JPH0346U - - Google Patents
Info
- Publication number
- JPH0346U JPH0346U JP5706189U JP5706189U JPH0346U JP H0346 U JPH0346 U JP H0346U JP 5706189 U JP5706189 U JP 5706189U JP 5706189 U JP5706189 U JP 5706189U JP H0346 U JPH0346 U JP H0346U
- Authority
- JP
- Japan
- Prior art keywords
- flow path
- nozzle
- electronic board
- refrigerant
- jet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 4
- 239000002826 coolant Substances 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 claims description 2
- 239000003507 refrigerant Substances 0.000 claims 2
- 230000002265 prevention Effects 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案による半導体素子の冷却構造の
一実施例を示す要部断面図、第２図は第１図中
−線断面図、第３図は第２図中−線断面図
、第４図は従来の半導体素子の冷却構造を示す断
面図、第５図は第４図中−線断面図である。
図において、１０は電子基板、１１は半導体素
子、１２はクーリングプレート、１３は冷媒流路
、１４は冷媒帰還流路、１５はノズル、１６はベ
ローズ、１７はズレ防止用突起部である。
FIG. 1 is a cross-sectional view of essential parts showing an embodiment of a cooling structure for a semiconductor device according to the present invention, FIG. 2 is a cross-sectional view taken along the line - - in FIG. 1, and FIG. FIG. 4 is a cross-sectional view showing a conventional cooling structure for a semiconductor element, and FIG. 5 is a cross-sectional view taken along the line -- in FIG. In the figure, 10 is an electronic board, 11 is a semiconductor element, 12 is a cooling plate, 13 is a coolant flow path, 14 is a coolant return flow path, 15 is a nozzle, 16 is a bellows, and 17 is a projection for preventing displacement.
Claims (1)
対して、冷媒流路１３に固定されたノズル１５か
ら冷媒のジエツト噴流を衝突させる電子基板１０
の冷却構造において、 冷媒流路１３の壁面１３ａに当接するズレ防止
用突起部１７がノズル１５の外周面に設けられて
いることを特徴とする半導体素子の冷却構造。[Claims for Utility Model Registration] An electronic board 10 in which a jet jet of refrigerant is impinged on a semiconductor element 11 mounted on the electronic board 10 from a nozzle 15 fixed to a refrigerant flow path 13.
A cooling structure for a semiconductor device, characterized in that a displacement prevention protrusion 17 that abuts against a wall surface 13a of a coolant flow path 13 is provided on an outer circumferential surface of a nozzle 15.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5706189U JPH0346U (en) | 1989-05-19 | 1989-05-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5706189U JPH0346U (en) | 1989-05-19 | 1989-05-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0346U true JPH0346U (en) | 1991-01-07 |
Family
ID=31581434
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5706189U Pending JPH0346U (en) | 1989-05-19 | 1989-05-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0346U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006240812A (en) * | 2005-03-02 | 2006-09-14 | Fuji Photo Film Co Ltd | Ink jet device for double-sided recording |
| US7661810B2 (en) | 2005-03-02 | 2010-02-16 | Fujifilm Corporation | Image recording apparatus and inkjet apparatus for double-side recording |
-
1989
- 1989-05-19 JP JP5706189U patent/JPH0346U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006240812A (en) * | 2005-03-02 | 2006-09-14 | Fuji Photo Film Co Ltd | Ink jet device for double-sided recording |
| US7661810B2 (en) | 2005-03-02 | 2010-02-16 | Fujifilm Corporation | Image recording apparatus and inkjet apparatus for double-side recording |
| JP4529179B2 (en) * | 2005-03-02 | 2010-08-25 | 富士フイルム株式会社 | Inkjet device for double-sided recording |