JPH03106797U

JPH03106797U -

Info

Publication number: JPH03106797U
Application number: JP1477490U
Authority: JP
Priority date: 1990-02-19
Filing date: 1990-02-19
Publication date: 1991-11-05

Description

[Brief explanation of drawings]

第１図乃至第３図は本考案の一実施例を説明す
る図であり、第１図は通信機器の要部断面図、第
２図は放熱フインとダクトとの関係を説明する斜
視図、第３図は第１図の−線断面図である。
第４図乃至第６図は従来例を説明する図であり、
第４図は通信機器の要部断面図、第５図は通信機
器のパネル面を示す斜視図、第６図は第４図の
−線断面図である。２Ａ……電子機器、３……他の電子機器、１１
，１１ｂ……電子回路パツケージ、２３……発熱
部品、２５……放熱ブロツク、２６……ヒートパ
イプ、２７……放熱フイン、４０……ダクト、４
５……エア取入口、４６……エア排出口。 1 to 3 are diagrams illustrating an embodiment of the present invention, in which FIG. 1 is a sectional view of a main part of a communication device, and FIG. 2 is a perspective view illustrating the relationship between a heat dissipation fin and a duct. FIG. 3 is a sectional view taken along the line -- in FIG. 1.
FIGS. 4 to 6 are diagrams explaining conventional examples,
FIG. 4 is a sectional view of essential parts of the communication device, FIG. 5 is a perspective view showing the panel surface of the communication device, and FIG. 6 is a sectional view taken along the line -- in FIG. 4. 2A...Electronic equipment, 3...Other electronic equipment, 11
, 11b... Electronic circuit package, 23... Heat generating component, 25... Heat radiation block, 26... Heat pipe, 27... Heat radiation fin, 40... Duct, 4
5...Air intake port, 46...Air discharge port.

Claims

[Scope of utility model registration request]

In a heat dissipation structure for an electronic device in which an electronic circuit package having a heat generating component is mounted and another electronic device is disposed above, one end side is held by a heat dissipation block provided on the heat generating component and the other end side is held by a heat dissipation block provided on the heat generating component, and the other end side is held by a heat dissipation block provided on the heat generating component. A heat pipe protrudes upward, a heat radiation fin provided at the other end of the heat pipe, and a space between the electronic circuit package and another electronic device with the heat radiation fin housed inside. An electronic device characterized in that the duct is provided with an air intake port for taking in external air at one end thereof, and an air discharge port for discharging air warmed by the heat radiation fins at the other end thereof. heat dissipation structure.