JPH0425290U - - Google Patents
Info
- Publication number
- JPH0425290U JPH0425290U JP6692990U JP6692990U JPH0425290U JP H0425290 U JPH0425290 U JP H0425290U JP 6692990 U JP6692990 U JP 6692990U JP 6692990 U JP6692990 U JP 6692990U JP H0425290 U JPH0425290 U JP H0425290U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- electronic device
- heat
- decrease
- changed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 3
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図ａ，ｂは本考案の一実施例を示す断面図
、第２図は従来の一例を示す断面図である。
１……外かく、２……発熱部品、３……ケース
、４……ばね、５……放熱板、６……電子機器。
FIGS. 1a and 1b are cross-sectional views showing an embodiment of the present invention, and FIG. 2 is a cross-sectional view showing a conventional example. 1...Exterior, 2...Heating parts, 3...Case, 4...Spring, 5...Heat sink, 6...Electronic equipment.
Claims (1)
れている放熱板を設けることによつて、発熱部品
の発熱量の増減に対応して、電子機器と外かくと
の放熱接触面を変化させることを特徴とする電子
機器の放熱構造。 By providing a heat dissipation plate connected to a shape memory alloy spring on the outer surface of the electronic device, the heat dissipation contact surface between the electronic device and the outer shell can be changed in response to an increase or decrease in the amount of heat generated by the heat generating component. A heat dissipation structure for electronic equipment featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6692990U JPH0425290U (en) | 1990-06-25 | 1990-06-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6692990U JPH0425290U (en) | 1990-06-25 | 1990-06-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0425290U true JPH0425290U (en) | 1992-02-28 |
Family
ID=31600058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6692990U Pending JPH0425290U (en) | 1990-06-25 | 1990-06-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0425290U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015032776A (en) * | 2013-08-06 | 2015-02-16 | 富士通株式会社 | Two-phase flow cooling device and evaporator for two-phase flow cooling device |
| JP2018132193A (en) * | 2014-09-30 | 2018-08-23 | パナソニックＩｐマネジメント株式会社 | Panel unit |
-
1990
- 1990-06-25 JP JP6692990U patent/JPH0425290U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015032776A (en) * | 2013-08-06 | 2015-02-16 | 富士通株式会社 | Two-phase flow cooling device and evaporator for two-phase flow cooling device |
| JP2018132193A (en) * | 2014-09-30 | 2018-08-23 | パナソニックＩｐマネジメント株式会社 | Panel unit |
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