JPH0163195U - - Google Patents
Info
- Publication number
- JPH0163195U JPH0163195U JP1987157821U JP15782187U JPH0163195U JP H0163195 U JPH0163195 U JP H0163195U JP 1987157821 U JP1987157821 U JP 1987157821U JP 15782187 U JP15782187 U JP 15782187U JP H0163195 U JPH0163195 U JP H0163195U
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- plate
- semiconductor
- contact
- cooling element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 5
- 150000002736 metal compounds Chemical class 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000003507 refrigerant Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の原理説明図、第２図は本考案
による一実施例の説明図で、ａは側面断面図、ｂ
１，ｂ２，ｂ３，ｂ４は組立工程図、第３図は従
来の側面断面図を示す。
図において、１はプリント基板、２は半導体素
子、３は冷却プレート、４は冷却素子、５は伝熱
板、６はメタルコンパウンド、２Ａは表面を示す
。
Fig. 1 is an explanatory diagram of the principle of the present invention, Fig. 2 is an explanatory diagram of an embodiment according to the present invention, a is a side sectional view, and b
1, b2, b3, and b4 are assembly process diagrams, and FIG. 3 is a conventional side sectional view. In the figure, 1 is a printed circuit board, 2 is a semiconductor element, 3 is a cooling plate, 4 is a cooling element, 5 is a heat transfer plate, 6 is a metal compound, and 2A is a surface.
Claims (1)
レート３の所定箇所に係止される可撓性の部材よ
り成る冷却素子４と、プリント基板１に実装され
た半導体素子２とを備え、該冷却素子４の伝熱板
５と該半導体素子２の表面２Ａとを当接させるこ
とで該半導体素子２の冷却を行う冷却構造におい
て、 前記冷却素子２の外周に塗布され、該冷却素子
４の前記伝熱板５と前記半導体素子２の前記表面
２Ａとの当接が合致されることで硬化を行うメタ
ルコンパウンド６が設けられて成ることを特徴と
する冷却構造。[Claims for Utility Model Registration] A cooling plate 3 through which a refrigerant is circulated, a cooling element 4 made of a flexible member that is fixed to a predetermined position of the cooling plate 3, and a semiconductor mounted on a printed circuit board 1. A cooling structure comprising a cooling element 2 and cooling the semiconductor element 2 by bringing a heat exchanger plate 5 of the cooling element 4 into contact with a surface 2A of the semiconductor element 2, comprising: coating on the outer periphery of the cooling element 2; A cooling structure characterized in that a metal compound 6 is provided which hardens when the heat transfer plate 5 of the cooling element 4 and the surface 2A of the semiconductor element 2 come into contact with each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987157821U JPH0163195U (en) | 1987-10-15 | 1987-10-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987157821U JPH0163195U (en) | 1987-10-15 | 1987-10-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0163195U true JPH0163195U (en) | 1989-04-24 |
Family
ID=31437599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987157821U Pending JPH0163195U (en) | 1987-10-15 | 1987-10-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0163195U (en) |
-
1987
- 1987-10-15 JP JP1987157821U patent/JPH0163195U/ja active Pending
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