JPH0171489U - - Google Patents
Info
- Publication number
- JPH0171489U JPH0171489U JP1987166239U JP16623987U JPH0171489U JP H0171489 U JPH0171489 U JP H0171489U JP 1987166239 U JP1987166239 U JP 1987166239U JP 16623987 U JP16623987 U JP 16623987U JP H0171489 U JPH0171489 U JP H0171489U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- unit
- fin
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第1図は本考案の一実施例を示す横断面図、第
2図は従来の冷却構造の横断面図である。
1,7……ヒートシンクパネル、2,8……フ
イン、3,9……シヤーシ、4,10……発熱体
、5,11……プリント基板、6,12……取付
壁面。
FIG. 1 is a cross-sectional view showing an embodiment of the present invention, and FIG. 2 is a cross-sectional view of a conventional cooling structure. 1, 7... Heat sink panel, 2, 8... Fin, 3, 9... Chassis, 4, 10... Heat generating element, 5, 11... Printed circuit board, 6, 12... Mounting wall surface.
Claims (1)
形状を有し左右の端面はフランジ形状から成るヒ
ートシンクと、中央部に角穴を有し前記のヒート
シンクのフイン部分を落とし込み固定することに
よつてユニツトのフレームの構造体と成す板金シ
ヤーシと、及びヒートシンク上部に水平に固定さ
れたプリント基板とを有することを特徴とするユ
ニツトの冷却構造。 The heat sink has a fin shape on the opposite side to the flat end surface on which the heating element is attached, and flanged shapes on the left and right end surfaces, and a square hole in the center.The unit can be assembled by inserting and fixing the fin portion of the heat sink. 1. A unit cooling structure comprising: a sheet metal chassis forming a frame structure; and a printed circuit board horizontally fixed above a heat sink.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987166239U JPH0171489U (en) | 1987-10-29 | 1987-10-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987166239U JPH0171489U (en) | 1987-10-29 | 1987-10-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0171489U true JPH0171489U (en) | 1989-05-12 |
Family
ID=31453450
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987166239U Pending JPH0171489U (en) | 1987-10-29 | 1987-10-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0171489U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999052339A1 (en) * | 1998-04-01 | 1999-10-14 | Kabushiki Kaisha Yaskawa Denki | Cooling device of multispindle servo-amplifier |
-
1987
- 1987-10-29 JP JP1987166239U patent/JPH0171489U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999052339A1 (en) * | 1998-04-01 | 1999-10-14 | Kabushiki Kaisha Yaskawa Denki | Cooling device of multispindle servo-amplifier |