holding the inside of the transfer chamber 51 in a vacuum state at a required reduced pressure. Alternatively, it is equipped with a gas supply mechanism (both not shown) for substituting an inert gas such as N2 gas.

Since the transfer arm 14 is a common product having the same structure as that of the above-mentioned embodiment, the minimum turning radius R in the shortened state in which the multi-joint arms 29, 30, 31 are mutually folded. Since it is set to be slightly smaller than the inner peripheral radius of the transfer chamber 11 of the minimum shape corresponding to the minimum number (3 pieces) of the vacuum processing chambers, the transfer chamber 51 of the maximum octagonal shape is formed. Since the swivel space is available inside, the peripheral wall portion 51 of the transfer chamber 51 is correspondingly increased as shown in the figure.
The thicknesses of a, 51b, 51c and 51d are increased to strengthen the large transfer chamber 51 against the vacuum strength.

Further, in the transfer arm 14, the minimum turning radius R of the articulated arms 29, 30, 31 in the shortened state is set small as described above.
Maximum arm extension distance of 30, 31 (maximum arm reach)
Q is the vacuum processing chamber P ₁₁ from the inside of the transfer chamber 51 of the largest type.
˜P ₁₆ and the dimensions required for loading / unloading the wafer W into / from the two loader chambers 12 and 13 (the distance from the center O of the turning axis to the wafer mounting table 2 in the vacuum processing chamber P ₁₁ ) It has a structure.

For this reason, by using a common product having the same structure for the transfer arm 14, the transfer of the minimum shape in the case of the pattern processing system having the number of peripherally arranged vacuum processing chambers (3) in the above-described embodiment. The maximum arm extension distance Q becomes large in the chamber 11 or in the transfer chamber in the case of a pattern processing system having an intermediate size of 4 or 5 vacuum processing chambers (not shown). Although it seems useless, it is very advantageous in consideration of the time and effort of designing and manufacturing transfer arms having different arm reach each time according to various sizes of the transfer chamber.
Moreover, the transfer arm 1 with its large arm reach
4 is used, a large distance is provided from the center O of the swivel axis to the loader chamber connecting portion (interface) even in the small transfer chamber 11 of the above embodiment, and a sufficient installation space for the alignment mechanism 15 is secured. become able to.

The alignment mechanism 15 is also the same as that of the above-mentioned embodiment, and the rotary table 33 is used in the transfer chamber 5.
The center lines L ₁ and L of the two loader chambers 12 and 13 which are arranged slightly outside the minimum turning radius R of the transfer arm 14 in 1 and are arranged in parallel with each other with an appropriate opening angle θ as described above. It is installed at an intermediate position between the _two via a rotary shaft 34.

Although not described in detail, the transfer device in the multi-chamber processing system of the embodiment shown in FIG. 4 basically obtains the same operation as that of the embodiment shown in FIGS. since the number of the vacuum processing chamber P ₁₁ to P ₁₆ to arrange many, so it can perform over processing for the wafer W to Taki.

By the way, as in each of the above-described embodiments, the transfer apparatus for a multi-chamber processing system of the present invention corresponds to the increase or decrease in the number of the vacuum processing chambers distributed along with the change of the semiconductor manufacturing process, etc. Although the shape and size of the loader chamber are changed, the most characteristic feature is that the other loader chambers 12 and 13, the transfer arm 14, the alignment mechanism 15 and the like are configured as a common product.

For this reason, as described above, in both the large and small transfer chambers 11 and 51, the peripheral wall end has a fixed connection portion (interface; peripheral wall portion 11f, to the loader chamber).
11g and 51f, 51g), and the loader chambers 12, 13 of the same structure can be connected and arranged in exactly the same manner in any of them. Moreover, the transfer arm 14 has a minimum turning radius D that allows it to swivel in the transfer chamber 11 of the minimum shape according to the minimum number (3) of the vacuum processing chambers and the maximum number (6) of the vacuum processing chambers.
The maximum arm extension distance Q is such that the object to be processed can be carried in and out of each of the vacuum processing chambers from the transfer chamber 51 of the maximum shape corresponding to the number of individual objects.

A design method for realizing such a structure will be described below. First, as a precondition, as shown in FIG. 5, the size of the wafer W as the object to be processed (for example, 8 inches).
And the size (width dimension) of the loader chambers 12, 13 in consideration of the size of the 8-inch wafer storing cassette C
= 300 mm, and the size (width dimension) of various vacuum processing chambers P ₁ ... That process the wafer W b = 400 mm, c = 300
mm, the required installation space for the alignment mechanism 15 and the like are selected in advance, and the minimum (3) and maximum (6) of vacuum processing chambers are arranged according to the process, and the number of loader chambers (2). And are selected.

In the first step, the maximum number of vacuum processing chambers (six) and loader chambers (two) do not interfere with each other as closely as possible (for example, there is a margin of about 10 mm on both sides). The octagon Y that can be radially distributed on the same circle is drawn in the figure and the distance from the arm rotation axis center O to each loading / unloading port (interface surface) (octagonal inscribed circle) Radius) Q ₁ is calculated.

That is, according to the following calculation formula, first, 2α + 2β = 180 °, and then the dimensions of each frontage between each vacuum processing chamber and the loader chamber (a condition in which 10 mm is added to each side) a ′ = 320 mm, b ′ = Four
With 20 mm and c ′ = 320 mm, the calculation formula of 420 ² = r ² + r ² -2r ² cos α 320 ² = r ² + r ² -2r ² cos β is established, whereby α = 51 °, β = 39 °, r = 484 is obtained. From this, the distance (radius of the octagonal inscribed circle) Q ₁ from the arm rotation axis center O to each loading / unloading port (interface surface) is Q ₁ = r cos (α / 2) = 436 mm.

Based on this Q ₁ , the maximum octagonal transfer chamber 51 is designed in consideration of the mounting space of the gate valve, and the maximum wafer transfer distance in the vacuum processing chamber is the largest for this Q _1. By adding Q ₂ = 305 mm, the maximum arm extension distance of the transfer arm 14 (maximum arm reach; maximum transfer distance) Q = Q ₁ + Q ₂ = 741 mm is calculated.

As the second step, the maximum arm extension distance Q
= 741 mm, the transfer arm 14 having an articulated arm structure is designed, and the minimum turning radius R is obtained. This minimum turning radius R can be reduced to about 255 mm.

As the third stage, the transfer chamber 5 of the largest type is
As much as possible, the interface parts for the left and right two loader chambers 12 and 13 are left unchanged, and the minimum number of vacuum processing chambers (3) in the other peripheral parts do not interfere with the swing range of the transfer arm. A quadrangle Z that can be arranged on the same circumference at a narrow interval is drawn in the figure, and the transfer chamber 11 of the minimum shape is designed and manufactured in consideration of the mounting space of the gate valve.

As a fourth step, the two alignment mechanisms 15 are arranged side by side slightly outside the minimum turning radius R of the transfer arm 14 in the transfer chamber 51 and at an opening angle θ. The loader chambers 12 and 13 are set at intermediate positions between the center lines L ₁ and L ₂ .

At this time, when the transfer arm 14 moves the wafer W into and out of the left and right loader chambers 12 and 13 in the transfer chamber,
When the transfer arm 14 collides with the rotary shaft 34 or the rotary base 33, in order to eliminate it, the opening angles θ of the center lines L ₁ and L ₂ of the left and right loader chambers 12 and 13 and the turning axis. The distance from the center O to the interface surface portions of the left and right loader chambers 12 and 13 is changed so as to be increased. When it becomes necessary to change the arrangement positions of the vacuum processing chambers due to this enlargement change, the design is performed again from the first stage.

With the transfer apparatus for the multi-chamber processing system designed and manufactured as described above, even if the number of peripherals of the vacuum processing chamber is increased or decreased due to the process change, the transfer chambers 11, 51 of the transfer system are transferred. Only by changing the shape and size, all the other loader chambers 12, 13 and the transfer arm 14 and the alignment mechanism 15 can be handled as a common product, and the manufacturing and assembling are very easy and the cost can be reduced. In addition, from the loader chambers 12 and 13 to the transfer chambers 11 and 5
While the wafer W is loaded into the chamber 1 by the transfer arm 14 and loaded into the vacuum processing chamber, the wafer W can be temporarily received by the alignment mechanism 15 for alignment such as orientation.

Further, as described above, the two loader chambers 12 and 1
By including 3, the loader chambers 12 and 13 can be used together to smoothly carry in / out the wafer W by the transfer arm 14, and a high through top can be achieved.
In addition, the two loader chambers 12 and 13 have their center lines L ₁ and L ₂ respectively in the transfer arms 14 and 51 in the transfer chambers 11 and 51.
Since the alignment mechanism 15 is arranged in parallel with each other with an appropriate opening angle θ toward the center O of the turning axis, and the empty space between the advancing / retreating routes of the transfer arm 14 with respect to both loader chambers 121 and 13 is arranged. The alignment mechanism 15 does not interfere with the operation of the transfer arm 14, and the transfer chambers 11 and 51 can be made as small as possible in each pattern according to the number of peripherals of the vacuum processing chamber, and the overall size of each system can be reduced. You will be able to plan.

On the other hand, in the above-described multi-chamber processing system transfer apparatus, the control unit 47 as a control means has a control unit such as a CPU having a memory storing programs of various operation modes, and selection and conditions of the program. By providing the operation panel for setting, etc., as described above, the transfer route of the object to be processed for each transfer chamber 11, 51 whose size has been changed according to the increase and decrease in the number of peripherals of the vacuum processing chamber due to the process change. By storing the distance in the memory in advance, the transfer arm 14 can be swung and expanded / contracted in accordance with the transfer route / distance of the object to be processed in the transfer chamber actually installed. Therefore, even if the shape and size of the transfer chamber are variously changed in accordance with the increase or decrease in the number of circumferentially arranged vacuum processing chambers due to the process change, the processing object transfer route and distance of the transfer arm 14 are taught each time. There is no need, and it becomes possible to immediately and accurately control the transfer arm.

7 and 8 show another embodiment. The same components as those of the embodiment shown in FIGS. 1 and 2 are designated by the same reference numerals and the description thereof will be omitted. Left and right wall portions 11a and 11b of the transfer chamber 11
A beam 11h connecting the left and right wall portions 11a and 11b is provided at the boundary between the left and right widening wall portions 11d and 11e, and the beam 23 h supports the lid 23 that seals the transfer chamber 11.

The lid 23 is a divided body 23a which is divided into two parts, front and rear.
And 23b. One end of the one divided body 23a is pivotally supported by the beam 11h by a hinge 23d, and the divided body 23a is configured to be openable and closable upward with the hinge 23d as a fulcrum. The other divided body 23
b is the left and right expanding wall portions 11d and 11e and the beam 1 by screws or the like.
It is attached so that it can be opened and closed at 1h.

By thus dividing the lid 23 into two, only the one divided body 23a is opened and closed, which facilitates the opening and closing work, and can be opened and closed even when the space above the lid 23 is narrow. Further, even if the shape of the transfer chamber 11 is changed, the divided body 23b can be used as a common product, and there is an effect that a design change can be easily dealt with.

Although a pair of left and right (two) loader chambers 12 and 13 are provided in the above embodiment, one may be provided, or three may be provided if necessary. Further, in the above embodiment, a multi-joint arm that holds one object to be processed is illustrated as the transfer arm 14, but other than this, for example, a Frog leg arm or two objects W to be processed as shown in FIG. 6 are held. The possible multi-joint arm 14A or the like may be used as the transfer arm.

The alignment mechanism 15 need not be installed in the case of a vacuum processing system which does not require the alignment of the wafer W. Further, although the semiconductor wafer W is exemplified as the object to be processed in the above-mentioned embodiment, other than this, for example, L
A CD substrate or the like may be the object to be processed. In addition, various modifications can be made without departing from the scope of the present invention.

[0077]

Since the transfer apparatus for a multi-chamber processing system of the present invention is configured as described above, even if the number of the vacuum processing chambers arranged is increased or decreased due to a process change, the transfer chamber of the transfer system is changed. Only by changing the shape and size, the other parts such as the loader chamber and the transfer arm can be handled as a common product, which is very easy to manufacture and assemble and the cost can be reduced.

The multi-chamber processing system transfer apparatus of the present invention can change the shape and size of the transfer chamber in accordance with the increase or decrease in the number of the vacuum processing chambers distributed according to the process change. It is not necessary to teach the transfer route and distance of the transfer arm of the transfer arm, and an appropriate control operation of the transfer arm can be performed immediately.

[Brief description of drawings]

FIG. 1 is a horizontal cross-sectional view of a transfer device in a multi-chamber processing system in which three vacuum processing chambers are circumferentially arranged according to an embodiment of the present invention.

FIG. 2 is a vertical sectional view taken along line XX of FIG.

FIG. 3A is a plan view of the transfer arm used in the transfer device in the extended state, and FIG. 3B is a plan view of the transfer arm in a shortened state.

FIG. 4 is a horizontal sectional view of a transfer device in a multi-chamber processing system in which six vacuum processing chambers are circumferentially arranged according to an embodiment of the present invention.

FIG. 5 shows a design method for obtaining a transfer device in a multi-chamber processing system having three vacuum processing chambers arranged therein and a transfer device in a multi-chamber processing system having six vacuum processing chambers arranged therein. Explanatory drawing.

FIG. 6A is a plan view of an articulated arm capable of holding two objects to be processed in an extended state, and FIG. 6B is a plan view of the articulated arm in a shortened state.

FIG. 7 is a horizontal sectional view of a transfer device in a multi-chamber processing system showing another embodiment of the present invention.

8 is a vertical cross-sectional view taken along the line YY of FIG.

[Explanation of symbols]

_{P 1, P 2, P 3} , P 11 ~P 16 ... vacuum processing chamber, G _1, G
_{1 ', G 2, G 3} ... gate valves, 11, 51 ... transfer chamber, 11a to 11g, 51a.about.51h ... peripheral wall, 11f,
11g, 51f, 51g ... loader chamber connection part, 12, 13
… Loader room 21, 22, 52, 53… Connection port, 14…
Transfer arm, R ... minimum turning radius, Q ... maximum arm extension distance, L _1, L ₂ ... center line, theta ... opening angle, 45 ... control unit, 23 ... lid, W ... workpiece (semiconductor wafer).

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Office reference number FI technical display location H01L 21/02 Z // B05C 13/00

Claims (5)

[Claims] 1. A transfer chamber of a substantially polygonal shape having a plurality of connection ports on a peripheral wall, which are connected to each other through a gate valve in a state in which a plurality of vacuum processing chambers corresponding to a process are arranged, and the transfer chamber. One or more loader chambers communicating with the end of the peripheral wall of the chamber through a gate valve, and a treatment target is taken from the loader chamber into the transfer chamber and loaded into the vacuum processing chamber, and the processed treatment target in the vacuum processing chamber is transferred. In a transfer device for a multi-chamber processing system, which comprises a transfer arm capable of revolving and retracting a processing object and returning it to the loader chamber, the transfer chamber is configured to increase or decrease the number of vacuum processing chambers distributed along with a process change. Although the shape and size are changed correspondingly, all other loader chambers and transfer arms can be handled by a common product. And the transfer arm has a minimum turning radius capable of turning in the transfer chamber of the smallest shape corresponding to the minimum number of peripherals of the vacuum processing chamber and a maximum shape corresponding to the maximum number of peripherals of the vacuum processing chamber. 2. A transfer device for a multi-chamber processing system having a maximum arm extension distance capable of loading and unloading an object to be processed into and from each of the vacuum processing chambers. 2. The transfer apparatus for a multi-chamber processing system according to claim 1, wherein an alignment mechanism for temporarily receiving and aligning an object to be processed from the transfer arm interferes with a swiveling / expanding operation of the transfer arm in the transfer chamber. A transfer device for a multi-chamber processing system, which is installed at a fixed position. 3. The transfer device for a multi-chamber processing system according to claim 2, wherein the two loader chambers are arranged in parallel with each other with an appropriate opening angle such that the center lines of the two loader chambers are oriented toward the center of the rotation axis of the transfer arm. However, the multi-chamber processing is characterized in that the alignment mechanism is installed at a position slightly outside the minimum turning radius of the transfer arm in the transfer chamber communicating with the loader chambers and at a position between the center lines of the loader chambers. Conveyor for system. 4. The transfer device for a multi-chamber processing system according to claim 1, wherein each transfer chamber is changed in size in response to an increase / decrease in the number of vacuum processing chambers distributed along with a process change. It should be provided with a control means for pre-storing the processing object transfer route and distance, and for rotating and expanding and contracting the transfer arm according to the processing object transfer route and distance of the actually installed transfer chamber. A transfer device for a multi-chamber processing system, characterized by: 5. The transfer apparatus for a multi-chamber processing system according to claim 1, wherein the transfer chamber has a lid on its upper surface for sealing the transfer chamber, and the lid is divided into at least two parts. A transfer device for a multi-chamber processing system, characterized in that one side can be opened and closed.