JPH03101568U - - Google Patents
Info
- Publication number
- JPH03101568U JPH03101568U JP946090U JP946090U JPH03101568U JP H03101568 U JPH03101568 U JP H03101568U JP 946090 U JP946090 U JP 946090U JP 946090 U JP946090 U JP 946090U JP H03101568 U JPH03101568 U JP H03101568U
- Authority
- JP
- Japan
- Prior art keywords
- metal
- wiring board
- printed wiring
- based printed
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 9
- 239000010953 base metal Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Description
第１図ａ乃至ｆは本考案の一実施例を示す金属
ベースプリント配線基板の製造工程の断面図、第
２図は本考案の他の実施例を示す金属ベースプリ
ント配線基板の断面図、第３図ａ乃至ｄは従来例
を示す金属ベースプリント配線基板の製造工程の
断面図、第４図ａ乃至ｄは従来の金属ベースプリ
ント配線基板の応用例、第５図はその動作時にお
ける消費電力と上昇温度との関係を示すグラフ、
第６図は従来の金属ベースプリント配線基板の熱
放散の経路を説明するための断面図である。
１……金属箔、３……ベース金属、５……基材
（ガラスエポキシ）。
1A to 1F are cross-sectional views of the manufacturing process of a metal-based printed wiring board showing one embodiment of the present invention; FIG. 2 is a cross-sectional view of a metal-based printed wiring board showing another embodiment of the present invention; Figures 3a to 3d are cross-sectional views of the manufacturing process of a conventional metal-based printed wiring board, Figures 4a to d are application examples of the conventional metal-based printed wiring board, and Figure 5 shows power consumption during operation. A graph showing the relationship between and rising temperature,
FIG. 6 is a cross-sectional view for explaining the heat dissipation path of a conventional metal-based printed wiring board. 1... Metal foil, 3... Base metal, 5... Base material (glass epoxy).
Claims (1)
に放熱用のベース金属を設けた金属ベースプリン
ト配線基板において、 上記ベース金属の表面がヒダ状に形成されてな
ることを特徴とする金属ベースプリント配線基板
。[Scope of Claim for Utility Model Registration] A metal-based printed wiring board in which a metal foil is bonded to the surface of a base material and a base metal for heat dissipation is provided on the back surface of the base material, wherein the surface of the base metal is formed in the shape of pleats. A metal-based printed wiring board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP946090U JPH03101568U (en) | 1990-01-31 | 1990-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP946090U JPH03101568U (en) | 1990-01-31 | 1990-01-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03101568U true JPH03101568U (en) | 1991-10-23 |
Family
ID=31513061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP946090U Pending JPH03101568U (en) | 1990-01-31 | 1990-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03101568U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008179981A (en) * | 2007-01-24 | 2008-08-07 | Guard Lock:Kk | Lock for key storage |
-
1990
- 1990-01-31 JP JP946090U patent/JPH03101568U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008179981A (en) * | 2007-01-24 | 2008-08-07 | Guard Lock:Kk | Lock for key storage |
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