JPS61151395U

JPS61151395U -

Info

Publication number: JPS61151395U
Application number: JP3318985U
Authority: JP
Priority date: 1985-03-08
Filing date: 1985-03-08
Publication date: 1986-09-18

Description

[Brief explanation of drawings]

第１図および第２図は本考案の一実施例を示し
、第１図は斜視図、第２図は要部断面図、第３図
は従来のａは斜視図、ｂ１，ｂ２は要部断面図を
示す。図において、１はプリント基板、２は電子部品
、３は冷却プレート、１０は給水チヤンバー、１
１は排水チヤンバー、１２はノズル、１３はスプ
リング、１４はベローズ、１５は伝熱板、１６は
シートを示す。 1 and 2 show an embodiment of the present invention, FIG. 1 is a perspective view, FIG. 2 is a sectional view of the main part, and FIG. 3 is a conventional one. A cross-sectional view is shown. In the figure, 1 is a printed circuit board, 2 is an electronic component, 3 is a cooling plate, 10 is a water supply chamber, 1
1 is a drainage chamber, 12 is a nozzle, 13 is a spring, 14 is a bellows, 15 is a heat transfer plate, and 16 is a sheet.

Claims

[Scope of utility model registration request]

A flexible device that includes an electronic component mounted on a printed circuit board, a cooling plate through which a coolant is circulated, and a heat transfer plate that is protruded from a predetermined location of the cooling plate and is pressed against the surface of the electronic component. A cooling structure for electronic components comprising a flexible structural member and a flexible sheet inserted between the surface and a heat exchanger plate,
The cooling plate is formed by a water supply chamber and a drainage chamber, and the water supply chamber is provided with a nozzle for ejecting the refrigerant onto the structural member, and a spring is provided on the outer periphery of the nozzle for applying the elastic force of the structural member. A cooling structure for electronic components, characterized in that the cooling structure comprises a locking structure.