JPH0258397U - - Google Patents
Info
- Publication number
- JPH0258397U JPH0258397U JP13741888U JP13741888U JPH0258397U JP H0258397 U JPH0258397 U JP H0258397U JP 13741888 U JP13741888 U JP 13741888U JP 13741888 U JP13741888 U JP 13741888U JP H0258397 U JPH0258397 U JP H0258397U
- Authority
- JP
- Japan
- Prior art keywords
- plate
- blank cover
- communication device
- front plate
- cover structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Description
第１図は本考案の実施例の斜視図、第２図は本
ブランクカバーの使用状態を示す通信機筺体の断
面図、第３図は第２図のＡＡ断面図、第４図は従
来のブランクカバーを示す斜視図、第５図は従来
のブランクカバーの使用状態を示す通信機筺体の
正面図である。
１……本考案によるブランクカバー、１′……
平面のしやへい板、１″……電子機器パツケージ
面に平行なブランクカバーの板、１……前面板
、２……通信機筺体、３……電子機器パツケージ
、４……フアン、５……熱しやへい板、６……バ
ツクボード、７……風の流れ、８……従来のブラ
ンクカバー。
Fig. 1 is a perspective view of an embodiment of the present invention, Fig. 2 is a cross-sectional view of a communication device housing showing the state in which the present blank cover is used, Fig. 3 is a cross-sectional view taken along line AA in Fig. 2, and Fig. 4 is a conventional FIG. 5 is a perspective view showing a blank cover, and FIG. 5 is a front view of a communication device housing showing a state in which a conventional blank cover is used. 1...Blank cover according to the present invention, 1'...
Flat thin plate, 1″...Blank cover plate parallel to the electronic device package surface, 1...Front plate, 2...Communication device housing, 3...Electronic device package, 4...Fan, 5... ... Heat-resistant board, 6... Backboard, 7... Wind flow, 8... Conventional blank cover.
Claims (1)
クカバー構造において、前面板と、装置に垂直に
実装される電子機器パツケージの基板面に平行な
板と、前記板に垂直で且つ前面板に垂直なしやへ
い板とを有するブランクカバー構造。 In the blank cover structure of a communication device housing having a forced air cooling heat dissipation structure, there is a front plate, a plate parallel to the substrate surface of an electronic equipment package mounted perpendicularly to the device, and a plate perpendicular to said plate but not perpendicular to the front plate. A blank cover structure having a cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13741888U JPH0258397U (en) | 1988-10-20 | 1988-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13741888U JPH0258397U (en) | 1988-10-20 | 1988-10-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0258397U true JPH0258397U (en) | 1990-04-26 |
Family
ID=31398823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13741888U Pending JPH0258397U (en) | 1988-10-20 | 1988-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0258397U (en) |
-
1988
- 1988-10-20 JP JP13741888U patent/JPH0258397U/ja active Pending
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