JPS6176965U - - Google Patents
Info
- Publication number
- JPS6176965U JPS6176965U JP16156484U JP16156484U JPS6176965U JP S6176965 U JPS6176965 U JP S6176965U JP 16156484 U JP16156484 U JP 16156484U JP 16156484 U JP16156484 U JP 16156484U JP S6176965 U JPS6176965 U JP S6176965U
- Authority
- JP
- Japan
- Prior art keywords
- cooling plate
- cooling
- cooling device
- refrigerant
- circulated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000003507 refrigerant Substances 0.000 claims 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図のａ，ｂ図は本考案の一実施例の側面断
面図、ｃ図は要部斜視図、第２図のａ，ｂ図は冷
却装置の概要を示す側面図、第３図のａ，ｂ図は
従来の側面断面図を示す。
図において、１，５は冷却プレート、２は冷却
素子、３はプリント板、４は半導体素子、１０は
フランジ、１１はベローズ、１５は可撓性チユー
ブ、１３はＯリング、１２，１４，１６，１７は
冷却板を示す。
Figures a and b in Figure 1 are a side sectional view of an embodiment of the present invention, Figure c is a perspective view of the main parts, Figures a and b in Figure 2 are side views showing an outline of the cooling device, and Figure 3 is a side view of an embodiment of the present invention. Figures a and b show conventional side sectional views. In the figure, 1 and 5 are cooling plates, 2 is a cooling element, 3 is a printed board, 4 is a semiconductor element, 10 is a flange, 11 is a bellows, 15 is a flexible tube, 13 is an O-ring, 12, 14, 16 , 17 indicates a cooling plate.
Claims (1)
ートの所定箇所に設けられ、プリント板に実装さ
れた半導体素子に密着される冷却板とを備えた冷
却装置であつて、該冷媒が流通される該冷却板の
所定面には凹凸が形成されて成ることを特徴とす
る冷却装置。 A cooling device comprising a cooling plate through which a refrigerant is circulated, and a cooling plate provided at a predetermined location on the cooling plate and in close contact with a semiconductor element mounted on a printed circuit board, the cooling device having a cooling plate through which the refrigerant is circulated. A cooling device characterized in that a predetermined surface of a cooling plate is formed with unevenness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16156484U JPH0311894Y2 (en) | 1984-10-25 | 1984-10-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16156484U JPH0311894Y2 (en) | 1984-10-25 | 1984-10-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6176965U true JPS6176965U (en) | 1986-05-23 |
| JPH0311894Y2 JPH0311894Y2 (en) | 1991-03-20 |
Family
ID=30719468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16156484U Expired JPH0311894Y2 (en) | 1984-10-25 | 1984-10-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0311894Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6344748A (en) * | 1986-08-11 | 1988-02-25 | Fujitsu Ltd | Cooling structure of semiconductor device |
-
1984
- 1984-10-25 JP JP16156484U patent/JPH0311894Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6344748A (en) * | 1986-08-11 | 1988-02-25 | Fujitsu Ltd | Cooling structure of semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0311894Y2 (en) | 1991-03-20 |